Bonding of aluminum alloy by hot-dipping tin coating

This paper presents bonding technology of aluminum alloy by hot-dipping tin. The dissolution curve of copper in molten tin liquid was obtained in the experiment of hot-dipping Sn. Optimal hot-dipping parameter which was suitable for soldering was designed. To elucidate characteristics of interfacial evolution, the microstructure of the coatings, soldered joint were analyzed using optical microscopy, SEM and EDX. The shear strength of soldered joints was tested as high as 39.9Mpa, which is high enough to achieve the requirement of electronic industry.

Evolutions of an Online Generation: Education, Industry and IMC

This paper traces the evolutions of a new generation of students who are predominantly the ‘online generation’; explores the emerging impact of this generation on industry; identifies the changing role of education from traditional classroom to an online environment; and explores the contribution related to integrated marketing communications (IMC). Educational requirements from a business perspective must incorporate global business demands; virtual learning environments progress the online generation towards a post-modern learning state. The central proposition of this paper is that the emergence of IMC in evolving industry practices is influenced by student generations who are producing a new paradigm of alignment between education and industry. This is purely a conceptual exploration using limited examples to provide some context and illustrate the questions raised for consideration.