Modelització numèrica d’un sistema de descàrrega d’una columna de la catedral d Girona mitjançant el mètode dels elements finits (anàlisi no lineal)

Aquest projecte consisteix en aplicar el càlcul no lineal en la modelització volumètricanumèrica de l’estructura del sistema de descàrrega d’una columna del claustre de lacatedral de Girona mitjançant el mètode dels elements finits. A la Universitat de Gironas’ha fet diferents estudis del claustre de la catedral de Girona però sempre simulant uncomportament lineal de les característiques dels materials. El programa utilitzat és la versió docent del programa ANSYS disponible al Dept.d’EMCI i l’element emprat ha sigut el SOLID65. Aquest element permet introduircaracterístiques de no linealitat en els models i és adequat per a anàlisi no lineald’elements com la pedra de Girona

Anàlisi paramètrica de l'assaig a compressió d'un panell de material compost rigiditzat amb tres nervis

L’objectiu d’aquest treball és desenvolupar una metodologia per realitzar l’anàlisiparamètrica de l’assaig de compressió d’un panell de material compost rigiditzat ambtres nervis. En primer lloc és necessari desenvolupar un sistema automatitzat per generar i avaluar el conjunt de parametritzacions. A continuació, s’estudiaran quines variables d’estat són les més adequades per representar el vinclament local, la flexió global, la càrrega crítica de desestabilització i l’índex de fallada en l’anàlisi paramètrica. La modelització amb el mètode dels elements finits serveix per simular l’assaig a compressió del panell. La simulació es realitza mitjançant un càlcul no lineal, per estudiar la desestabilització i els fenòmens no lineals que pateix el panell. L’estudi es complementa amb una anàlisi modal i una anàlisi lineal

Failure mechanism under tensile loads in CFRP 0-90º cross-ply laminates containing voids

The failure mechanism of a voided CFRP 0-90° cross-ply laminate under tensile loads applied in one direction was studied in this Final Degree Project. For this purpose, voided coupons were manufactured for being tested and a FEA was done. In both investigations, voids were placed in 90º and 0º direction, in order to understand the void location influence. On the one hand, the behaviour of the voided laminates was investigated through a FEM in order to preview the stress distribution within the material. On the other hand, voided specimens where manufactured by applying blowing agent in between the inner layers. These specimens were tested by a quasi-static step wise tensile test where data showing its real behaviour was collected. Specimens were X-rayed after each step of the test in order to investigate the failure mechanism of the composite. Data from the test was studied so that relations such as strength of the laminates, crack density per stress, void length per first crack at the void and void area per first crack at the specimen could be characterized

Càlcul, disseny i fabricació d'una carrosseria autoportant en material compòsit per al vehicle de baix consum Àliga

El projecte és l’inici de la creació d’un nou prototip per a poder competir la temporada 2008 a la cursa de vehicles de baix consum Shell Eco-Marathon. El principal objectiu és aconseguir un xassís que redueixi, en la mesura del possible, el pes del prototip a la vegada que asseguri una millor rigidesa i millori l’ergonomia de tot el conjunt. Es dissenyarà tota la part estructural de la carrosseria, que serà sotmesa a càlcul mitjançant la tècnica dels elements finits i posteriorment es realitzarà una guia de producció per tal de guiar els membres de l’equip que en realitzin la producció

Deployment of self-expandable stents in aneurysmatic cerebral vessels: comparison of different computational approaches for interventional planning

In the last few years, there has been a growing focus on faster computational methods to support clinicians in planning stenting procedures. This study investigates the possibility of introducing computational approximations in modelling stent deployment in aneurysmatic cerebral vessels to achieve simulations compatible with the constraints of real clinical workflows. The release of a self-expandable stent in a simplified aneurysmatic vessel was modelled in four different initial positions. Six progressively simplified modelling approaches (based on Finite Element method and Fast Virtual Stenting – FVS) have been used. Comparing accuracy of the results, the final configuration of the stent is more affected by neglecting mechanical properties of materials (FVS) than by adopting 1D instead of 3D stent models. Nevertheless, the differencesshowed are acceptable compared to those achieved by considering different stent initial positions. Regarding computationalcosts, simulations involving 1D stent features are the only ones feasible in clinical context.

