Maze solving automatons for self-healing of open interconnects: Modular add-on for circuit boards
Data(s) |
2015
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Resumo |
We present the circuit board integration of a self-healing mechanism to repair open faults. The electric field driven mechanism physically restores fractured interconnects in electronic circuits and has the ability to solve mazes. The repair is performed by conductive particles dispersed in an insulating fluid. We demonstrate the integration of the healing module onto printed circuit boards and the ability of maze solving. We model and perform experiments on the influence of the geometry of conductive particles as well as the terminal impedances of the route on the healing efficiency. The typical heal rate is 10 mu m/s with healed route having mean resistance of 8 k Omega across a 200 micron gap and depending on the materials and concentrations used. (C) 2015 AIP Publishing LLC. |
Formato |
application/pdf |
Identificador |
http://eprints.iisc.ernet.in/51436/1/app_phy_let-106_12_2015.pdf Nair, Aswathi and Raghunandan, Karthik and Yaswant, Vaddi and Pillai, Sreelal S and Sambandan, Sanjiv (2015) Maze solving automatons for self-healing of open interconnects: Modular add-on for circuit boards. In: APPLIED PHYSICS LETTERS, 106 (12). |
Publicador |
AMER INST PHYSICS |
Relação |
http://dx.doi.org/10.1063/1.4916513 http://eprints.iisc.ernet.in/51436/ |
Palavras-Chave | #Instrumentation and Applied Physics (Formally ISU) |
Tipo |
Journal Article PeerReviewed |