49 resultados para Plasma processing and deposition


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The usual plasma spraying methods often involve entrainment of the surrounding air into the turbulent plasma core and result in coated materials having relatively high porosity and low adhesive strength. Therefore, exploration of new plasma spraying methods for fabricating high quality coatings to meet the requirement of special applications will be quite important. In this study, an alternative plasma spraying method, i.e. the low-pressure laminar plasma spraying process, is investigated and used in an attempt for spraying thermal barrier coatings (TBCs). Investigations on the characteristics of the laminar plasma jets, feeding methods for the ceramic powder and the formation process of the individual quenched splats have been carried out. The properties of the TBCs sprayed by laminar plasma jet process, such as the adhesive strength at the interface of the ceramic coating/bond coat, the surface roughness and microstructure, are examined by tensile tests and scanning electron microscope (SEM) observations.

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To heteroepitaxally grow the crystalline cubic-GaN (c-GaN) film on the substrates with large lattice mismatch is basically important for fabricating the blue or ultraviolet laser diodes based on cubic group III nitride materials. We have obtained the crystalline c-GaN film and the heteroepitaxial interface between c-Gan and GaAs (001) substrate by the ECR Plasma-Assisted Metal Organic Chemical Vapor Deposition (PA-MOCVD) under low-pressure and low-temperature (similar to600degreesC) on a homemade ECR-plasma Semiconductor Processing Device (ESPD). In order to decrease the growth temperature, the ECR plasma source was adopted as the activated nitrogen source, therefore the working pressure of MOCVD was decreased down to the region less than 1 Pa. To eliminate the damages from energetic ions of current plasma source, a Multi-cusp cavity,coupling ECR Plasma source (MEP) was selected to use in our experiment. To decrease the strain and dislocations induced from the large lattice mismatch between c-GaN and GaAs substrate, the plasma pretreatment procedure i.e., the initial growth technique was investigated The experiment arrangements, the characteristics of plasma and the growth procedure, the characteristics on-GaN film and interface between c-GaN and GaAs(001), and the roles of ECR plasma are described in this contribution.

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In this paper, hydrophilic microporous cellulose nitrate membranes have been surface-modified by plasma polymerization of octafluorocyclobutane (OFCB). The microporous composite membranes with a hydrophilic layer sandwiched between two hydrophobic layers have been obtained. The obtained composite membranes have been used in a membrane distillation (MD) process and have exhibited good performance. The effects of polymerization conditions, such as glow-discharge power and deposition time, on the structures and MD performances of the obtained composite membranes have been investigated by SEM, X-ray microscopical analysis, and XPS. The polymerization conditions should be as mild as possible in order to prepare the hydrophobic composite membrane with good MD performance. The typical MD behaviors of the obtained hydrophobic composite membranes are in agreement with that of hydrophobic membranes directly prepared from hydrophobic polymeric materials, like PVDF, PTFE, or PP.

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Modeling study is performed to compare the flow and heat transfer characteristics of laminar and turbulent argon thermal-plasma jets impinging normally upon a flat plate in ambient air. The combined-diffusion-coefficient method and the turbulence-enhanced combined-diffusion-coefficient method are employed to treat the diffusion of argon in the argon-air mixture for the laminar and the turbulent cases, respectively. Modeling results presented include the flow, temperature and argon concentration fields, the air mass flow-rates entrained into the impinging plasma jets, and the distributions of the heat flux density on the plate surface. It is found that the formation of a radial wall jet on the plate surface appreciably enhances the mass flow rate of the ambient air entrained into the laminar or turbulent plasma impinging-jet. When the plate standoff distance is comparatively small, there exists a significant difference between the laminar and turbulent plasma impinging-jets in their flow fields due to the occurrence of a large closed recirculation vortex in the turbulent plasma impinging-jet, and no appreciable difference is found between the two types of jets in their maximum values and distributions of the heat flux density at the plate surface. At larger plate standoff distances, the effect of the plate on the jet flow fields only appears in the region near the plate, and the axial decaying-rates of the plasma temperature, axial velocity and argon mass fraction along the axis of the laminar plasma impinging-jet become appreciably less than their turbulent counterparts.

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Modeling study is performed to reveal the special features of the entrainment of ambient air into subsonic laminar and turbulent argon plasma jets. Two different types of jet flows are considered, i.e., the argon plasma jet is impinging normally upon a flat substrate located in atmospheric air surroundings or is freely issuing into the ambient air. It is found that the existence of the substrate not only changes the plasma temperature, velocity and species concentration distributions in the near-substrate region, but also significantly enhances the mass flow rate of the ambient air entrained into the jet due to the additional contribution to the gas entrainment of the wall jet formed along the substrate surface. The fraction of the additional entrainment of the wall jet in the total entrained-air flow rate is especially high for the laminar impinging plasma jet and for the case with shorter substrate standoff distances. Similarly to the case of cold-gas free jets, the maximum mass flow-rate of ambient gas entrained into the turbulent impinging or free plasma jet is approximately directly proportional to the mass flow rate at the jet inlet. The maximum mass flow-rate of ambient gas entrained into the laminar impinging plasma jet slightly increases with increasing jet-inlet velocity but decreases with increasing jet-inlet temperature.

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Approximate Box Relaxation method was used t'o simulate a plasma jet flow impinging on a flatplate at atmospheric pressure, to achieve a better understanding of the characteristics of plasma jet in materials surface treating. The flow fields under different conditions were simulated and analyzed. The distributions of temperature, velocity and pressure were obtained by modelling. Computed results indicate that this numerical method is suitable for simulation of the flow characteristics of plasma jet: and is helpful for understanding of the mechanism of the plasma-material processing.

