Thermal analysis of LEDS for liquid crystal display's backlighting

This paper investigated the thermal design of the light emitting diode (LED)onto the board and its packaging. The LED was a 6-lead MultiLED with three chips designed for LCD backlighting and other lighting purposes. A 3D finite element model of this LED was built up and thermal analysis was carried out using the multi physics software package PHYSICA. The modeling results were presented as temperature distributions in each LED, and the predicted junction temperature was used for thermal resistance calculation. The results for the board structure indicated that (1) removing the foil attach decreased the thermal resistance, (2) Increasing the copper foil thickness reduced the thermal resistance. package design indicated that the SMT designed LED with integrated slug gave lower thermal resistance. Pb-free solder material gave lower thermal resistance and junction temperature when compared with conductive adhesive

Effects of magnetic fields on crystal growth

The effects of a constant uniform magnetic field on thermoelectric currents during dendritic solidification were investigated using an enthalpy based numerical model. It was found that the resulting Lorentz force generates a complex flow influencing the solidification pattern. Experimental work of material processing under high magnetic field conditions has shown that the microstructure can be significantly altered. There is evidence that these effects can be atrtributed to the Lorentz force created through the thermoelectric magentohydrodynamic interactions.[1,2] However the mechanism of how this occurs is not very well understood. In this paper, our aim is to investigate the flow field created from the Lorentz force and how this influences the morphology of dendritic growth for both pure materials and binary alloys.