149 resultados para Bonded joints

em Indian Institute of Science - Bangalore - Índia


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The present work focuses on simulation of nonlinear mechanical behaviors of adhesively bonded DLS (double lap shear) joints for variable extension rates and temperatures using the implicit ABAQUS solver. Load-displacement curves of DLS joints at nine combinations of extension rates and environmental temperatures are initially obtained by conducting tensile tests in a UTM. The joint specimens are made from dual phase (DP) steel coupons bonded with a rubber-toughened adhesive. It is shown that the shell-solid model of a DLS joint, in which substrates are modeled with shell elements and adhesive with solid elements, can effectively predict the mechanical behavior of the joint. Exponent Drucker-Prager or Von Mises yield criterion together with nonlinear isotropic hardening is used for the simulation of DLS joint tests. It has been found that at a low temperature (-20 degrees C), both Von Mises and exponent Drucker-Prager criteria give close prediction of experimental load-extension curves. However. at a high temperature (82 degrees C), Von Mises condition tends to yield a perceptibly softer joint behavior, while the corresponding response obtained using exponent Drucker-Prager criterion is much closer to the experimental load-displacement curve.

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An analytical study for the static strength of adhesive lap joints is presented. The earlier solutions of Volkersen [i], DeBruyne[2] and others were limited to linear adhesives. The influence of adhesive non-linearity was first considered by Grimes' et al[3] and Dickson et al [4]. Recently Hart-Smith[5] successfully introduced elastic-plastic behaviour of the adhesive. In the present study the problem is formulated for general non-linear adhesive behaviour and an efficient numerical algorithm is written for the solution. Bilinear and trilinear models for the nonlinearity yield closed form analytical solutions.

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A method of analysis of adhesive bonded joints with arbitrary adherend shapes is developed and applied to their design for efficient load transfer. The formulation of the simplified physical model is essentially one dimensional. An efficient numerical procedure is developed and its applicability is demonstrated. Guide lines are indicated for choosing suitable shape functions.

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Better fatigue performance of adhesively bonded joints makes them suitable for most structural applications. However, predicting the service life of bonded joints accurately remains a challenge. In this present study, nonlinear computational simulations have been performed on adhesively bonded single lap ASTM-D1002 shear joint considering both geometrical and material nonlinearities to predict the fatigue life by judiciously applying the modified Coffin-Manson equation for adhesive joints. Elasto-plastic material models have been employed for both the adhesive and the adherends. The predicted life has close agreement in the high cycle fatigue (HCF) regime with empirical observations reported in the literature. (C) 2010 Elsevier Ltd. All rights reserved.

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This paper presents nonlinear finite element analysis of adhesively bonded joints considering the elastoviscoplastic constitutive model of the adhesive material and the finite rotation of the joint. Though the adherends have been assumed to be linearly elastic, the yielding of the adhesive is represented by a pressure sensitive modified von Mises yield function. The stress-strain relation of the adhesive is represented by the Ramberg-Osgood relation. Geometric nonlinearity due to finite rotation in the joint is accounted for using the Green-Lagrange strain tensor and the second Piola-Kirchhoff stress tensor in a total Lagrangian formulation. Critical time steps have been calculated based on the eigenvalues of the transition matrices of the viscoplastic model of the adhesive. Stability of the viscoplastic solution and time dependent behaviour of the joints are examined. A parametric study has been carried out with particular reference to peel and shear stress along the interface. Critical zones for failure of joints have been identified. The study is of significance in the design of lap joints as well as on the characterization of adhesive strength. (C) 1999 Elsevier Science Ltd. All rights reserved.

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The fatigue de-bond growth studies have been conducted on adhesively bonded lap joint specimens between aluminium and aluminium with Redux-319A adhesive with a pre-defined crack of 3 mm at the bond end. The correlations between fracture parameters and the de-bond growth data are established using both numerical and experimental techniques. In the numerical method, geometrically non-linear finite element analyses were carried out on adhesively bonded joint specimen for various de-bond lengths measured from the lap end along the mid-bond line of the adhesive. The finite element results were post processed to estimate the SERR components G (I) and G (II) using the Modified Virtual Crack Closure Integral (MVCCI) procedure. In experimental work, specimens were fabricated and fatigue de-bond growth tests were conducted at a stress ratio R = -1. The results obtained from both numerical analyses and testing have been used to generate de-bond growth curve and establish de-bond growth law in the Paris regime for such joints. The de-bond growth rate is primarily function of mode-I SERR component G (I) since the rate of growth in shear mode is relatively small. The value of Paris exponent m is found to be 6.55. The high value of de-bond growth exponent in Paris regime is expected, since the adhesive is less ductile than conventional metallic materials. This study is important for estimating the life of adhesively bonded joints under both constant and variable amplitude fatigue loads.

