导弹水下潜射过程的流体—固体耦合仿真

导弹潜射是集高速流动、冲击、结构响应于一体的流体—固体—气体三态非线性耦合复杂过程,是决定潜射导弹发射成败的关键环节。本文应用LS-DYNA显式程序建立了三种包含水体、空气、导弹、发射井和筒盖的多物质耦合ALE网格模型,使用罚函数流体—固体耦合方法对导弹水下无攻角潜射过程进行了数值模拟,给出了弹体质心的轴向加速度、轴向流体阻力及阻力系数、空泡区压力分布。仿真结果表明,模型2的仿真过程与实际导弹潜射过程最为相符。同时总结介绍了LS-DYNA程序中流体—固体耦合计算的相关设定原则和方法。本文可为潜射导弹的水动力载荷设计和数值仿真提供有益的参考。

用于激波管/风洞的双爆轰驱动段

对爆轰驱动段的发展进程进行了回顾.比较了反向与前向爆轰驱动段的优缺点.提出在前向爆轰驱动段上游增加反向辅爆轰驱动段,来消除主驱动段中爆轰波后的Taylor波,改善其驱动性能.这种双爆轰驱动段只要辅与主驱动段初始压力比等于或大于临界值,主驱动段中的Taylor波将不再出现,可产生均匀的高温高压驱动气体.此外,还能产生过驱动爆轰波,进一步提高驱动能力.

郭永怀先生诞辰九十周年纪念文集

目录

燃烧物理学基础

Soluble Angiopoietin Receptor Tie-2 In Patients With Acute Myocardial Infarction And Its Detection By Optical Protein-Chip

The Tie-2 receptor has been shown to play a role in angiogenesis in atherosclerosis. The conventional method assaying the level of soluble Tie-2 (sTie-2) was ELISA. However, this method has some disadvantages. The aims of this research are to establish a more simple detection method, the optical protein-chip based on imaging ellipsomtry (OPC-IE) applying to Tie-2 assay. The sTie-2 biosensor surface on silicon wafer was prepared first, and then serum levels of sTie-2 in 38 patients with AMI were measured on admission (day 1), day 2, day 3 and day 7 after onset of chest pain and 41 healthy controls by ELISA and OPC-IE in parallel. Median level of sTie-2 increased significantly in the AMI patients when compared with the controls. Statistics showed there was a significant correlation in sTie-2 results between the two methods (r=0.923, P0.01). The result of this study showed that the level of sTie-2 increased in AMI, and OPC-IE assay was a fast, reliable, and convenient technique to measure sTie-2 in serum.

低密度台阶形闪耀光栅的制作

介绍了制作低密度闪耀光栅的过程,在制作时,对传统的制作过程进行了改进,有效提高了制作质量。以40μm闪耀光栅为例介绍了制作的过程,得到了良好的光栅表面形貌,并且闪耀级次的衍射效率达到了70%以上。相比传统的制作方法,效率提高了5%～10%。对比了理论上的衍射效率,分析了实验误差,发现把存在对准误差的光栅进行处理将会有效地提高其衍射效率,为进一步提高闪耀光栅的衍射效率提供了依据。

Negative refraction in a honeycomb-lattice photonic crystal

In this paper we theoretically investigate a photonic crystal with dielectric rods in a honeycomb lattice. Two left-handed frequency regions are found in the second and third photonic band by using the plane wave expansion method to analyze the photonic band structure and equifrequency contours. Subwavelength imaging by the photonic crystal flat lens are systematically studied by numerical simulations using the multiple scattering method. Different from the photonic crystals with noncircular dielectric rods in air, this structure is almost isotropic at the optimal frequency for superlensing. As a comparison, flat slab focusing is also demonstrated at other frequencies in the two left-handed regions. (c) 2006 Elsevier Ltd. All rights reserved.

Laser induced damage of multi-layer dielectric used in pulse compressor gratings

Laser induced damage threshold (LIDT) of multi-layer dielectric used in pulse compressor gratings (PCG) was investigated. The sample was prepared by e-beam evaporation (EBE). LIDT was detected following ISO standard 11254-1.2. It was found that LIDTs of normal and 51.2 deg. incidence (transverse electric (TE) mode) were 14.14 and 9.31 J/cm2, respectively. A Nomarski microscope was employed to map the damage morphology, and it was found that the damage behavior was pit-concave-plat structure for normal incidence, while it was pit structure for 51.2 deg. incidence with TE mode. The electric field distribution was calculated to illuminate the difference of LIDT between the two incident cases.

Thermal-mechanical modeling of nodular defect embedded within multilayer coatings

The initiation of laser damage within optical coatings can be better understood by thermal-mechanical modeling of coating defects. The result of this modeling shows that a high-temperature rise and thermal stress can be seen just inside the nodular defect compared to surrounding coating layers. The temperature rise and thermal stress tend to increase with seed diameter. Shallower seed tend to cause higher temperature rise and greater thermal stress. There is a critical seed depth at which thermal stress is largest. The composition of the seed resulting from different coating-material emission during evaporation can affect the temperature rise and thermal stress distribution.