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Based on the analysis of molecular gas dynamics, the drag and moment acting on an ellipsoid particle of revolution X-2/a(2) + Y-2/a(2) + Z(2)/c(2) = 1, as an example of nonspherical particles, are studied under the condition of free-molecular plasma flow with thin plasma sheaths. A nonzero moment which causes nonspherical particle self-oscillation and self-rotation around its own axis in the plasma flow-similar to the pitching moment in aerodynamics-is discovered for the first time. When the ratio of axis length c/a is unity, the moment is zero and the drag formula are reduced to the well-known results of spherical particles. The effects of the particle-plasma relative velocity, the plasma temperature, and the particle materials on the drag and moment are also investigated.

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In the plasma processing of ultrafine particles of material, the heat transfer and force are considerably affected by particle charging. In this communication a new model, including thermal electron emission and incorporating the effect of electric field near the particle surface, is developed for metallic spherical particles under the condition of a thin plasma sheath. Based on this model, the particle floating potential, and thus the heat transfer and force, can be detemined more accurately and more realistically than previously.

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A mathematical model is presented for the numerical simulation of the flow, temperature, and concentration fields in an rf plasma chemical reactor. The simulation is performed assuming chemical equilibrium. The extent of validity of this assumption is discussed. The system considered is the reaction of SiCl4 and NH3 for the production of Si3N4.

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A kinetic model has been developed for the prediction of the concentration gelds in an rf plasma reactor. A sample calculation for a SiCl4/H2 system is then performed. The model considers the mixing processes along with the kinetics of seven reactions involving the decomposition of these reactants. The results obtained are compared to those assuming chemical equilibrium. The predictions indicate that an equilibrium assumption will result in lower predicted temperature fields in the reactor. Furthermore, for the chemical system considered here, while differences exist between the concentration fields obtained by the two models, the differences are not substantial.

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The problem of thermophoretic deposition of small particles onto cold surfaces is studied in two-dimensional and axisymmetric flow fields. The particle concentration equation is solved numerically together with the momentum and energy equations in the laminar boundary layer with variable density effect included. It is shown explicitly to what extent the particle concentration and deposition rate at the wall are influenced by the density variation effect for external flow past bodies. The general numerical procedure is given for two-dimensional and axisymmetric cases and is illustrated with examples of thermophoretic deposition of particles in flows past a cold cylinder and a sphere.

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In recent years, stable and long laminarplasma jets have been successfully generated, and thus it is possible to achieve low-noise working surroundings, better process repeatability and controllability, and reduced metal-oxidation degree in plasma materials processing. With such a recent development in thermal plasma science and technology as the main research background, modeling studies are performed concerning the DCarcplasmatorch for generating the long laminar argon plasma jet. Two different two-dimensional modeling approaches are employed to deal with the arc-root attachment at the anode surface. The first approach is based on circumferentially uniform arc-root attachment, while the second uses the so-called fictitious anode method. Modeling results show that the highest temperature and maximum axial-velocity at the plasmatorch exit are ~15000 K and ~1100 m/s, respectively, for the case with arc current of 160 A and argon flow rate of 1.95×10{sup}(-4)kg/s.

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In the present study, single-molecule fluorescence microscopy was used to examine the characteristics of plasma membrane targeting and microdomain localization of enhanced yellow fluorescent protein (eYFP)-tagged wild-type Dok5 and its variants in living Chinese hamster ovary (CHO) cells. We found that Dok5 can target constitutively to the plasma membrane, and the PH domain is essential for this process. Furthermore, single-molecule trajectories analysis revealed that Dok5 can constitutively partition into microdomain on the plasma membrane. Finally, the potential mechanism of microdomain localization of Dok5 was discussed. This study provided insights into the characteristics of plasma membrane targeting and microdomain localization of Dok5 in living CHO cells. (C) 2008 Elsevier B.V. All rights reserved.

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Inductively coupled plasma (ICP) technology is a new advanced version of dry-etching technology compared with the widely used method of reactive ion etching (RIE). Plasma processing of the ICP technology is complicated due to the mixed reactions among discharge physics, chemistry and surface chemistry. Extensive experiments have been done and microoptical elements have been fabricated successfully, which proved that the ICP technology is very effective in dry etching of microoptical elements. In this paper, we present the detailed fabrication of microoptical fused silica phase gratings with ICP technology. Optimized condition has been found to control the etching process of ICP technology and to improve the etching quality of microoptical elements greatly. With the optimized condition, we have fabricated lots of good gratings with different periods, depths, and duty cycles. The fabricated gratings are very useful in fields such as spectrometer, high-efficient filter in wavelength-division-multiplexing system, etc..

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Multi-sheet InGaN/GaN quantum dots (QDs) were grown successfully by surface passivation processing and low-temperature growth in metalorganic chemical vapor deposition. This method based on the principle of increasing the energy barrier of adatom hopping by surface passivation and low-temperature growth, is quite different from present methods. The InGaN quantum dots in the first layer of about 40-nm-wide and 15-nm-high grown by this method were revealed by atomic force microscopy. The InGaN QDs in upper layer grew bigger. To our knowledge, the current-voltage characteristics of multi-sheet InGaN/GaN QDs were measured for the fist time. Two kinds of resonance-tunneling-current features were observed which were attributed to the low-dimensional localization effect. Some current peaks only appeared in positive voltage for sample due to the non-uniformity of the QDs in the structure. (C) 2002 Elsevier Science B.V. All rights reserved.