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Experimental and theoretical studies on degradation of composite-epoxy adhesive joints were carried out on samples having different interfacial and cohesive properties. Oblique incidence ultrasonic inspection of bonded joints revealed that degradation in the adhesive can be measured by significant variation in reflection amplitude as also by a shift in the minima of reflection spectrum. It was observed that severe degradation of the adhesive leads to failure dominated by interfacial mode. Through this investigation it is demonstrated that a correlation exists between the bond strength and a frequency shift in reflection minimum. The experimental data was validated using analytical models. Though both bulk adhesive degradation and interfacial degradation influences the shift in spectrum minimum, the contribution of the latter was found to be significant. An inversion algorithm was used to determine the interfacial transverse stiffness using the experimental oblique reflection spectrum. The spectrum shift was found to depend on the value of interfacial transverse stiffness using which a qualitative assessment can be made on the integrity of the joint.

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Structural adhesive bonding is widely used to execute assemblies in automobile and aerospace structures. The quality and reliability of these bonded joints must be ensured during service. In this context non destructive evaluation of these bonded structures play an important role. Evaluation of adhesively bonded composite single lap shear joints has been attempted through experimental approach. Series of tests, non-destructive as well as destructive were performed on different sets of carbon fiber reinforced polymer (CFRP) composite lap joint specimens with varied bond quality. Details of the experimental investigations carried out and the outcome are presented in this paper.

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A wavelet spectral finite element (WSFE) model is developed for studying transient dynamics and wave propagation in adhesively bonded composite joints. The adherands are formulated as shear deformable beams using the first order shear deformation theory (FSDT) to obtain accurate results for high frequency wave propagation. Equations of motion governing wave motion in the bonded beams are derived using Hamilton's principle. The adhesive layer is modeled as a line of continuously distributed tension/compression and shear springs. Daubechies compactly supported wavelet scaling functions are used to transform the governing partial differential equations from time domain to frequency domain. The dynamic stiffness matrix is derived under the spectral finite element framework relating the nodal forces and displacements in the transformed frequency domain. Time domain results for wave propagation in a lap joint are validated with conventional finite element simulations using Abaqus. Frequency domain spectrum and dispersion relation results are presented and discussed. The developed WSFE model yields efficient and accurate analysis of wave propagation in adhesively-bonded composite joints. (C) 2014 Elsevier Ltd. All rights reserved.

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The use of relatively low modulus adhesive at the ends of overlap in a bi-adhesive bondline of a bonded joint can reduce the stress concentration significantly and, therefore, potentially lead to higher strength of the joint. This study presents the two-dimensional and three-dimensional nonlinear (geometric and material) finite element analyses of adhesively bonded single lap joints having modulus-graded bondline under monotonic loading conditions. The adhesives were modelled as an elasto-plastic multi-linear material, while the substrates were regarded as both linear elastic and bi-linear elasto-plastic material. The computational simulations have been performed to investigate the bondline behaviour by studying the stress and strain distributions both at the mid-plane as well as at the interface of the bondline. It has been observed that the static strength is higher for joints with bi-adhesive bondlines compared to those with single adhesives in bondline. Higher joint strength has also been observed for optimum bi-adhesive bondline ratio through parametric studies. Effects of load level, and bondline thickness on stress distribution in the bi-adhesive bondline have also been studied. 3D analysis results reveal the existence of complex multi-axial stress/strain state at the ends of the overlap in the bondline which cannot be observed in 2D plane strain analysis. About 1/3rd of the width of the joint from the free edge in the width direction has 3D stress state, especially in the compliant adhesive of the bondline. Magnitudes of longitudinal and lateral stress/strain components are comparable to peel stress/strain components. It has also been analytically shown that the in-plane global stiffness of the joint remains unaffected by modulus gradation of the bondline adhesive. (C) Koninklijke Brill NV, Leiden, 2010.