Residual thermomechanical stresses in thinned-chip assemblies

A new technology for the three-dimensional (3-D) stacking of very thin chips on a substrate is currently under development within the ultrathin chip stacking (UTCS) Esprit Project 24910. In this work, we present the first-level UTCS structure and the analysis of the thermomechanical stresses produced by the manufacturing process. Chips are thinned up to 10 or 15 m. We discuss potentially critical points at the edges of the chips, the suppression of delamination problems of the peripheral dielectric matrix and produce a comparative study of several technological choices for the design of metallic interconnect structures. The purpose of these calculations is to give inputs for the definition of design rules for this technology. We have therefore undertaken a programme that analyzes the influence of sundry design parameters and alternative development options. Numerical analyses are based on the finite element method.

Nanoscale capacitance microscopy of thin dielectric films

We present an analytical model to interpret nanoscale capacitance microscopy measurements on thin dielectric films. The model displays a logarithmic dependence on the tip-sample distance and on the film thickness-dielectric constant ratio and shows an excellent agreement with finite-element numerical simulations and experimental results on a broad range of values. Based on these results, we discuss the capabilities of nanoscale capacitance microscopy for the quantitative extraction of the dielectric constant and the thickness of thin dielectric films at the nanoscale.

Thermal modeling and management in ultrathin chip stack technology

This paper presents a thermal modeling for power management of a new three-dimensional (3-D) thinned dies stacking process. Besides the high concentration of power dissipating sources, which is the direct consequence of the very interesting integration efficiency increase, this new ultra-compact packaging technology can suffer of the poor thermal conductivity (about 700 times smaller than silicon one) of the benzocyclobutene (BCB) used as both adhesive and planarization layers in each level of the stack. Thermal simulation was conducted using three-dimensional (3-D) FEM tool to analyze the specific behaviors in such stacked structure and to optimize the design rules. This study first describes the heat transfer limitation through the vertical path by examining particularly the case of the high dissipating sources under small area. First results of characterization in transient regime by means of dedicated test device mounted in single level structure are presented. For the design optimization, the thermal draining capabilities of a copper grid or full copper plate embedded in the intermediate layer of stacked structure are evaluated as a function of the technological parameters and the physical properties. It is shown an interest for the transverse heat extraction under the buffer devices dissipating most the power and generally localized in the peripheral zone, and for the temperature uniformization, by heat spreading mechanism, in the localized regions where the attachment of the thin die is altered. Finally, all conclusions of this analysis are used for the quantitative projections of the thermal performance of a first demonstrator based on a three-levels stacking structure for space application.

Dynamic compact thermal models with multiple power sources: application to an ultrathin chip stacking technology

Whereas numerical modeling using finite-element methods (FEM) can provide transient temperature distribution in the component with enough accuracy, it is of the most importance the development of compact dynamic thermal models that can be used for electrothermal simulation. While in most cases single power sources are considered, here we focus on the simultaneous presence of multiple sources. The thermal model will be in the form of a thermal impedance matrix containing the thermal impedance transfer functions between two arbitrary ports. Eachindividual transfer function element ( ) is obtained from the analysis of the thermal temperature transient at node ¿ ¿ after a power step at node ¿ .¿ Different options for multiexponential transient analysis are detailed and compared. Among the options explored, small thermal models can be obtained by constrained nonlinear least squares (NLSQ) methods if the order is selected properly using validation signals. The methods are applied to the extraction of dynamic compact thermal models for a new ultrathin chip stack technology (UTCS).

A time-domain method for the analysis of thermal impedance response preserving the convolution form

The study of the thermal behavior of complex packages as multichip modules (MCM¿s) is usually carried out by measuring the so-called thermal impedance response, that is: the transient temperature after a power step. From the analysis of this signal, the thermal frequency response can be estimated, and consequently, compact thermal models may be extracted. We present a method to obtain an estimate of the time constant distribution underlying the observed transient. The method is based on an iterative deconvolution that produces an approximation to the time constant spectrum while preserving a convenient convolution form. This method is applied to the obtained thermal response of a microstructure as analyzed by finite element method as well as to the measured thermal response of a transistor array integrated circuit (IC) in a SMD package.

