Polymer waveguide and VCSEL array multi-physics modelling for OECB based optical backplanes [opto-electrical circuit boards]

The deployment of OECBs (opto-electrical circuit boards) is expected to make a significant impact in the telecomm switches arena within the next five years. This will create optical backplanes with high speed point-to-point optical interconnects. The crucial aspect in the manufacturing process of the optical backplane is the successful coupling between VCSEL (vertical cavity surface emitting laser) device and embedded waveguide in the OECB. The results from a thermo-mechanical analysis are being used in a purely optical model, which solves optical energy and attenuation from the VCSEL aperture into, and then through, the waveguide. Results from the modelling are being investigated using DOE analysis to identify packaging parameters that minimise misalignment. This is achieved via a specialist optimisation software package. Results from the thermomechanical and optical models are discussed as are experimental results from the DOE.

Modelling induction skull melting design modifications

Induction Skull Melting (ISM) is used for heating, melting, mixing and, possibly, evaporating reactive liquid metals at high temperatures when a minimum contact at solid walls is required. The numerical model presented here involves the complete time dependent process analysis based on the coupled electromagnetic, temperature and turbulent velocity fields during the melting and liquid shape changes. The simulation is validated against measurements of liquid metal height, temperature and heat losses in a commercial size ISM furnace. The often observed limiting temperature plateau for ever increasing electrical power input is explained by the turbulent convective heat losses. Various methods to increase the superheat within the liquid melt, the process energy efficiency and stability are proposed.

Electronic packaging and reduction in modelling time using domain decomposition

The domain decomposition method is directed to electronic packaging simulation in this article. The objective is to address the entire simulation process chain, to alleviate user interactions where they are heavy to mechanization by component approach to streamline the model simulation process.

The use of computer simulation for aircraft evacuation certification: a report from the VERRES project

In this paper a methodology for the application of computer simulation to the evacuation certification of aircraft is suggested. The methodology suggested here involves the use of computer simulation, historic certification data, component testing and full-scale certification trials. The proposed methodology sets out a protocol for how computer simulation should be undertaken in a certification environment and draws on experience from both the marine and building industries. Along with the suggested protocol, a phased introduction of computer models to certification is suggested. Given the sceptical nature of the aviation community regarding any certification methodology change in general, this would involve as a first step the use of computer simulation in conjunction with full-scale testing. The computer model would be used to reproduce a probability distribution of likely aircraft performance under current certification conditions and in addition, several other more challenging scenarios could be developed. The combination of full-scale trial, computer simulation (and if necessary component testing) would provide better insight into the actual performance capabilities of the aircraft by generating a performance probability distribution or performance envelope rather than a single datum. Once further confidence in the technique is established, the second step would only involve computer simulation and component testing. This would only be contemplated after sufficient experience and confidence in the use of computer models have been developed. The third step in the adoption of computer simulation for certification would involve the introduction of several scenarios based on for example exit availability instructed by accident analysis. The final step would be the introduction of more realistic accident scenarios into the certification process. This would require the continued development of aircraft evacuation modelling technology to include additional behavioural features common in real accident scenarios.

Computational modelling of bubbles, droplets and particles in metals reduction and refining

A multi-phase framework is typically required for the CFD modelling of metals reduction processes. Such processes typically involve the interaction of liquid metals, a gas (often air) top space, liquid droplets in the top space and injection of both solid particles and gaseous bubbles into the bath. The exchange of mass, momentum and energy between the phases is fundamental to these processes. Multi-phase algorithms are complex and can be unreliable in terms of either or both convergence behaviour or in the extent to which the physics is captured. In this contribution, we discuss these multi-phase flow issues and describe an example of each of the main “single phase” approaches to modelling this class of problems (i.e., Eulerian–Lagrangian and Eulerian–Eulerian). Their utility is illustrated in the context of two problems – one involving the injection of sparging gases into a steel continuous slab caster and the other based on the development of a novel process for aluminium electrolysis. In the steel caster, the coupling of the Lagrangian tracking of the gas phase with the continuum enables the simulation of the transient motion of the metal–flux interface. The model of the electrolysis process employs a novel method for the calculation of slip velocities of oxygen bubbles, resulting from the dissolution of alumina, which allows the efficiency of the process to be predicted.

