Architecture for IoT Node and Platform

Only recently, during the past five years, consumer electronics has been evolving rapidly. Many products have started to include “smart home” capabilities, enabling communication and interoperability of various smart devices. Even more devices and sensors can be remote controlled and monitored through cloud services. While the smart home systems have become very affordable to average consumer compared to the early solutions decades ago, there are still many issues and things that need to be fixed or improved upon: energy efficiency, connectivity with other devices and applications, security and privacy concerns, reliability, and response time. This paper focuses on designing Internet of Things (IoT) node and platform architectures that take these issues into account, notes other currently used solutions, and selects technologies in order to provide better solution. The node architecture aims for energy efficiency and modularity, while the platform architecture goals are in scalability, portability, maintainability, performance, and modularity. Moreover, the platform architecture attempts to improve user experience by providing higher reliability and lower response time compared to the alternative platforms. The architectures were developed iteratively using a development process involving research, planning, design, implementation, testing, and analysis. Additionally, they were documented using Kruchten’s 4+1 view model, which is used to describe the use cases and different views of the architectures. The node architecture consisted of energy efficient hardware, FC3180 microprocessor and CC2520 RF transceiver, modular operating system, Contiki, and a communication protocol, AllJoyn, used for providing better interoperability with other IoT devices and applications. The platform architecture provided reliable low response time control, monitoring, and initial setup capabilities by utilizing web technologies on various devices such as smart phones, tablets, and computers. Furthermore, an optional cloud service was provided in order to control devices and monitor sensors remotely by utilizing scalable high performance technologies in the backend enabling low response time and high reliability.

Dynamic Workload Parallelization and System Calibration on Single-Chip Cloud Computer

Many-core systems are emerging from the need of more computational power and power efficiency. However there are many issues which still revolve around the many-core systems. These systems need specialized software before they can be fully utilized and the hardware itself may differ from the conventional computational systems. To gain efficiency from many-core system, programs need to be parallelized. In many-core systems the cores are small and less powerful than cores used in traditional computing, so running a conventional program is not an efficient option. Also in Network-on-Chip based processors the network might get congested and the cores might work at different speeds. In this thesis is, a dynamic load balancing method is proposed and tested on Intel 48-core Single-Chip Cloud Computer by parallelizing a fault simulator. The maximum speedup is difficult to obtain due to severe bottlenecks in the system. In order to exploit all the available parallelism of the Single-Chip Cloud Computer, a runtime approach capable of dynamically balancing the load during the fault simulation process is used. The proposed dynamic fault simulation approach on the Single-Chip Cloud Computer shows up to 45X speedup compared to a serial fault simulation approach. Many-core systems can draw enormous amounts of power, and if this power is not controlled properly, the system might get damaged. One way to manage power is to set power budget for the system. But if this power is drawn by just few cores of the many, these few cores get extremely hot and might get damaged. Due to increase in power density multiple thermal sensors are deployed on the chip area to provide realtime temperature feedback for thermal management techniques. Thermal sensor accuracy is extremely prone to intra-die process variation and aging phenomena. These factors lead to a situation where thermal sensor values drift from the nominal values. This necessitates efficient calibration techniques to be applied before the sensor values are used. In addition, in modern many-core systems cores have support for dynamic voltage and frequency scaling. Thermal sensors located on cores are sensitive to the core's current voltage level, meaning that dedicated calibration is needed for each voltage level. In this thesis a general-purpose software-based auto-calibration approach is also proposed for thermal sensors to calibrate thermal sensors on different range of voltages.