Residual thermomechanical stresses in thinned-chip assemblies

A new technology for the three-dimensional (3-D) stacking of very thin chips on a substrate is currently under development within the ultrathin chip stacking (UTCS) Esprit Project 24910. In this work, we present the first-level UTCS structure and the analysis of the thermomechanical stresses produced by the manufacturing process. Chips are thinned up to 10 or 15 m. We discuss potentially critical points at the edges of the chips, the suppression of delamination problems of the peripheral dielectric matrix and produce a comparative study of several technological choices for the design of metallic interconnect structures. The purpose of these calculations is to give inputs for the definition of design rules for this technology. We have therefore undertaken a programme that analyzes the influence of sundry design parameters and alternative development options. Numerical analyses are based on the finite element method.

A physical frequency-dependent compact model for RF integrated inductors

A frequency-dependent compact model for inductors in high ohmic substrates, which is based on an energy point-of-view, is developed. This approach enables the description of the most important coupling phenomena that take place inside the device. Magnetically induced losses are quite accurately calculated and coupling between electric and magnetic fields is given by means of a delay constant. The later coupling phenomenon provides a modified procedure for the computation of the fringing capacitance value, when the self-resonance frequency of the inductor is used as a fitting parameter. The model takes into account the width of every metal strip and the pitch between strips. This enables the description of optimized layout inductors. Data from experiments and electromagnetic simulators are presented to test the accuracy of the model.

A current-mode interface circuit for a piezoresistive pressure sensor

An interfacing circuit for piezoresistive pressure sensors based on CMOS current conveyors is presented. The main advantages of the proposed interfacing circuit include the use of a single piezoresistor, the capability of offset compensation, and a versatile current-mode configuration, with current output and current or voltage input. Experimental tests confirm linear relation of output voltage versus piezoresistance variation.

Improvement of the quality factor of RF integrated inductors by layout optimization

A systematic method to improve the quality (Q) factor of RF integrated inductors is presented in this paper. The proposed method is based on the layout optimization to minimize the series resistance of the inductor coil, taking into account both ohmic losses, due to conduction currents, and magnetically induced losses, due to eddy currents. The technique is particularly useful when applied to inductors in which the fabrication process includes integration substrate removal. However, it is also applicable to inductors on low-loss substrates. The method optimizes the width of the metal strip for each turn of the inductor coil, leading to a variable strip-width layout. The optimization procedure has been successfully applied to the design of square spiral inductors in a silicon-based multichip-module technology, complemented with silicon micromachining postprocessing. The obtained experimental results corroborate the validity of the proposed method. A Q factor of about 17 have been obtained for a 35-nH inductor at 1.5 GHz, with Q values higher than 40 predicted for a 20-nH inductor working at 3.5 GHz. The latter is up to a 60% better than the best results for a single strip-width inductor working at the same frequency.

Análisis y diseño de filtros apilados basados en resonadores acústicos

Durant els últims anys la demanda de filtres pas banda de ràdio freqüència, de reduïdes dimensions, lleugers i d'elevades prestacions destinats a sistemes de comunicacions inalàmbriques s'ha incrementat de forma significativa. Aquests sistemes principalment són els sistemes de telefonia mòbil de tercera generació UMTS y el sistema de navegació GPS. Els filtres actuals, basats en ressonadors SAW (Surface Acoustic Wave), tenen unes dimensions reduïdes però estan limitats en freqüència (3 GHz) i la seva tecnologia no és compatible amb les tecnologies estàndards de circuits integrats. Per aquestes raons s'espera que els filtres basats en ressonadors BAW (Bulk Acoustic Wave) substitueixin als SAW. Els dos tenen dimensions similars, però els filtres BAW poden funcionar a freqüències superiors a 3 GHz, poden treballar amb nivells de potència majors, i és important destacar el fet que la seva tecnologia és compatible amb les tecnologies estàndards de circuits integrats. La investigació en l'àmbit dels filtres BAW s'ha centrat en millorar els processos tecnològics i la qualitat dels materials, però s'ha treballat poc en l'adaptació de les tècniques sistemàtiques de disseny de filtres a les particularitats d'aquesta tecnologia, per tant el principal objectiu d'aquest treball és presentar mètodes sistemàtics per al disseny de filtres BAW, centrant-se en l'estudi d’estructures apilades.

