Overall optimization of high-speed semiconductor laser modules


Autoria(s): Liu Y (Liu Yu); Chen SF (Chen ShuoFu); Wang X (Wang Xin); Yuan HQ (Yuan HaiQing); Liang X (Liang, Xie); Zhu NH (Zhu NingHua)
Data(s)

2009

Resumo

Based on the high frequency techniques such as frequency response measurement, equivalent circuit modeling and packaging parasitics compensation, a comprehensive optimization method for packaging high-speed semiconductor laser module is presented in this paper. The experiments show that the small-signal magnitude frequency response of the TO packaged laser module is superior to that of laser diode in frequencies, and the in-band flatness and the phase-frequency linearity are also improved significantly.

National Natural Science Foundation of China 60820106004 60536010606060196077702960837001National High Technology Research and Development Program of China 2009AA03Z409 Major International Cooperation Projects of China 2006dfa11880

Identificador

http://ir.semi.ac.cn/handle/172111/7569

http://www.irgrid.ac.cn/handle/1471x/63521

Idioma(s)

英语

Fonte

Liu, Y (Liu Yu); Chen, SF (Chen ShuoFu); Wang, X (Wang Xin); Yuan, HQ (Yuan HaiQing); Liang, X (Liang, Xie); Zhu, NH (Zhu NingHua) .Overall optimization of high-speed semiconductor laser modules ,CHINESE SCIENCE BULLETIN ,OCT 2009 ,54(20):3697-3703

Palavras-Chave #光电子学 #optimization design
Tipo

期刊论文