Electrodeposition of composite copper/liquid-containing microcapsule coatings

This paper presents results on the preparation of microcapsules containing liquid organosilica, and their co-deposition with copper in an acidic copper electrolyte onto a carbon steel cathode to form a copper/microcapsule composite coating. Microscopic analyses of the surface and the cross-section of the coating confirm the incorporation of the liquid-containing microcapsules in the coating layer. The influence of microcapsules in the electrolyte on the cathode polarization, as well as that of process conditions on the microcapsule inclusion, is also discussed. (C) 2004 Kluwer Academic Publishers.

Electrochemical deposition of cupric ions for the determination of mass transfer rates to a stepped rotating cylinder electrode

The stepped rotating cylinder electrode (SRCE) geometry has been developed as a simple aid to the practical study of the flow-enhanced corrosion and applied electrochemistry problems commonly observed under conditions of disturbed, turbulent flow. The electrodeposition of cupric ions from an acid sulphate plating bath has been used to characterise differential rates of mass transfer to the SRCE. The variation in thickness of electrodeposited copperfilms has allowed the mapping of local rates of mass transfer over the active surface of this geometry. Both optical and scanning electron microscopy were used for the examination of metallographic sections to provide a high resolution evaluation of the distribution of mass transfer coefficient. Results are also discussed using the convective-diffusion model in combination with the existing direct numerical flow simulation (DNS) data for this geometry.