13 resultados para skid vm

em QUB Research Portal - Research Directory and Institutional Repository for Queen's University Belfast


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With the intention of introducing unique and value-added products to the market, organizations have become more conscious of how to best create knowledge as reported by Ganesh Bhatt in 2000 in 'Information dynamics, learning and knowledge creation in organizations'. Knowledge creation is recognized as having an important role in generating and sustaining a competitive advantage as well as in meeting organizational goals, as reported by Aleda Roth and her colleagues in 1994 in 'The knowledge factory for accelerated learning practices.' One of the successful ingredients of value management (VM) is its utilization of diverse knowledge resources, drawing upon different organizational functions, professional disciplines, and stakeholders, in a facilitated team process. Multidisciplinary VM study teams are viewed as having high potential to innovate due to their heterogeneous nature. This paper looks at one of the VM workshop's major benefits, namely, knowledge creation. A case study approach was used to explore the nature, processes, and issues associated with fostering a dynamic knowledge creation capability within VM teams. The results indicate that the dynamic knowledge creating process is embedded in and influenced by managing team constellation, creating shared awareness, developing shared understanding, and producing aligned action. The catalysts that can speed up the processes are open dialogue and discussion among participants. This process is enhanced by the use of facilitators, skilled at extracting knowledge.

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We propose simple models to predict the performance degradation of disk requests due to storage device contention in consolidated virtualized environments. Model parameters can be deduced from measurements obtained inside Virtual Machines (VMs) from a system where a single VM accesses a remote storage server. The parameterized model can then be used to predict the effect of storage contention when multiple VMs are consolidated on the same server. We first propose a trace-driven approach that evaluates a queueing network with fair share scheduling using simulation. The model parameters consider Virtual Machine Monitor level disk access optimizations and rely on a calibration technique. We further present a measurement-based approach that allows a distinct characterization of read/write performance attributes. In particular, we define simple linear prediction models for I/O request mean response times, throughputs and read/write mixes, as well as a simulation model for predicting response time distributions. We found our models to be effective in predicting such quantities across a range of synthetic and emulated application workloads. 

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We propose a trace-driven approach to predict the performance degradation of disk request response times due to storage device contention in consolidated virtualized environments. Our performance model evaluates a queueing network with fair share scheduling using trace-driven simulation. The model parameters can be deduced from measurements obtained inside Virtual Machines (VMs) from a system where a single VM accesses a remote storage server. The parameterized model can then be used to predict the effect of storage contention when multiple VMs are consolidated on the same virtualized server. The model parameter estimation relies on a search technique that tries to estimate the splitting and merging of blocks at the the Virtual Machine Monitor (VMM) level in the case of multiple competing VMs. Simulation experiments based on traces of the Postmark and FFSB disk benchmarks show that our model is able to accurately predict the impact of workload consolidation on VM disk IO response times.

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Semiconductor fabrication involves several sequential processing steps with the result that critical production variables are often affected by a superposition of affects over multiple steps. In this paper a Virtual Metrology (VM) system for early stage measurement of such variables is presented; the VM system seeks to express the contribution to the output variability that is due to a defined observable part of the production line. The outputs of the processed system may be used for process monitoring and control purposes. A second contribution of this work is the introduction of Elastic Nets, a regularization and variable selection technique for the modelling of highly-correlated datasets, as a technique for the development of VM models. Elastic Nets and the proposed VM system are illustrated using real data from a multi-stage etch process used in the fabrication of disk drive read/write heads. © 2013 IEEE.

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Plasma etch is a key process in modern semiconductor manufacturing facilities as it offers process simplification and yet greater dimensional tolerances compared to wet chemical etch technology. The main challenge of operating plasma etchers is to maintain a consistent etch rate spatially and temporally for a given wafer and for successive wafers processed in the same etch tool. Etch rate measurements require expensive metrology steps and therefore in general only limited sampling is performed. Furthermore, the results of measurements are not accessible in real-time, limiting the options for run-to-run control. This paper investigates a Virtual Metrology (VM) enabled Dynamic Sampling (DS) methodology as an alternative paradigm for balancing the need to reduce costly metrology with the need to measure more frequently and in a timely fashion to enable wafer-to-wafer control. Using a Gaussian Process Regression (GPR) VM model for etch rate estimation of a plasma etch process, the proposed dynamic sampling methodology is demonstrated and evaluated for a number of different predictive dynamic sampling rules. © 2013 IEEE.

