Multi-Scale Dynamic Study of Secondary Impact During Drop Testing of Surface Mount Packages


Autoria(s): Meng, Jingshi
Contribuinte(s)

Dasgupta, Abhijit

Digital Repository at the University of Maryland

University of Maryland (College Park, Md.)

Mechanical Engineering

Data(s)

22/06/2016

22/06/2016

2016

Resumo

This dissertation focuses on design challenges caused by secondary impacts to printed wiring assemblies (PWAs) within hand-held electronics due to accidental drop or impact loading. The continuing increase of functionality, miniaturization and affordability has resulted in a decrease in the size and weight of handheld electronic products. As a result, PWAs have become thinner and the clearances between surrounding structures have decreased. The resulting increase in flexibility of the PWAs in combination with the reduced clearances requires new design rules to minimize and survive possible internal collisions impacts between PWAs and surrounding structures. Such collisions are being termed ‘secondary impact’ in this study. The effect of secondary impact on board-level drop reliability of printed wiring boards (PWBs) assembled with MEMS microphone components, is investigated using a combination of testing, response and stress analysis, and damage modeling. The response analysis is conducted using a combination of numerical finite element modeling and simplified analytic models for additional parametric sensitivity studies.

Identificador

doi:10.13016/M23208

http://hdl.handle.net/1903/18229

Idioma(s)

en

Palavras-Chave #Mechanical engineering #Damage Modeling #Drop Tests #Electronic Packaging #Reliability #Secondary Impact #Surface Mount
Tipo

Dissertation