Enhancements of the simulation method on the edge effect in resin transfer molding processes

In resin transfer molding processes, small clearances exist between the fiber preform and the mold edges, which result in a preferential resin flow in the edge channel and then disrupt the flow patterns during the mold filling stage. A mathematical model including the effect of cavity thickness on resin flow was developed for flow behavior involving the interface between an edge channel and a porous medium. According to the mathematical analysis of momentum equations in a fully developed rectangular duct and formulations of the equivalent edge permeability, comparing with three-dimensional Navier-Stokes equations, the governing equations were modified in the edge channel. The volume of fluid (VOF) method was applied to track the flow front. A simple case is numerically simulated using the modified governing equations. The effects of edge channel width and cavity thickness on flow front and inlet pressure are analyzed, and the evolution characteristics of simulated results are in agreement with the experimental results. (c) 2007 Elsevier B.V. All rights reserved

Reactive Mold Filling in Resin Transfer Molding Processes with Edge Effects

Reactive mold filling is one of the important stages in resin transfer molding processes, in which resin curing and edge effects are important characteristics. On the basis of previous work, volume-averaging momentum equations involving viscous and inertia terms were adopted to describe the resin flow in fiber preform, and modified governing equations derived from the Navier-Stokes equations are introduced to describe the resin flow in the edge channel. A dual-Arrhenius viscosity model is newly introduced to describe the chemorheological behavior of a modified bismaleimide resin. The influence of the curing reaction and processing parameters on the resin flow patterns was investigated.

Mesoscopic simulation of the impregnating process of unidirectional fibrous preform in resin transfer molding

The resin transfer molding has gained popularity in the preparation of fiber-reinforced polymer-matrix composites because of its high efficiency and low pollution. The non-uniform inter-tow and intra-tow flows are regarded as the reason of void formation in RTM. According to the process characteristics, the axisymmetric model was developed to study the interaction between the flow in the inter-tow space and that in the intra-tow space. The flow behavior inside the fiber tows was formulated using Brinkman's equation, while that in the open space around the fiber tows was formulated by Stokes' equation. The volume of fluid (VOF) method was applied to track the flow front, and the effects of filling velocity, resin viscosity, inter-tow dimension and intra-tow permeability on fluid pressure and flow front were analyzed. The results show that the flow front difference between the inter-tow and intra-tow becomes larger with the decrease of intra-tow permeability, as well as the increase of filling velocity and inter-tow dimension.

A new method for fabrication of three-dimensional polymer micropatterning - Microtransfer molding

Microtransfer molding (muTM) is a kind of soft lithography for polymer micropatterning. In muTM, a liquid prepolymer(or concentrated polymer solution) is applied to the patterned surface of an elastomeric mold and then brought into the contact with a substrate. After prepolymer is cured thermally or by UV light, the elastomeric mold is peeled away. A pattern is left on the surface of the substrate. In this study, similar to300 nm lines and three-dimensional patterns of PMMA and epoxy on planar and/or non-planar substrates are realized.

Study on thermodynamic properties of polypyromellitimide molding powder

Polypyromellitimide molding powder has been prepared. In the 78-370 K range, the dependence of the specific heat capacity (c(p)) on the temperature (T) is given by the polynomial: c(p)=0.8163+0.4592X+0.02468X(2)+0.1192X(3)+0.05659X(4) (J K-1 g(-1)) where X=(T-225.5)/144.5. Thermal decomposition in air starts at 716 K, and is complete at 1034 K. The standard combustion enthalpy is Delta(c)H=-26.442 kJ g(-1). (C) 2000 Elsevier Science B.V. All rights reserved.

Nd：Y3Sc（1．5）Al（3．5）O（12）透明陶瓷的光谱性能以及激光输出

采用燃烧法制备了Nd：YSAG粉体,经过成型、素烧,最终在氢气气氛中烧结制备了Nd：YSAG透明陶瓷.测试结果表明,Nd：YSAG透明陶瓷具有荧光谱线较宽,荧光寿命较长的特点.激光实验得到的激光输出,斜率效率为23.6%,输出功率为0.36W,输出激光的谱线分布较宽.

The nanocomposite scaffold of poly(lactide-co-glycolide) and hydroxyapatite surface-grafted with L-lactic acid oligomer for bone repair

Nanohydroxyapatite (op-HA) surface-modified with L-lactic acid oligomer (LAc oligomer) was prepared by LAc oligomer grafted onto the hydroxyapatite (HA) surface. The nanocomposite of op-HA/PLGA with different op-HA contents of 5, 10, 20 and 40 wt.% in the composite was fabricated into three-dimensional scaffolds by the melt-molding and particulate leaching methods. PLGA and the nanocomposite of HA/PLGA with 10 wt.% of ungrafted hydroxyapatite were used as the controls. The scaffolds were highly porous with evenly distributed and interconnected pore structures, and the porosity was around 90%. Besides the macropores of 100-300 mu m created by the leaching of NaCl particles, the micropores (1-50 mu m) in the pore walls increased with increasing content of op-HA in the composites of op-HA/PLGA. The op-HA particles could disperse more uniformly than those of pure HA in PLGA matrix. The 20 wt.% op-HA/PLGA sample exhibited the maximum mechanical strength, including bending strength (4.14 MPa) and compressive strength (2.31 MPa). The cell viability and the areas of the attached osteoblasts on the films of 10 wt.% op-HA/PLGA and 20 wt.% op-HA/PLGA were evidently higher than those on the other composites.