Computational modelling of multi-physics and multi-scale processes in parallel

This paper provides an overview of the developing needs for simulation software technologies for the computational modelling of problems that involve combinations of interactions amongst varying physical phenomena over a variety of time and space scales. Computational modelling of such problems requires software tech1nologies that enable the mathematical description of the interacting physical phenomena together with the solution of the resulting suites of equations in a numerically consistent and compatible manner. This functionality requires the structuring of simulation modules for specific physical phenomena so that the coupling can be effectively represented. These multi-physics and multi-scale computations are very compute intensive and the simulation software must operate effectively in parallel if it is to be used in this context. An approach to these classes of multi-disciplinary simulation in parallel is described, with some key examples of application to2 challenging engineering problems.

Data collection in support of the modelling of naval vessels

Evacuation analysis of passenger and commercial shipping can be undertaken using computer-based simulation tools such as maritimeEXODUS. These tools emulate human shipboard behaviour during emergency scenarios; however it is largely based around the behaviour of civilian passengers and fixtures and fittings of merchant vessels. If these tools and procedures are to be applied to naval vessels there is a clear requirement to understand the behaviour of well-trained naval personnel interacting with the fixtures and fittings that are exclusive to warships. Human factor trials using Royal Navy training facilities were recently undertaken to collect data to improve our understanding of the performance of naval personnel in warship environments. The trials were designed and conducted by staff from the Fire Safety Engineering Group (FSEG) of the University of Greenwich on behalf of the Sea Technology Group (STG), Defence Procurement Agency. The trials involved a selection of RN volunteers with sea-going experience in warships, operating and traversing structural components under different angles of heel. This paper describes the trials and some of the collected data.

A study of modelling approaches for rail vehicle collision behaviour

A rigid wall model has been used widely in the numerical simulation of rail vehicle impacts. Finite element impact modelling of rail vehicles is generally based on a half-width and full-length or half-length structure, depending on the symmetry. The structure and components of rail vehicles are normally designed to cope with proof loading to ensure adequate ride performance. In this paper, the authors present a study of a rail vehicle with driving cab focused on improving the modelling approach and exploring the intrinsic structural weaknesses to enhance its crashworthiness. The underpinning research used finite element analysis and compared the behaviour of the rail vehicle in different impact scenarios. It was found that the simulation of a rigid wall impact can mask structural weaknesses; that even a completely symmetrical impact may lead to an asymmetrical result; that downward bending is an intrinsic weakness of conventional rail vehicles and that a rigid part of the vehicle structure, such as the body bolster, may cause uncoordinated deformation and shear fracture between the vehicle sections. These findings have significance for impact simulation, the full-scale testing of rail vehicles and rail vehicle design in general.

Microwave modelling and validation in food thawing applications

Developing temperature fields in frozen cheese sauce undergoing microwave heating were simulated and measured. Two scenarios were investigated: a centric and offset placement on the rotating turntable. Numerical modeling was performed using a dedicated electromagnetic Finite Difference Time Domain (FDTD) module that was two-way coupled to the PHYSICA multiphysics package. Two meshes were used: the food material and container were meshed for the heat transfer and the microwave oven cavity and waveguide were meshed for the microwave field. Power densities obtained on the structured FDTD mesh were mapped onto the unstructured finite volume method mesh for each time-step/turntable position. On heating for each specified time-step the temperature field was mapped back onto the FDTD mesh and the electromagnetic properties were updated accordingly. Changes in thermal/electric properties associated with the phase transition were fully accounted for as well as heat losses from product to cavity. Detailed comparisons were carried out for the centric and offset placements, comparing experimental temperature profiles during microwave thawing with those obtained by numerical simulation.

