Mechanisms and sources of passive intermodulation in printed circuits

Modern wireless systems are expected to operate in multiple frequency bands and support diverse communications standards to provide the high volume and speed of data transmission. Today's major limitations of their performance are imposed by interference, spurious emission and noise generated by high-power carriers in antennas and passive components of the RF front-end. Passive Intermodulation (PIM), which causes the combinatorial frequency generation in the operational bands, presents a primary challenge to signal integrity, system efficacy and data throughput. © 2013 IEEE.

Effects of Geometrical Discontinuities on Distributed Passive Intermodulation in Printed Lines

This paper presents the results of experimental study of passive intermodulation (PIM) generation in microstrip lines with U-shaped and meandered strips, impedance tapers, and strips with the profiled edges. It is shown that the geometrical discontinuities in printed circuits may have a noticeable impact on distributed PIM generation even when their effect is indiscernible in the linear regime measurements. A consistent interpretation of the observed phenomena has been proposed on the basis of the phase synchronism in the four-wave mixing process. The results of this study reveal new features of PIM production important for the design and characterization of low-PIM microstrip circuits. © 2010 IEEE.

Effects of Interface Conditions and Long-Term Stability of Passive Intermodulation Response in Printed Lines

An experimental investigation of the effect of conductor-to-substrate interface on distributed passive intermodulation (PIM) generation in printed microstrip lines has been undertaken using the custom-designed microwave laminates with removed surface bonding layers and with the commercial adhesion promotion applied to the conductor underside. The study of long-term stability of PIM performance of the printed circuits is reported for the first time. The comprehensive measurement results, observations of the selfimprovement of the PIM performance and the effect of panel bending on PIM generation in printed boards with different finishing are presented. A consistent physical interpretation of the observed phenomena is proposed. The results of this study provide new important considerations for the design and characterisation of low-PIM printed circuits.

Passive Intermodulation in Distributed Circuits with Cascaded Discrete Nonlinearities

The principle aspects of passive intermodulation (PIM) characterisation in distributed printed circuits with cascaded lumped nonlinearities are presented. Mechanisms of PIM generations have been investigated experimentally and modelled using the formalism of X-parameters. The devised equivalent circuit models are applied to the analysis of microstrip lines with distributed and cascaded lumped sources of nonlinearity. The dynamic measurements have revealed that PIM generation rates in straight and meandered microstrip lines differ and significantly deviate from those expected for the respective discrete sources of nonlinearity. The obtained results indicate that multiple physical sources of nonlinearity contribute to PIM generation in printed circuits. Finally, it is demonstrated that the electrical discontinuities can have significant effect on the overall PIM response of the distributed passive circuits and cause PIM product leakage and parasitic coupling between isolated circuit elements.

Characterisation of nonlinear distortion and intermodulation in passive devices and antennas

The paper presents a conceptual discussion of the characterisation and phenomenology of passive intermodulation (PIM) by the localised and distributed nonlinearities in passive devices and antennas. The PIM distinctive nature and its impact on signal distortions are examined in comparison with similar effects in power amplifiers. The main features of PIM generation are discussed and illustrated by the example of PIM due to electro-thermal nonlinearity. The issues of measurement, discrimination and modelling of PIM generated by nonlinearities in passive RF components and antennas are addressed.

Millimetre wave dielectric characterisation of multilayer LTCC substrate

The paper reports on the mm-wave characterization of a low temperature co-fired ceramic (LTCC) substrate. A substrate integrated resonator (SIW) method is presented for robust extraction of both permittivity and loss tangent of the substrate. The data obtained allow full characterization of the substrate in the 71 GHz – 95 GHz frequency range suitable for accurate modelling of E-and W-band printed circuits.