265 resultados para laser driver circuit

em Chinese Academy of Sciences Institutional Repositories Grid Portal


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622Mbits/s free space laser communication system is developed. IT's communication rate is 622Mbits/s. The whole system include three parts which are signal in and out circuit laser driver and receive circuit and optical antenna The communication principle is introduced The experiment result shows that the transmission of data and image are satisfied with demands of design. It have a definite market value.

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This paper describes the design process and performance of the optimized parallel optical transmission module. Based on 1x12 VCSEL (Vertical Cavity Surface Emitting Laser) array, we designed and fabricated the high speed parallel optical modules. Our parallel optical module contains a 1x12 VCSEL array, a 12 channel CMOS laser driver circuit, a high speed PCB (Printed Circuit Board), a MT fiber connector and a packaging housing. The L-I-V characteristics of the 850nm VCSEL was measured at the operating current 8mA, 3dB frequency bandwidth more than 3GHz and the optical output 1mW. The transmission rate of all 12 channels is 30Gbit/s, with a single channel 2.5Gbit/s. By adopting the integration of the 1x12 VCSEL array and the driver array, we make a high speed PCB (Printed Circuit Board) to provide the optoelectronic chip with the operating voltage and high speed signals current. The LVDS (Low-Voltage Differential Signals) was set as the input signal to achieve better high frequency performance. The active coupling was adopted with a MT connector (8 degrees slant fiber array). We used the Small Form Factor Pluggable (SFP) packaging. With the edge connector, the module could be inserted into the system dispense with bonding process.

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基于目前国内规模最大的激光驱动器——“神光Ⅱ”八路基频光已经实现功率平衡运行,通过改变其中若干路三倍频系统各调谐量的偏离,对输出三倍频波形进行束与束之间的横向对比研究.研究发现,对于Ⅱ类-Ⅱ类偏振失配三倍频系统,在影响转换效率的三个调谐量中,偏振分配角失配△θp,对三倍频波形影响最大;在入射基频功率密度约为1.0GW/cm^2情况下,当三倍频系统三个调谐量都处在最佳匹配时,三倍频波形半峰全宽τ最小。研究工作为最终实现“神光Ⅱ”八路光束三倍频功率平衡输出提供了晶体调试的方法。

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利用二维光谱色散平滑技术和透镜列阵(LA)来改善激光驱动器中靶面的辐照均匀性。通过消衍射透镜列阵可得到包络陡峭且中小空间尺度均匀性较好的焦斑。当在光路中加入二维光谱色散平滑单元后,光束在两个互相垂直的方向发生光谱色散,多光束干涉所引起的细密条纹也将在很大程度上被抹平,如果把横向热传导平滑效应也考虑在内,高空间频率的强度波动可进一步被消除。二维理论模拟结果表明采用该方案可获得顶部平坦边缘陡峭的焦斑,而且该方案无需仔细调整靶面的位置,实际应用较方便。

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用数值方法研究了激光驱动器系统中使用光谱色散平滑单元后光束的衍射特性、模拟结果表明,光谱色散会使光束衍射光斑变大,近场空间强度均匀性改善,而远场光斑内部存在光强接近于均匀分布的区域.进一步分析了光谱色散平滑单元中相位调制器的调制深度、调制频率及光栅色散系数等主要元件参数对光束传输特性的影响,发现在一定情况下光斑内部会出现较强的强度调制。

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In this letter, the power spectrum of a cooled distributed feedback laser module is measured using the self-heterodyne technique. Periodical oscillation peaks have been observed in the measurement. Further investigation shows that the additional modulation signal is coupled from the thermal electric cooler (TEC) controller to the laser driver, and then applied to the laser diode. The additional modulation can be eliminated by properly isolating the laser driving source from the TEC controller.

