Development of heat sink device by using topology optimization

Small scale fluid flow systems have been studied for various applications, such as chemical reagent dosages and cooling devices of compact electronic components. This work proposes to present the complete cycle development of an optimized heat sink designed by using Topology Optimization Method (TOM) for best performance, including minimization of pressure drop in fluid flow and maximization of heat dissipation effects, aiming small scale applications. The TOM is applied to a domain, to obtain an optimized channel topology, according to a given multi-objective function that combines pressure drop minimization and heat transfer maximization. Stokes flow hypothesis is adopted. Moreover, both conduction and forced convection effects are included in the steady-state heat transfer model. The topology optimization procedure combines the Finite Element Method (to carry out the physical analysis) with Sequential Linear Programming (as the optimization algorithm). Two-dimensional topology optimization results of channel layouts obtained for a heat sink design are presented as example to illustrate the design methodology. 3D computational simulations and prototype manufacturing have been carried out to validate the proposed design methodology.

Evaluation of the Inductive Coupling between Equivalent Emission Sources of Components

The electromagnetic interference between electronic systems or between their components influences the overall performance. It is important thus to model these interferences in order to optimize the position of the components of an electronic system. In this paper, a methodology to construct the equivalent model of magnetic field sources is proposed. It is based on the multipole expansion, and it represents the radiated emission of generic structures in a spherical reference frame. Experimental results for different kinds of sources are presented illustrating our method.

Temperature impact on the tunnel fet off-state current components

In this work, the temperature impact on the off-state current components is analyzed through numerical simulation and experimentally. First of all, the band-to-band tunneling is studied by varying the underlap in the channel/drain junction, leading to an analysis of the different off-state current components. For pTFET devices, the best behavior for off-state current was obtained for higher values of underlap (reduced BTBT) and at low temperatures (reduced SRH and TAT). At high temperature, an unexpected off-state current occurred due to the thermal leakage current through the drain/channel junction. Besides, these devices presented a good performance when considering the drain current as a function of the drain voltage, making them suitable for analog applications. (C) 2012 Elsevier Ltd. All rights reserved.

Using Equivalent Emission Sources to Evaluate the Coupling Between Components

The electromagnetic interference between the electronic systems or their components influences the performance of the systems. For that reason, it is important to model these interferences in order to optimize the position of the systems or their components. In this paper, a method is proposed to construct the equivalent emission source models of systems. The proposed method is based on the multipolar expansion by representing the radiated emission of generic structures in a spherical reference (r, theta, phi). Some results are presented illustrating our method.