Micromachined silicon lenses for terahertz applications

Silicon microlenses are a very important tool for coupling terahertz (THz) radiation into antennas and detectors in integrated circuits. They can be used in a large array structures at this frequency range reducing considerably the crosstalk between the pixels. Drops of photoresist have been deposited and their shape transferred into the silicon by means of a Reactive Ion Etching (RIE) process. Large silicon lenses with a few mm diameter (between 1.5 and 4.5 mm) and hundreds of μm height (between 50 and 350 μm) have been fabricated. The surface of such lenses has been characterized using Scanning Electron Microscopy (SEM) and Atomic Force Microscopy (AFM), resulting in a surface roughness of about ∼3 μm, good enough for any THz application. The beam profile at the focal plane of such lenses has been measured at a wavelength of 10.6 μm using a tomographic knife-edge technique and a CO2 laser.

A Study of the Robustness Against SEUs of Digital Circuits Implemented with FPGA DSPs

In this paper we present an experimental validation of the reliability increase of digital circuits implemented in XilinxTMFPGAs when they are implemented using the DSPs (Digital Signal Processors) that are available in the reconfigurable device. For this purpose, we have used a fault-injection platform developed by our research group, NESSY [1]. The presented experiments demonstrate that the probability of occurrence of a SEU effect is similar both in the circuits implemented with and without using embedded DSPs. However, the former are more efficient in terms of area usage, which leads to a decrease in the probability of a SEU occurrence.