Solderjet bumping technique used to manufacture a compact and robust green solid-state laser

Solder-joining using metallic solder alloys is an alternative to adhesive bonding. Laser-based soldering processes are especially well suited for the joining of optical components made of fragile and brittle materials such as glasses, ceramics and optical crystals due to a localized and minimized input of thermal energy. The Solderjet Bumping technique is used to assemble a miniaturized laser resonator in order to obtain higher robustness, wider thermal conductivity performance, higher vacuum and radiation compatibility, and better heat and long term stability compared with identical glued devices. The resulting assembled compact and robust green diode-pumped solid-state laser is part of the future Raman Laser Spectrometer designed for the Exomars European Space Agency (ESA) space mission 2018.

A functional representation of almost isometries

For each quasi-metric space X we consider the convex lattice SLip(1)(X) of all semi-Lipschitz functions on X with semi-Lipschitz constant not greater than 1. If X and Y are two complete quasi-metric spaces, we prove that every convex lattice isomorphism T from SLip(1)(Y) onto SLip(1)(X) can be written in the form Tf = c . (f o tau) + phi, where tau is an isometry, c > 0 and phi is an element of SLip(1)(X). As a consequence, we obtain that two complete quasi-metric spaces are almost isometric if, and only if, there exists an almost-unital convex lattice isomorphism between SLip(1)(X) and SLip(1) (Y).