Diseño de antenas UHF para aplicaciones RFID

Aquest projecte es basa en l'estudi, disseny i avaluació d'antenes per a aplicacions RFID a la banda UHF. Les etiquetes RFID estan compostes per un xip i una antena que han de presentar una bona adaptació per a aconseguir màxima transferència de potència. Els dos objectius principals en els diferents fases de disseny de cada antena han estat optimitzar les seves dimensions, i incrementar l'ample de banda.

Disseny i muntatge d'un mòdul d'entrades digitals per comunicació modbus

Actualment l’exigència i la competitivitat del mercat, obliguen les industries a modernitzar-se i automatitzar tots els seus processos productius. En aquests processos les dades i paràmetres de control són dades fonamentals a verificar. Amb aquest treball final de carrera, es pretén realitzar un mòdul d’entrades digitals, per tal de gestionar les dades rebudes d’un procés automatitzat. L’objectiu d’aquest TFC ha estat dissenyar un mòdul d’entrades digitals capaç de gestionar dades de qualsevol tipus de procés automatitzat i transmetre-les a un mestremitjançant un bus de comunicació Modbus. El projecte però, s’ha centrat en el cas específic d’un procés automatitzat per al tractament de la fusta. El desenvolupament d’aquest sistema, comprèn el disseny del circuit, la realització de la placa, el software de lectura de dades i la implementació del protocol Modbus. Tot el mòdul d’entrades està controlat per un microcontrolador PIC 18F4520. El disseny és un sistema multiplataforma per tal d’adaptar-se a qualsevol procés automàtic i algunes de les seves característiques més rellevants són: entrades aïllades multitensió, control de fugues, sortides a relé, i memòria externa de dades, entre altres. Com a conclusions cal dir que s’han assolit els objectius proposats amb èxit. S’ha aconseguit un disseny robust, fiable, polivalent i altament competitiu en el mercat. A nivell acadèmic, s’han ampliat els coneixements en el camp del disseny i de la programació.

A time-domain method for the analysis of thermal impedance response preserving the convolution form

The study of the thermal behavior of complex packages as multichip modules (MCM¿s) is usually carried out by measuring the so-called thermal impedance response, that is: the transient temperature after a power step. From the analysis of this signal, the thermal frequency response can be estimated, and consequently, compact thermal models may be extracted. We present a method to obtain an estimate of the time constant distribution underlying the observed transient. The method is based on an iterative deconvolution that produces an approximation to the time constant spectrum while preserving a convenient convolution form. This method is applied to the obtained thermal response of a microstructure as analyzed by finite element method as well as to the measured thermal response of a transistor array integrated circuit (IC) in a SMD package.

Via-configurable transistor array: a regular design technique to improve ICs yield

Process variations are a major bottleneck for digital CMOS integrated circuits manufacturability and yield. That iswhy regular techniques with different degrees of regularity are emerging as possible solutions. Our proposal is a new regular layout design technique called Via-Configurable Transistors Array (VCTA) that pushes to the limit circuit layout regularity for devices and interconnects in order to maximize regularity benefits. VCTA is predicted to perform worse than the Standard Cell approach designs for a certain technology node but it will allow the use of a future technology on an earlier time. Ourobjective is to optimize VCTA for it to be comparable to the Standard Cell design in an older technology. Simulations for the first unoptimized version of our VCTA of delay and energy consumption for a Full Adder circuit in the 90 nm technology node are presented and also the extrapolation for Carry-RippleAdders from 4 bits to 64 bits.

