Effect of microstructure on material removal mechanisms in nano/micro grinding of tungsten carbide mould inserts

Nano/micro grinding of tungsten carbide (WC) mould inserts was performed. A form accuracy of 〜200nm (in PV) and a surface roughness of 〜7nm were achieved. Nanoindentation revealed that small chipping or cracking occurred even at a penetration depth of 38nm, which could hinder the further improvement of surface quality during grinding. It was found that when grinding was conducted at nanometric scale, the microstructure of the work material and the morphology of the WC grains should be taken into account to enable a fully ductile removal. Copyright 2005 by the Japan Society of Mechanical Engineers

NMR study of the radiation-induced cross-linking of poly(tetrafluoroethylene-co-perfluoromethyl vinyl ether)

The gamma-radiolysis of poly(tetrafluoroethylene-co-perfuoromethyl vinyl ether) (TFE/PMVE) was investigated using solid state F-19 and C-13 NMR spectroscopy. Chain scission products identified in the polymer were saturated chain ends -CF2CF3 (G = 1.0), methyl ether end groups -CF2OCF3 (G = 0.9), acid end groups -CF2COOH (G = 0.5), and a small amount of terminal unsaturation -CF=CF2 (G = 0.2). A mechanism for the formation of these scission products was proposed and the G value for main chain scission, G(S), was determined to be 1.4. Cross-linking of TFE/PMVE was found to proceed via a Y-linking mechanism. The G value for cross-linking, G(X), was determined to be 0.9. A maximum of 0.2 mol % cross-links were formed under the experimental conditions.