Dimension theory and nonstable K1 of quadratic modules

Employing Bak’s dimension theory, we investigate the nonstable quadratic K-group K1,2n(A, ) = G2n(A, )/E2n(A, ), n 3, where G2n(A, ) denotes the general quadratic group of rank n over a form ring (A, ) and E2n(A, ) its elementary subgroup. Considering form rings as a category with dimension in the sense of Bak, we obtain a dimension filtration G2n(A, ) G2n0(A, ) G2n1(A, ) E2n(A, ) of the general quadratic group G2n(A, ) such that G2n(A, )/G2n0(A, ) is Abelian, G2n0(A, ) G2n1(A, ) is a descending central series, and G2nd(A)(A, ) = E2n(A, ) whenever d(A) = (Bass–Serre dimension of A) is finite. In particular K1,2n(A, ) is solvable when d(A) <.

Evaluation of predicted network modules in yeast metabolism using NMR-based metabolite profiling

Genome-scale metabolic models promise important insights into cell function. However, the definition of pathways and functional network modules within these models, and in the biochemical literature in general, is often based on intuitive reasoning. Although mathematical methods have been proposed to identify modules, which are defined as groups of reactions with correlated fluxes, there is a need for experimental verification. We show here that multivariate statistical analysis of the NMR-derived intra- and extracellular metabolite profiles of single-gene deletion mutants in specific metabolic pathways in the yeast Saccharomyces cerevisiae identified outliers whose profiles were markedly different from those of the other mutants in their respective pathways. Application of flux coupling analysis to a metabolic model of this yeast showed that the deleted gene in an outlying mutant encoded an enzyme that was not part of the same functional network module as the other enzymes in the pathway. We suggest that metabolomic methods such as this, which do not require any knowledge of how a gene deletion might perturb the metabolic network, provide an empirical method for validating and ultimately refining the predicted network structure.

Non-trivial stably free modules over crossed products

We consider the class of crossed products of noetherian domains with universal enveloping algebras of Lie algebras. For algebras from this class we give a sufficient condition for the existence of projective non-free modules. This class includes Weyl algebras and universal envelopings of Lie algebras, for which this question, known as noncommutative Serre's problem, was extensively studied before. It turns out that the method of lifting of non-trivial stably free modules from simple Ore extensions can be applied to crossed products after an appropriate choice of filtration. The motivating examples of crossed products are provided by the class of RIT algebras, originating in non-equilibrium physics.

Limitations of Gene Duplication Models: Evolution of Modules in Protein Interaction Networks

It has been generally acknowledged that the module structure of protein interaction networks plays a crucial role with respect to the functional understanding of these networks. In this paper, we study evolutionary aspects of the module structure of protein interaction networks, which forms a mesoscopic level of description with respect to the architectural principles of networks. The purpose of this paper is to investigate limitations of well known gene duplication models by showing that these models are lacking crucial structural features present in protein interaction networks on a mesoscopic scale. This observation reveals our incomplete understanding of the structural evolution of protein networks on the module level. © 2012 Emmert-Streib.

Flowfield analysis of a linear clustered plug nozzle with round-to-square modules

The plug nozzle is one of the advanced expansion devices proposed to improve the overall performance of launcher liquid rocket engines. The present work investigates the three-dimensional flow field generated on this kind of nozzle by partitioning the primary nozzle into modules. A linear plug nozzle has been designed together with modules having two different geometries: a rectangular cross section and round-to-square module. Numerical simulations have been carried out considering the case where all modules of the primary nozzle are active and the case where one module is turned off. The solutions are compared and specific three-dimensional flow structures taking place inside the modules and on the plug are identified. The relationship between these structures and the skin friction distribution within the module and along the plug surface is investigated. Finally, the effect on performance of these three-dimensional flow features is emphasized. © 2006 Elsevier Masson SAS. All rights reserved.

Multiobjective design optimization of IGBT power modules considering power cycling and thermal cycling

Insulated-gate bipolar transistor (IGBT) power modules find widespread use in numerous power conversion applications where their reliability is of significant concern. Standard IGBT modules are fabricated for general-purpose applications while little has been designed for bespoke applications. However, conventional design of IGBTs can be improved by the multiobjective optimization technique. This paper proposes a novel design method to consider die-attachment solder failures induced by short power cycling and baseplate solder fatigue induced by the thermal cycling which are among major failure mechanisms of IGBTs. Thermal resistance is calculated analytically and the plastic work design is obtained with a high-fidelity finite-element model, which has been validated experimentally. The objective of minimizing the plastic work and constrain functions is formulated by the surrogate model. The nondominated sorting genetic algorithm-II is used to search for the Pareto-optimal solutions and the best design. The result of this combination generates an effective approach to optimize the physical structure of power electronic modules, taking account of historical environmental and operational conditions in the field.

State detection of bond wires in IGBT modules using eddy current pulsed thermography

Insulated gate bipolar transistor (IGBT) modules are important safety critical components in electrical power systems. Bond wire lift-off, a plastic deformation between wire bond and adjacent layers of a device caused by repeated power/thermal cycles, is the most common failure mechanism in IGBT modules. For the early detection and characterization of such failures, it is important to constantly detect or monitor the health state of IGBT modules, and the state of bond wires in particular. This paper introduces eddy current pulsed thermography (ECPT), a nondestructive evaluation technique, for the state detection and characterization of bond wire lift-off in IGBT modules. After the introduction of the experimental ECPT system, numerical simulation work is reported. The presented simulations are based on the 3-D electromagnetic-thermal coupling finite-element method and analyze transient temperature distribution within the bond wires. This paper illustrates the thermal patterns of bond wires using inductive heating with different wire statuses (lifted-off or well bonded) under two excitation conditions: nonuniform and uniform magnetic field excitations. Experimental results show that uniform excitation of healthy bonding wires, using a Helmholtz coil, provides the same eddy currents on each, while different eddy currents are seen on faulty wires. Both experimental and numerical results show that ECPT can be used for the detection and characterization of bond wires in power semiconductors through the analysis of the transient heating patterns of the wires. The main impact of this paper is that it is the first time electromagnetic induction thermography, so-called ECPT, has been employed on power/electronic devices. Because of its capability of contactless inspection of multiple wires in a single pass, and as such it opens a wide field of investigation in power/electronic devices for failure detection, performance characterization, and health monitoring. 

In situ diagnostics and prognostics of solder fatigue in IGBT modules for electric vehicle drives

This paper proposes an in situ diagnostic and prognostic (D&P) technology to monitor the health condition of insulated gate bipolar transistors (IGBTs) used in EVs with a focus on the IGBTs' solder layer fatigue. IGBTs' thermal impedance and the junction temperature can be used as health indicators for through-life condition monitoring (CM) where the terminal characteristics are measured and the devices' internal temperature-sensitive parameters are employed as temperature sensors to estimate the junction temperature. An auxiliary power supply unit, which can be converted from the battery's 12-V dc supply, provides power to the in situ test circuits and CM data can be stored in the on-board data-logger for further offline analysis. The proposed method is experimentally validated on the developed test circuitry and also compared with finite-element thermoelectrical simulation. The test results from thermal cycling are also compared with acoustic microscope and thermal images. The developed circuitry is proved to be effective to detect solder fatigue while each IGBT in the converter can be examined sequentially during red-light stopping or services. The D&P circuitry can utilize existing on-board hardware and be embedded in the IGBT's gate drive unit.