Disseny i muntatge d'un mòdul d'entrades digitals per comunicació modbus

Actualment l’exigència i la competitivitat del mercat, obliguen les industries a modernitzar-se i automatitzar tots els seus processos productius. En aquests processos les dades i paràmetres de control són dades fonamentals a verificar. Amb aquest treball final de carrera, es pretén realitzar un mòdul d’entrades digitals, per tal de gestionar les dades rebudes d’un procés automatitzat. L’objectiu d’aquest TFC ha estat dissenyar un mòdul d’entrades digitals capaç de gestionar dades de qualsevol tipus de procés automatitzat i transmetre-les a un mestremitjançant un bus de comunicació Modbus. El projecte però, s’ha centrat en el cas específic d’un procés automatitzat per al tractament de la fusta. El desenvolupament d’aquest sistema, comprèn el disseny del circuit, la realització de la placa, el software de lectura de dades i la implementació del protocol Modbus. Tot el mòdul d’entrades està controlat per un microcontrolador PIC 18F4520. El disseny és un sistema multiplataforma per tal d’adaptar-se a qualsevol procés automàtic i algunes de les seves característiques més rellevants són: entrades aïllades multitensió, control de fugues, sortides a relé, i memòria externa de dades, entre altres. Com a conclusions cal dir que s’han assolit els objectius proposats amb èxit. S’ha aconseguit un disseny robust, fiable, polivalent i altament competitiu en el mercat. A nivell acadèmic, s’han ampliat els coneixements en el camp del disseny i de la programació.

Gated Geiger mode avalanche photodiode pixels with integrated readout electronics for low noise photon detection

Avalanche photodiodes operated in the Geiger mode offer a high intrinsic gain as well as an excellent timing accuracy. These qualities make the sensor specially suitable for those applications where detectors with high sensitivity and low timing uncertainty are required. Moreover, they are compatible with standard CMOS technologies, allowing sensor and front-end electronics integration within the pixel cell. However, the sensor suffers from high levels of intrinsic noise, which may lead to erroneous results and limit the range of detectable signals. They also increase the amount of data that has to be stored. In this work, we present a pixel based on a Geiger-mode avalanche photodiode operated in the gated mode to reduce the probability to detect noise counts interfering with photon arrival events. The readout circuit is based on a two grounds scheme to enable low reverse bias overvoltages and consequently lessen the dark count rate. Experimental characterization of the fabricated pixel with the HV-AMS 0.35µm standard technology is also presented in this article.

Classical horizontal inequity and reranking: an integrated approach

The last 20 years have seen a significant evolution in the literature on horizontal inequity (HI) and have generated two major and "rival" methodological strands, namely, classical HI and reranking. We propose in this paper a class of ethically flexible tools that integrate these two strands. This is achieved using a measure of inequality that merges the well-known Gini coefficient and Atkinson indices, and that allows a decomposition of the total redistributive effect of taxes and transfers in a vertical equity effect and a loss of redistribution due to either classical HI or reranking. An inequality-change approach and a money-metric cost-of-inequality approach are developed. The latter approach makes aggregate classical HI decomposable across groups. As in recent work, equals are identified through a nonparametric estimation of the joint density of gross and net incomes. An illustration using Canadian data from 1981 to 1994 shows a substantial, and increasing, robust erosion of redistribution attributable both to classical HI and to reranking, but does not reveal which of reranking or classical HI is more important since this requires a judgement that is fundamentally normative in nature.

Demand and revenue implications of an integrated public transport policy: the case of Madrid

One of the most popular options for promoting public transport use is the provision of an integrated and high quality public transport system. This was the strategy adopted by the regional government in Madrid in 1986 and since then public transport patronage has increased by more than 50%. This paper has two objectives. The first is to identify the factors underlying the significant increase in the demand for public transport in Madrid. To do this we estimate an aggregate demand function for bus and underground trips, which allows us to obtain the demand elasticities with respect to the main attributes of public transport services and also to calculate the long-term impact of changes in those explanatory variables on patronage. The second objective is to evaluate the impact on revenue derived from the introduction of the travel card scheme, and to discuss the consequences on revenue of changes in the relative fare levels of different types of ticket without substantially affecting patronage. This latter issue is addressed by estimating a matrix of own and cross-price elasticities for different ticket types.

Equity and CO2 emissions distribution in climate change integrated assessment

Emissions distribution is a focus variable for the design of future international agreements to tackle global warming. This paper specifically analyses the future path of emissions distribution and its determinants in different scenarios. Whereas our analysis is driven by tools which are typically applied in the income distribution literature and which have recently been applied to the analysis of CO2 emissions distribution, a new methodological approach is that our study is driven by simulations run with a popular regionalised optimal growth climate change model over the 1995-2105 period. We find that the architecture of environmental policies, the implementation of flexible mechanisms and income concentration are key determinants of emissions distribution over time. In particular we find a robust positive relationship between measures of inequalities.