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目的利用单片机技术设计多路温度测控系统,实现多路温度的测量和控制.方法系统以单片机AT89C52为核心,利用多路转换器和新型数字器件MAX6675构成8路K型热电偶温度测量电路,利用D/A转换器AD7528和驱动电路构成输出电路,实现8路一一对应的闭环温度测量控制.系统软件采用PID控制器.结果实践证明,可根据需要增减系统温度信号采样通道的数目,使用软件抗干扰措施,提高了采样数据的可靠性.简化了输入输出硬件结构,使系统具有低成本高速度和较好的测量控制精度.结论多路温度测控系统作为整机适用于现场测量控制应用,也可作为多路温度控制模块应用在体积小、温度测量精度要求较高的大型系统中.

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We reported here a novel technique for laser high speed drillings on Printed Circuit Boards (PCBs). A CNC solid laser based system is developed to drill through and blind vias as an alternative to mechanical drilling. The system employs an Acousto-Optic Q-switched Nd: YAG laser, a computer control system and an X-Y moving table which can handle up to 400 x 400 mm PCB. With a special designed cavity the laser system works in a pulsed operation in order to generate pulses with width down to 0.5 mu s and maximum peak power over 10kW at 10k repetition rate. Delivered by an improved optical beam transforming system, the focused laser beam can drill hobs including blind vias on PCBs with diameter in the range of 0.1 - 0.4 mm and at up to 300 - 500 vias per second (depending on the construction of PCBs). By means of a CNC X-Y moving system, laser pulses with pulse-to-pulse superior repeatability can be fired at desired location on a PCBs with high accuracy. This alternative technology for drilling through or blind vias on PCBs or PWBs (printed wiring boards) will obviously enhance the capability to printed boards manufacturing.

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The characteristics of backward harmonic radiation due to electron oscillations driven by a linearly polarized fs laser pulse are analysed considering a single electron model. The spectral distributions of the electron's backward harmonic radiation are investigated in detail for different parameters of the driver laser pulse. Higher order harmonic radiations are possible for a sufficiently intense driving laser pulse. We have shown that for a realistic pulsed photon beam, the spectrum of the radiation is red shifted as well as broadened because of changes in the longitudinal velocity of the electrons during the laser pulse. These effects are more pronounced at higher laser intensities giving rise to higher order harmonics that eventually leads to a continuous spectrum. Numerical simulations have further shown that by increasing the laser pulse width the broadening of the high harmonic radiations can be controlled.

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A new method of frequency-shifting for a diode laser is realized. Using a sample-and-hold circuit, the error signal can be held by the circuit during frequency shifting. It can avoid the restraint of locking or even lock-losing caused by the servo circuit when we input a step-up voltage into piezoelectric transition (PZT) to achieve laser frequency-shifting.

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Based on the high frequency techniques such as frequency response measurement, equivalent circuit modeling and packaging parasitics compensation, a comprehensive optimization method for packaging high-speed semiconductor laser module is presented in this paper. The experiments show that the small-signal magnitude frequency response of the TO packaged laser module is superior to that of laser diode in frequencies, and the in-band flatness and the phase-frequency linearity are also improved significantly.

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Two simple methods for estimating the potential modulation bandwidth of TO packaging technique are presented. The first method is based upon the comparison of the measured frequency responses of the laser diodes and the TO laser modules, and the second is from the equivalent circuit for the test fixture, the TO header, the submount and the bonding wire. It is shown that the TO packaging techniques used in the experiments can potentially achieve a frequency bandwidth of over 10.5 GHz, and the two proposed methods give similar results.

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A new method of analyzing the chirp characteristics of directly modulated lasers and integrated laser-modulators is presented in this paper. Phase-circuit has been introduced into the circuit model of distributed feedback (DFB) lasers in the analysis. Therefore, the chirp characteristics of the device can be obtained by simulating the modified circuit model. The simulation results agree well with the published data. Furthermore, this modified model is combined with the circuit model of electroabsorption (EA) modulators to simulate the chirp characteristics of the monolithic integration of a DFB laser and an EA modulator. The simulation is focused on the dependence of the frequency chirp of the integrated device on the isolation resistance between laser and modulator. Much lower chirp can be seen in the integrated lightwave source compared to the directly modulated laser.