Thermal-mechanical modelling of power electronic module packaging

In this paper the reliability of the isolation substrate and chip mountdown solder interconnect of power modules under thermal-mechanical loading has been analysed using a numerical modelling approach. The damage indicators such as the peel stress and the accumulated plastic work density in solder interconnect are calculated for a range of geometrical design parameters, and the effects of these parameters on the reliability are studied by using a combination of the finite element analysis (FEA) method and optimisation techniques. The sensitivities of the reliability of the isolation substrate and solder interconnect to the changes of the design parameters are obtained and optimal designs are studied using response surface approximation and gradient optimization method

Coupled FDTD-FVM simulation of microwave heating of polymer materials for micro-systems packaging applications

Heating in an idealised polymer load in a novel open-ended variable frequency microwave oven is numerically simulated using a couple solver approach. The frequency-agile microwave oven bonding system (FAMOBS)is developed to meet rapid polymer curing requirements in microelectronics and optoelectronics manufacturing. The heating of and idealised polymer load has been investigated through numerical modelling. Assessment of the system comprises of simulation of electromagnetic fields and of temperature distribution within the load. Initial simulation results are presented and contrasted with experimental analysis of field distribution

Multi-physics modelling for microelectronics and microsystems - current capabilities and future challenges

At present the vast majority of Computer-Aided- Engineering (CAE) analysis calculations for microelectronic and microsystems technologies are undertaken using software tools that focus on single aspects of the physics taking place. For example, the design engineer may use one code to predict the airflow and thermal behavior of an electronic package, then another code to predict the stress in solder joints, and then yet another code to predict electromagnetic radiation throughout the system. The reason for this focus of mesh-based codes on separate parts of the governing physics is essentially due to the numerical technologies used to solve the partial differential equations, combined with the subsequent heritage structure in the software codes. Using different software tools, that each requires model build and meshing, leads to a large investment in time, and hence cost, to undertake each of the simulations. During the last ten years there has been significant developments in the modelling community around multi- physics analysis. These developments are being followed by many of the code vendors who are now providing multi-physics capabilities in their software tools. This paper illustrates current capabilities of multi-physics technology and highlights some of the future challenges

Challenges in modelling biofluids in microchannels

This paper presents the challenges encountered in modelling biofluids in microchannels. In particular blood separation implemented in a T-microchannel device is analysed. Microfluids behave different from the counterparts in the microscale and a different approach has been adopted here to model them, which emphasize the roles of viscous forces, high shear rate performance and particle interaction in microscope. A T-microchannel design is numerically analysed by means of computational fluid dynamics (CFD) to investigate the effectiveness of blood separation based on the bifurcation law and other bio-physical effects. The simulation shows that the device can separate blood cells from plasma.

Modelling of nano-imprint forming process for the production of miniaturised 3D structures

Nano-imprint forming (NIF) as manufacturing technology is ideally placed to enable high resolution, low-cost and high-throughput fabrication of three-dimensional fine structures and the packaging of heterogeneous micro-systems (S.Y. Chou and P.R. Krauss, 1997). This paper details a thermo-mechanical modelling methodology for optimising this process for different materials used in components such as mini-fluidics and bio-chemical systems, optoelectronics, photonics and health usage monitoring systems (HUMS). This work is part of a major UK Grand Challenge project - 3D-Mintegration - which is aiming to develop modelling and design technologies for the next generation of fabrication, assembly and test processes for 3D-miniaturised systems.

Computer simulation of crack propagation in power electronics module solder joints

A numerical modelling method for the analysis of solder joint damage and crack propagation has been described in this paper. The method is based on the disturbed state concept. Under cyclic thermal-mechanical loading conditions, the level of damage that occurs in solder joints is assumed to be a simple monotonic scalar function of the accumulated equivalent plastic strain. The increase of damage leads to crack initiation and propagation. By tracking the evolution of the damage level in solder joints, crack propagation path and rate can be simulated using Finite Element Analysis method. The discussions are focused on issues in the implementation of the method. The technique of speeding up the simulation and the mesh dependency issues are analysed. As an example of the application of this method, crack propagation in solder joints of power electronics modules under cyclic thermal-mechanical loading conditions has been analyzed and the predicted cracked area size after 3000 loading cycles is consistent with experimental results.