Lapping technique of InP single crystal wafer

The wafer processing of Indium Phosphide (InP) is so important that it is getting more and more attentions. Lapping is a basic step just following the ingot cutting. In this paper, the influences of various processing parameters on the lapped wafer quality and lapping rate have been checked, the double-crystal X-ray diffraction results about lapped wafers also were presented here. According to the experimental results, the optimum lapping conditions have been obtained.

磨料流在离心研磨过程中运动特征的数值模拟

用液固两相流体动力学的方法对离心研磨过程中磨料流的运动特征进行数值模拟，得出磨料流运动的动态结果，并与高速摄影实验结果进行对比，指出计算机数值模拟结果对研磨机的设计和研磨工艺参数的选择具有实际的指导意义。该方法经济简捷，可以代替大量的工艺实验实现对离心研磨技术参数的优化，从而提高生产效率。