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The assembly of aerospace and automotive structures in recent years is increasingly carried out using adhesives. Adhesive joints have advantages of uniform stress distribution and less stress concentration in the bonded region. Nevertheless, they may suffer due to the presence of defects in bond line and at the interface or due to improper curing process. While defects like voids, cracks and delaminations present in the adhesive bond line may be detected using different NDE methods, interfacial defects in the form of kissing bond may go undetected. Attempts using advanced ultrasonic methods like nonlinear ultrasound and guided wave inspection to detect kissing bond have met with limited success stressing the need for alternate methods. This paper concerns the preliminary studies carried out on detectability of dry contact kissing bonds in adhesive joints using the Digital Image Correlation (DIC) technique. In this attempt, adhesive joint samples containing varied area of kissing bond were prepared using the glass fiber reinforced composite (GFRP) as substrates and epoxy resin as the adhesive layer joining them. The samples were also subjected to conventional and high power ultrasonic inspection. Further, these samples were loaded till failure to determine the bond strength during which digital images were recorded and analyzed using the DIC method. This noncontact method could indicate the existence of kissing bonds at less than 50% failure load. Finite element studies carried out showed a similar trend. Results obtained from these preliminary studies are encouraging and further tests need to be done on a larger set of samples to study experimental uncertainties and scatter associated with the method. (C) 2013 Elsevier Ltd. All rights reserved.

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The demand for energy efficient, low weight structures has boosted the use of composite structures assembled using increased quantities of structural adhesives. Bonded structures may be subjected to severe working environments such as high temperature and moisture due to which the adhesive gets degraded over a period of time. This reduces the strength of a joint and leads to premature failure. Measurement of strains in the adhesive bondline at any point of time during service may be beneficial as an assessment can be made on the integrity of a joint and necessary preventive actions may be taken before failure. This paper presents an experimental approach of measuring peel and shear strains in the adhesive bondline of composite single-lap joints using digital image correlation. Different sets of composite adhesive joints with varied bond quality were prepared and subjected to tensile load during which digital images were taken and processed using digital image correlation software. The measured peel strain at the joint edge showed a rapid increase with the initiation of a crack till failure of the joint. The measured strains were used to compute the corresponding stresses assuming a plane strain condition and the results were compared with stresses predicted using theoretical models, namely linear and nonlinear adhesive beam models. A similar trend in stress distribution was observed. Further comparison of peel and shear strains also exhibited similar trend for both healthy and degraded joints. Maximum peel stress failure criterion was used to predict the failure load of a composite adhesive joint and a comparison was made between predicted and actual failure loads. The predicted failure loads from theoretical models were found to be higher than the actual failure load for all the joints.

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Three aspects of crystal engineering in molecular crystals are presented to emphasize the role of intermolecular interactions and factors influencing crystal packing. Hydrogen bonded tartrate-amine complexes have been analyzed with the propensity for formation of multidirectional hydrogen bonding as a key design element in the generation of materials for second harmonic generation (SHG). The invariance of the framework in DBT and its possible implications on SHG is outlined. The role of Fluorine in orienting molecules of coumarins, styrylcoumarins and butadienes for photodimerization is described with particular emphasis on its steering capability. Usage of coumarin as an design element for the generation of polymorphs of substituted styrylcoumarins is examined with specific examples.

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Joints are primary sources of weakness in structures. Pin joints are very common and are used where periodic disassembly of components is needed. A circular pin in a circular hole in an infinitely large plate is an abstraction of such a pin joint. A two-dimensional plane-stress analysis of such a configuration is carried out, here, subjected to pin-bearing and/or biaxial-plate loading. The pin is assumed to be rigid compared to the plate material. For pin load the reactive stresses at the edges of the infinite plate tend to zero though their integral over the external boundary equals to the pin load. The pin-hole interface is unbonded and so beyond some load levels the plate separates from the pin and the extent of separation is a non-linear function of load level. The problem is solved by inverse technique where the extent of contact is specified and the causative loads are evaluated directly. In the situations where combined load is acting the separation-contact zone specification generally needs two parameters (angles) to be specified. The present report deals with analysing such a situation in metallic (or isotropic) plates. Numerical results are provided for parametric representation and the methodology is demonstrated.