Multi-Scale Dynamic Study of Secondary Impact During Drop Testing of Surface Mount Packages

This dissertation focuses on design challenges caused by secondary impacts to printed wiring assemblies (PWAs) within hand-held electronics due to accidental drop or impact loading. The continuing increase of functionality, miniaturization and affordability has resulted in a decrease in the size and weight of handheld electronic products. As a result, PWAs have become thinner and the clearances between surrounding structures have decreased. The resulting increase in flexibility of the PWAs in combination with the reduced clearances requires new design rules to minimize and survive possible internal collisions impacts between PWAs and surrounding structures. Such collisions are being termed ‘secondary impact’ in this study. The effect of secondary impact on board-level drop reliability of printed wiring boards (PWBs) assembled with MEMS microphone components, is investigated using a combination of testing, response and stress analysis, and damage modeling. The response analysis is conducted using a combination of numerical finite element modeling and simplified analytic models for additional parametric sensitivity studies.

Characterization of Non-linear Polymer Properties to Predict Process Induced Warpage and Residual Stress of Electronic Packages

Nonlinear thermo-mechanical properties of advanced polymers are crucial to accurate prediction of the process induced warpage and residual stress of electronics packages. The Fiber Bragg grating (FBG) sensor based method is advanced and implemented to determine temperature and time dependent nonlinear properties. The FBG sensor is embedded in the center of the cylindrical specimen, which deforms together with the specimen. The strains of the specimen at different loading conditions are monitored by the FBG sensor. Two main sources of the warpage are considered: curing induced warpage and coefficient of thermal expansion (CTE) mismatch induced warpage. The effective chemical shrinkage and the equilibrium modulus are needed for the curing induced warpage prediction. Considering various polymeric materials used in microelectronic packages, unique curing setups and procedures are developed for elastomers (extremely low modulus, medium viscosity, room temperature curing), underfill materials (medium modulus, low viscosity, high temperature curing), and epoxy molding compound (EMC: high modulus, high viscosity, high temperature pressure curing), most notably, (1) zero-constraint mold for elastomers; (2) a two-stage curing procedure for underfill materials and (3) an air-cylinder based novel setup for EMC. For the CTE mismatch induced warpage, the temperature dependent CTE and the comprehensive viscoelastic properties are measured. The cured cylindrical specimen with a FBG sensor embedded in the center is further used for viscoelastic property measurements. A uni-axial compressive loading is applied to the specimen to measure the time dependent Young’s modulus. The test is repeated from room temperature to the reflow temperature to capture the time-temperature dependent Young’s modulus. A separate high pressure system is developed for the bulk modulus measurement. The time temperature dependent bulk modulus is measured at the same temperatures as the Young’s modulus. The master curve of the Young’s modulus and bulk modulus of the EMC is created and a single set of the shift factors is determined from the time temperature superposition. The supplementary experiments are conducted to verify the validity of the assumptions associated with the linear viscoelasticity. The measured time-temperature dependent properties are further verified by a shadow moiré and Twyman/Green test.

Regular homomorphisms of minimal sets

The classification of minimal sets is a central theme in abstract topological dynamics. Recently this work has been strengthened and extended by consideration of homomorphisms. Background material is presented in Chapter I. Given a flow on a compact Hausdorff space, the action extends naturally to the space of closed subsets, taken with the Hausdorff topology. These hyperspaces are discussed and used to give a new characterization of almost periodic homomorphisms. Regular minimal sets may be described as minimal subsets of enveloping semigroups. Regular homomorphisms are defined in Chapter II by extending this notion to homomorphisms with minimal range. Several characterizations are obtained. In Chapter III, some additional results on homomorphisms are obtained by relativizing enveloping semigroup notions. In Veech's paper on point distal flows, hyperspaces are used to associate an almost one-to-one homomorphism with a given homomorphism of metric minimal sets. In Chapter IV, a non-metric generalization of this construction is studied in detail using the new notion of a highly proximal homomorphism. An abstract characterization is obtained, involving only the abstract properties of homomorphisms. A strengthened version of the Veech Structure Theorem for point distal flows is proved. In Chapter V, the work in the earlier chapters is applied to the study of homomorphisms for which the almost periodic elements of the associated hyperspace are all finite. In the metric case, this is equivalent to having at least one fiber finite. Strong results are obtained by first assuming regularity, and then assuming that the relative proximal relation is closed as well.