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Reducing wafer metrology continues to be a major target in semiconductor manufacturing efficiency initiatives due to it being a high cost, non-value added operation that impacts on cycle-time and throughput. However, metrology cannot be eliminated completely given the important role it plays in process monitoring and advanced process control. To achieve the required manufacturing precision, measurements are typically taken at multiple sites across a wafer. The selection of these sites is usually based on a priori knowledge of wafer failure patterns and spatial variability with additional sites added over time in response to process issues. As a result, it is often the case that in mature processes significant redundancy can exist in wafer measurement plans. This paper proposes a novel methodology based on Forward Selection Component Analysis (FSCA) for analyzing historical metrology data in order to determine the minimum set of wafer sites needed for process monitoring. The paper also introduces a virtual metrology (VM) based approach for reconstructing the complete wafer profile from the optimal sites identified by FSCA. The proposed methodology is tested and validated on a wafer manufacturing metrology dataset. © 2012 IEEE.

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Increasingly semiconductor manufacturers are exploring opportunities for virtual metrology (VM) enabled process monitoring and control as a means of reducing non-value added metrology and achieving ever more demanding wafer fabrication tolerances. However, developing robust, reliable and interpretable VM models can be very challenging due to the highly correlated input space often associated with the underpinning data sets. A particularly pertinent example is etch rate prediction of plasma etch processes from multichannel optical emission spectroscopy data. This paper proposes a novel input-clustering based forward stepwise regression methodology for VM model building in such highly correlated input spaces. Max Separation Clustering (MSC) is employed as a pre-processing step to identify a reduced srt of well-conditioned, representative variables that can then be used as inputs to state-of-the-art model building techniques such as Forward Selection Regression (FSR), Ridge regression, LASSO and Forward Selection Ridge Regression (FCRR). The methodology is validated on a benchmark semiconductor plasma etch dataset and the results obtained are compared with those achieved when the state-of-art approaches are applied directly to the data without the MSC pre-processing step. Significant performance improvements are observed when MSC is combined with FSR (13%) and FSRR (8.5%), but not with Ridge Regression (-1%) or LASSO (-32%). The optimal VM results are obtained using the MSC-FSR and MSC-FSRR generated models. © 2012 IEEE.

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Virtual metrology (VM) aims to predict metrology values using sensor data from production equipment and physical metrology values of preceding samples. VM is a promising technology for the semiconductor manufacturing industry as it can reduce the frequency of in-line metrology operations and provide supportive information for other operations such as fault detection, predictive maintenance and run-to-run control. The prediction models for VM can be from a large variety of linear and nonlinear regression methods and the selection of a proper regression method for a specific VM problem is not straightforward, especially when the candidate predictor set is of high dimension, correlated and noisy. Using process data from a benchmark semiconductor manufacturing process, this paper evaluates the performance of four typical regression methods for VM: multiple linear regression (MLR), least absolute shrinkage and selection operator (LASSO), neural networks (NN) and Gaussian process regression (GPR). It is observed that GPR performs the best among the four methods and that, remarkably, the performance of linear regression approaches that of GPR as the subset of selected input variables is increased. The observed competitiveness of high-dimensional linear regression models, which does not hold true in general, is explained in the context of extreme learning machines and functional link neural networks.

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Virtual metrology (VM) aims to predict metrology values using sensor data from production equipment and physical metrology values of preceding samples. VM is a promising technology for the semiconductor manufacturing industry as it can reduce the frequency of in-line metrology operations and provide supportive information for other operations such as fault detection, predictive maintenance and run-to-run control. Methods with minimal user intervention are required to perform VM in a real-time industrial process. In this paper we propose extreme learning machines (ELM) as a competitive alternative to popular methods like lasso and ridge regression for developing VM models. In addition, we propose a new way to choose the hidden layer weights of ELMs that leads to an improvement in its prediction performance.

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With the availability of a wide range of cloud Virtual Machines (VMs) it is difficult to determine which VMs can maximise the performance of an application. Benchmarking is commonly used to this end for capturing the performance of VMs. Most cloud benchmarking techniques are typically heavyweight - time consuming processes which have to benchmark the entire VM in order to obtain accurate benchmark data. Such benchmarks cannot be used in real-time on the cloud and incur extra costs even before an application is deployed.

