Interface adaptor logic: A new model for interfacing peripherals in IP based designs

The introduction of standard on-chip buses has eased integration and boosted the production of IP functional cores. However, once an IP is bus specific retargeting to a different bus is time-consuming and tedious, and this reduces the reusability of the bus-specific IP. As new bus standards are introduced and different interconnection methods are proposed, this problem increases. Many solutions have been proposed, however these solutions either limit the IP block performance or are restricted to a particular platform. A new concept is presented that can connect IP blocks to a wide variety of interface architectures with low overhead. This is achieved through the use a special interface adaptor logic layer.

Experiments with Bose-Einstein condensates on an atom chip

We describe the production of BECs on a new type of atom chip based on silver foil. Our atom chip is fabricated with thick wires capable of carrying currents of several amperes without overheating. The silver surface is highly reflective to light resonant with optical transitions used for Rb. The pattern on the chip consists of two parallel Z-trap wires, capable of producing two-wire guide, and two additional endcap wires for varying the axial confinement. Condensates are produced in magnetic microtraps formed within 1 mm of surface of the chip. We have observed the fragmentation of cold atom clouds when brought close to the chip surface. This results from a perturbed trapping potential caused by nanometer deviations of the current path through the wires on the chip. We present results of fragmentation of cold clouds at distances below 100 µm from the wires and investigate the origin of the deviating current. The fragmentation has different characteristics to those seen with copper conductors. The dynamics of atoms in these microtraps is also investigated. ©2005 COPYRIGHT SPIE--The International Society for Optical Engineering. Downloading of the abstract is permitted for personal use only.

Foil based atom chip for Bose-Einstein condensates

We describe a novel method of fabricating atom chips that are well suited to the production and manipulation of atomic Bose–Einstein condensates. Our chip was created using a silver foil and simple micro-cutting techniques without the need for photolithography. It can sustain larger currents than conventional chips, and is compatible with the patterning of complex trapping potentials. A near pure Bose–Einstein condensate of 4 × 104 87Rb atoms has been created in a magnetic microtrap formed by currents through wires on the chip. We have observed the fragmentation of atom clouds in close proximity to the silver conductors. The fragmentation has different characteristic features to those seen with copper conductors.

Design of microchannel free-space optical interconnects based on vertical-cavity surface-emitting laser arrays

We investigate the design of free-space optical interconnects (FSOIs) based on arrays of vertical-cavity surface-emitting lasers (VCSELs), microlenses, and photodetectors. We explain the effect of the modal structure of a multimodeVCSEL beam on the performance of a FSOI with microchannel architecture. A Gaussian-beam diffraction model is used in combination with the experimentally obtained spectrally resolved VCSEL beam profiles to determine the optical channel crosstalk and the signal-to-noise ratio (SNR) in the system. The dependence of the SNR on the feature parameters of a FSOI is investigated. We found that the presence of higher-order modes reduces the SNR and the maximum feasible interconnect distance. We also found that the positioning of a VCSEL array relative to the transmitter microlens has a significant impact on the SNR and the maximum feasible interconnect distance. Our analysis shows that the departure from the traditional confocal system yields several advantages including the extended interconnect distance and/or improved SNR. The results show that FSOIs based on multimode VCSELs can be efficiently utilized in both chip-level and board-level interconnects. (C) 2002 Optical Society of America.

The effect of elasticity on drop creation in T-shaped microchannels

Polymeric microdrops of low viscosity, elastic fluids have been generated in T-shaped microfluidic devices using a cross-flow shear-induced drop generation process. Dilute (c/c* similar to 0.5) aqueous solutions of polyethylene oxide (PEO) of various molecular weights (3 x 10(5) -2 x 10(6) g/mol) were used as the drop phase fluids whilst silicone oils (5 mPa s