Estudi de l'efecte estabilitzador de les corretges en les cobertes lleugeres

L’acer és un dels materials més destacats dins l’àmbit estructural degut, en gran part, a laseva elevada capacitat tensional, tant en tracció com en compressió. Aquesta capacitatpermet estructures lleugeres i cobrir grans llums. En pòrtics de nusos rígids d’una nauindustrial és habitual l’ús de perfils oberts en doble T. Aquests perfils presenten una baixarigidesa a torsió i flexió lateral, el qual els fa propensos a patir inestabilitat quan es produeixcompressió en una de les seves ales en flexió, fenòmen que es coneix com a vinclamentlateral. Per aquest motiu, el càlcul en efectes de 2n ordre adquireix una importància mésrellevant a l’hora de dimensionar els elements estructurals. Un altre punt important és queels elements estructurals estan units entre ells, no treballen de manera individual, fet quecomporta un estudi més complex a l’hora de determinar les condicions de contorn de cadaelement.El present estudi pretén determinar l'efecte estabilitzador de les corretges en un pòrtic denusos rígids, i si és així, en quina magnitud pot arribar a afectar aquest grau de travat alconjunt estructural.L'Estudi s'ha realitzat seguint dues metodologies diferents. Els anàlisis estructurals parteixendels criteris indicats a les normatives d'estructures metàl•liques espanyola (CTE-DB-SE-A) il'europea (Eurocodig 3)

Disseny amforal i canvi tecnològic al voltant del canvi d'era: L'aportació de l'Anàlisi d'Elements Finits

[spa] Mediante el Análisis de Elementos Finitos es posible evaluar un diseño cerámico en función de su tipologia y de las propiedades mecánicas del material. Su aplicación permite considerar los factores tecnológicos que puedan haber condicionado el cambio de una tipologia cerámica. Este análisis se ilustra con los primeros tipos anfóricos romanos producidos en la actual Cataluña (Dressel 1, Tarraconense 1 y Pascuai 7).

Re-disseny d’utillatge i anàlisi de vinclament per l’assaig de compressió en laminats prims

El grup de recerca AMADE de la Universitat de Girona està especialitzat en la caracteritzacióde materials compòsits. Per avaluar la resistència i la tolerància al dany d'aquestes estructures,típicament es realitzen dos assajos: impacte a baixa velocitat i compressió després d'impacte(CAI per les sigles en anglès de Compression After Impact), respectivament. L'objectiu del'assaig CAI és obtenir la resistència residual a compressió de l'estructura.L'objectiu d'aquest treball és el de crear una adaptació per l'utillatge capaç d'assajar plaquesamb baix gruix . La modelització amb el mètode dels elements finits serveix per avaluar quantitativament el valorde les càrregues crítiques de vinclament per diferents gruixos de placa.Les plaques d'assaig són plaques de material compòsit amb làmines unidireccionals amb apilamentsimètric i balancejat

Bio-based composites from stone groundwood applied to new product development

This paper deals with the product design, engineering, and material selection intended for the manufacturing of an eco-friendly chair. The final product is expected to combine design attributes with technical and legal feasibility with the implementation of new bio-based materials. Considering the industrial design, a range of objectives and trends were determined after setting the market requirements, and the final concept was proposed and modeled. The product geometry, production technology, and legal specifications were the input data for product engineering. The material selection was based on the technical requirements. Polypropylene (PP) composite materials based on coupled-fiberglass, sized-fiberglass, and coupled-stone ground wood reinforcements were prepared and characterized. Final formulations based on these PP composites are proposed and justified

Dynamic electrostatic force microscopy in liquid media

We present the implementation of dynamic electrostatic force microscopy in liquid media. This implementation enables the quantitative imaging of local dielectric properties of materials in electrolyte solutions with nanoscale spatial resolution. Local imaging capabilities are obtained by probing the frequency-dependent and ionic concentration-dependent electrostatic forces at high frequency (>1 MHz), while quantification of the interaction forces is obtained with finite-element numerical calculations. The results presented open a wide range of possibilities in a number of fields where the dielectric properties of materials need to be probed at the nanoscale and in a liquid environment.