In this paper, we present lightweight cloud benchmarking techniques that execute quickly and can be used in near real-time on the cloud. The exploration of lightweight benchmarking techniques are facilitated by the development of DocLite - Docker Container-based Lightweight Benchmarking. DocLite is built on the Docker container technology which allows a user-defined portion (such as memory size and the number of CPU cores) of the VM to be benchmarked. DocLite operates in two modes, in the first mode, containers are used to benchmark a small portion of the VM to generate performance ranks. In the second mode, historic benchmark data is used along with the first mode as a hybrid to generate VM ranks. The generated ranks are evaluated against three scientific high-performance computing applications. The proposed techniques are up to 91 times faster than a heavyweight technique which benchmarks the entire VM. It is observed that the first mode can generate ranks with over 90% and 86% accuracy for sequential and parallel execution of an application. The hybrid mode improves the correlation slightly but the first mode is sufficient for benchmarking cloud VMs.

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Cloud data centres are implemented as large-scale clusters with demanding requirements for service performance, availability and cost of operation. As a result of scale and complexity, data centres typically exhibit large numbers of system anomalies resulting from operator error, resource over/under provisioning, hardware or software failures and security issus anomalies are inherently difficult to identify and resolve promptly via human inspection. Therefore, it is vital in a cloud system to have automatic system monitoring that detects potential anomalies and identifies their source. In this paper we present a lightweight anomaly detection tool for Cloud data centres which combines extended log analysis and rigorous correlation of system metrics, implemented by an efficient correlation algorithm which does not require training or complex infrastructure set up. The LADT algorithm is based on the premise that there is a strong correlation between node level and VM level metrics in a cloud system. This correlation will drop significantly in the event of any performance anomaly at the node-level and a continuous drop in the correlation can indicate the presence of a true anomaly in the node. The log analysis of LADT assists in determining whether the correlation drop could be caused by naturally occurring cloud management activity such as VM migration, creation, suspension, termination or resizing. In this way, any potential anomaly alerts are reasoned about to prevent false positives that could be caused by the cloud operator’s activity. We demonstrate LADT with log analysis in a Cloud environment to show how the log analysis is combined with the correlation of systems metrics to achieve accurate anomaly detection.

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Existing benchmarking methods are time consuming processes as they typically benchmark the entire Virtual Machine (VM) in order to generate accurate performance data, making them less suitable for real-time analytics. The research in this paper is aimed to surmount the above challenge by presenting DocLite - Docker Container-based Lightweight benchmarking tool. DocLite explores lightweight cloud benchmarking methods for rapidly executing benchmarks in near real-time. DocLite is built on the Docker container technology, which allows a user-defined memory size and number of CPU cores of the VM to be benchmarked. The tool incorporates two benchmarking methods - the first referred to as the native method employs containers to benchmark a small portion of the VM and generate performance ranks, and the second uses historic benchmark data along with the native method as a hybrid to generate VM ranks. The proposed methods are evaluated on three use-cases and are observed to be up to 91 times faster than benchmarking the entire VM. In both methods, small containers provide the same quality of rankings as a large container. The native method generates ranks with over 90% and 86% accuracy for sequential and parallel execution of an application compared against benchmarking the whole VM. The hybrid method did not improve the quality of the rankings significantly.

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Virtual Reality techniques are relatively new, having experienced significant development only during the last few years, in accordance with the progress achieved by computer science and hardware and software technologies. The study of such advanced design systems has led to the realization of an immersive environment in which new procedures for the evaluation of product prototypes, ergonomics and manufacturing operations have been simulated. The application of the environment realized to robotics, ergonomics, plant simulations and maintainability verifications has allowed us to highlight the advantages offered by a design methodology: the possibility of working on the industrial product in the first phase of conception; of placing the designer in front of the virtual reproduction of the product in a realistic way; and of interacting with the same concept. The aim of this book is to present an updated vision of VM through different aspects. We will describe the trends and results achieved in the automotive, aerospace and railway fields, in terms of the Digital Product Creation Process to design the product and the manufacturing process.