Discussion: Remoulded shear strength at plastic and semi-solid states

The undrained shear strength of remoulded soils is of great concern in geotechnical engineering applications. This study aims to develop a reliable approach for determining the undrained shear strength of remoulded fine-grained soils, through the use of index test results, at both the plastic and semi-solid states of consistency. Experimental investigation and subsequent analysis involving a number of fine-grained soils of widely varying plasticity and geological origin have led to a two-parameter linear model of the relationship between logarithm of remoulded undrained shear strength and liquidity index. The numerical values of the parameters are found to be dependent to a lesser extent on the soil group and to a greater extent on the soil state. Based on the values of regression coefficient, ranking index and ranking distance, it seems that the relationship represents the experimental results well. It may be pointed out that the possibility of such a relationship in the semi-solid state of a soil has not been explored in the past. It is also shown that the shear strength at the plastic limit is about 32–34 times that at the liquid limit.

Discussion of ``Atterberg Limits and Remolded Shear Strength-Water Content Relationships''

The present discussion tries to bring out the importance of clay mineralogical composition of fine-grained soils on their liquid limit behaviour. It reinforces the author's observation that the undrained shear strengths at liquid limit water content and at plastic limit water content are not unique.

Maze solving automatons for self-healing of open interconnects: Modular add-on for circuit boards

We present the circuit board integration of a self-healing mechanism to repair open faults. The electric field driven mechanism physically restores fractured interconnects in electronic circuits and has the ability to solve mazes. The repair is performed by conductive particles dispersed in an insulating fluid. We demonstrate the integration of the healing module onto printed circuit boards and the ability of maze solving. We model and perform experiments on the influence of the geometry of conductive particles as well as the terminal impedances of the route on the healing efficiency. The typical heal rate is 10 mu m/s with healed route having mean resistance of 8 k Omega across a 200 micron gap and depending on the materials and concentrations used. (C) 2015 AIP Publishing LLC.