Studies on Mechanical Properties of Full-Biodegradable Starch-PVA-Polyester Films

A kind of full-biodegradable film material is discussed in this article. The film material is composed of starch, PVA, degradable polyesters(PHB, PHB-V, PCL) with built plasticizer, a cross-linking reinforcing agent and a wet strengthening agent. It contains a high percentage of starch, costs cheap and is excellent in weather fastness, temperature resistance and waterproof and it could be completely biodegraded. The present paper deals mainly with a new technical route using a new type of electromagnetic dynamic blow molding extruder and some effects on mechanical properties of the system.

Sol-gel fabrication, patterning and photoluminescent properties of LaPO4 : Ce3+, Tb3+ nanocrystalline thin films

Ce3+ and/or Tb3+-doped LaPO4 nanocrystalline thin films and their patterning were fabricated by a sol-gel process combined with soft lithography on silicon and quartz glass substrates. The results of XRD indicated that the films began to crystallize at 700 degreesC. The 1000 degreesC annealed single layer films are transparent by eyes, uniform and crack-free with a thickness of about 200 nm and an average grain size of 100 nm. Patterned thin film with different band widths (5-50 mum) were obtained by micro-molding in capillaries technique. The luminescence and energy transfer properties of Ce3+ and Tb3+ were studied in LaPO4 films.

Patterning and luminescent properties of nanocrystallineY(2)O(3): Eu3+ phosphor films by sol-gel soft lithography

Nanocrystalline Y2O3:Eu3+ phosphor films and their patterning were fabricated by a Pechini sol-gel process combined with a soft lithography. X-ray diffraction (XRD), thermogravimetric and differential thermal analysis (TG-DTA), atomic force microscopy (AFM), optical microscopy, UV/vis transmission and photoluminescence (PL) spectra as well as lifetimes were used to characterize the resulting films. The results of XRD indicated that the films began to crystallize at 500 degreesC and the crystallinity increased with the elevation of annealing temperatures. Uniform and crack free non-patterned phosphor films were obtained, which mainly consisted of grains with an average size of 70 nm. Using micro-molding in capillaries technique, we obtained homogeneous and defects-free patterned gel and crystalline phosphor films with different stripe widths (5, 10, 20 and 50 mum). Significant shrinkage (50%) was observed in the patterned films during the heat treatment process. The doped Eu3+ showed its characteristic emission in crystalline Y2O3 phosphor films due to an efficient energy transfer from Y2O3 host to them. Both the lifetimes and PL intensity of the Eu3+ increased with increasing the annealing temperature from 500 to 900 degreesC, and the optimum concentrations for Eu3+ were determined to be 5 mol%.

Preparation, patterning and luminescent properties of nanocrystalline Gd2O3 : A (A = Eu3+, Dy3+, Sm3+, Er3+) phosphor films via Pechini sol-gel soft lithography

Nanocrystalline Gd2O3:A (A = Eu3+, Dy3+, Sm3+, Er3+) phosphor films and their patterning were fabricated by a Pechini sol-gel process combined with a soft lithography. X-ray diffraction (XRD), atomic force microscopy (AFM), scanning electron microscopy (SEM) and optical microscopy, UV/vis transmission and photoluminescence (PL) spectra as well as lifetimes were used to characterize the resulting films. The results of XRD indicated that the films began to crystallize at 500 degreesC and that the crystallinity increased with the elevation of annealing temperatures. Uniform and crack free non-patterned phosphor films were obtained by optimizing the composition of the coating sol, which mainly consisted of grains with an average size of 70 nm and a thickness of 550 nm. Using micro-molding in capillaries technique, we obtained homogeneous and defects-free patterned gel and crystalline phosphor films with different stripe widths (5, 10, 20 and 50 mum). Significant shrinkage (50%) was observed in the patterned films during the heat treatment process. The doped rare earth ions (A) showed their characteristic emission in crystalline Gd2O3 phosphor films due to an efficient energy transfer from Gd2O3 host to them. Both the lifetimes and PL intensity of the rare earth ions increased with increasing the annealing temperature from 500 to 900 degreesC, and the optimum concentrations for Eu3+, Dy3+, sm(3+), Er3+ were determined to be 5, 0.25, 1 and 1.5 mol% of Gd3+ in Gd2O3 films, respectively.

Embossing of polymers using a thermosetting polymer mold made by soft lithography

In this article we present a mechanical pattern transfer process where a thermosetting polymer mold instead of a metal, dielectric, ceramic, or semiconductor master made by conventional lithography was used as the master to pattern thermoplastic polymers in hot embossing lithography. The thermosetting polymer mold was fabricated by a soft lithography strategy, microtransfer molding. For comparison, the thermosetting polymer mold and the silicon wafer master were both used to imprint the thermoplastic polymer, polymethylmethacrylate. Replication of the thermosetting polymer mold and the silicon wafer master was of the same quality. This indicates that the thermosetting polymer mold could be used for thermoplastic polymer patterning in hot embossing lithography with high fidelity.