Experimental and numerical study on power consumptions in a double-tube-socket pneumatic conveying system

A new methodology is proposed in this paper to predict the lowest power consumption for a double-tube-socket (DTS) pneumatic conveying system. This methodology is established on both experimental work and numerical simulation. After parametric studies by numerical simulation, the desired conveying cases which have the lowest power consumption were obtained. Finally those cases were carried out in our experimental system. The measured power consumption was close to that predicted. In this paper the experimental work is discussed and the numerical simulation introduced. (c) 2010 Elsevier B.V. All rights reserved.

Experimental Study on Convective Boiling Heat Transfer in Narrow-Gap Annulus Tubes

Since convective boiling or highly subcooled single-phase forced convection in micro-channels is an effective cooling mechanism with a wide range of applications, more experimental and theoretical studies are required to explain and verify the forced convection heat transfer phenomenon in narrow channels. In this experimental study, we model the convective boiling behavior of water with low latent heat substance Freon 113 (R-113), with the purpose of saving power consumption and visualizing experiments. Both heat transfer and pressure drop characteristics were measured in subcooled and saturated concentric narrow gap forced convection boiling. Data were obtained to qualitatively identify the effects of gap size, pressure, flow rate and wall superheat on boiling regimes and the transition between various regimes. Some significant differences from unconfined forced convection boiling were found,and also, the flow patterns in narrow vertical annulus tubes have been studied quantitatively.

拉曼喷泉原子钟

利用拉曼光场代替喷泉原子钟的微波腔实现拉曼喷泉原子钟。将分离拉曼光场技术与冷原子喷泉技术相结合,避免了在真空腔内放置微波腔,简化了真空系统,同时还保持了很高的准确度。采用半经典理论研究了冷原子喷泉与拉曼光场的相互作用过程,得到了冉赛(Ramsey)条纹。比较了拉曼喷泉原子钟与热铯束拉曼原子钟,前者有更小的体积和功耗,其精度可能达到或超过商用小铯钟。还比较了拉曼喷泉原子钟与微波喷泉原子钟的差别,分析了光子反冲的影响,提出利用同向传播和相向传播的两台拉曼原子钟测量精细结构常数。

卫星激光通信Ⅰ链路和终端技术

卫星激光通信具有巨大的潜在应用价值, 国际上已实现高码率、小型化、轻量化和低功耗激光通信终端, 全文的第一部分即“链路和终端技术”综述了卫星激光通信的国外进展, 介绍了终端的关键技术, 讨论了终端设计思想。第二部分(另文)将讨论和介绍卫星激光通信终端地面检测和验证技术。

A low-cost CMOS programmable temperature

A novel uncalibrated CMOS programmable temperature switch with high temperature accuracy is presented. Its threshold temperature T-th can be programmed by adjusting the ratios of width and length of the transistors. The operating principles of the temperature switch circuit is theoretically explained. A floating gate neural MOS circuit is designed to compensate automatically the threshold temperature T-th variation that results form the process tolerance. The switch circuit is implemented in a standard 0.35 mu m CMOS process. The temperature switch can be programmed to perform the switch operation at 16 different threshold temperature T(th)s from 45-120 degrees C with a 5 degrees C increment. The measurement shows a good consistency in the threshold temperatures. The chip core area is 0.04 mm(2) and power consumption is 3.1 mu A at 3.3V power supply. The advantages of the temperature switch are low power consumption, the programmable threshold temperature and the controllable hysteresis.

A programmable SIMD vision chip for real-time vision applications

A programmable vision chip for real-time vision applications is presented. The chip architecture is a combination of a SIMD processing element array and row-parallel processors, which can perform pixel-parallel and row-parallel operations at high speed. It implements the mathematical morphology method to carry out low-level and mid-level image processing and sends out image features for high-level image processing without I/O bottleneck. The chip can perform many algorithms through software control. The simulated maximum frequency of the vision chip is 300 MHz with 16 x 16 pixels resolution. It achieves the rate of 1000 frames per second in real-time vision. A prototype chip with a 16 x 16 PE array is fabricated by the 0.18 mu m standard CMOS process. It has a pixel size of 30 mu m x 40 mu m and 8.72 mW power consumption with a 1.8 V power supply. Experiments including the mathematical morphology method and target tracking application demonstrated that the chip is fully functional and can be applied in real-time vision applications.

New type of multimode-interference-type thermo-optic variable optical attenuator

A thermo-optic variable optical attenuator (VOA) based on a Mach-Zehnder interferometer and multimode-interference coupler is fabricated. Not a single-mode but a multimode waveguide is used as the input and output structures of the optical field, which greatly reduces the coupling loss of the VOA with a normal single-mode fiber. The insertion loss of the fabricated VOA is 2.52 to 2.82 dB at the wavelength of 1520 to 1570 nm. The polarization dependent loss is 0.28 to 0.45 dB at the same wavelength range. Its maximum attenuation range is up to 26.3 dB when its power consumption is 369 mW. The response frequency of the fabricated VOA is about 10 kHz. (C) 2004 Society of Photo-Optical Instrumentation Engineers.

Design and fabrication of compact nonblocking 4X4 optical matrix switch on silicon-on-insulator by anisotropic chemical etching

A folding nonblocking 4 X 4 optical matrix switch in simplified-tree architecture was designed and fabricated on a silicon-on-insulator wafer. To compress chip size, switch elements (SEs) were connected by total internal reflection mirrors instead of conventional S-bends. For obtaining smooth interfaces, potassium hydroxide (KOH) anisotropic chemical etching of silicon was employed. The device has a compact size of 20 X 3.2 mm(2) and a fast response of 8 +/- 1 mu s. Power consumption of 2 x 2 SE and excess loss per mirror were 145 mW and -1.1 dB, respectively. (c) 2005 Society of Photo-Optical Instrumentation Engineers.

Integrated folding 4x4 optical matrix switch with total internal reflection mirrors on SOI by anisotropic chemical etching

A folding rearrangeable nonblocking 4 x 4 optical matrix switch was designed and fabricated on silicon-on-insulator wafer. To compress chip size, switch elements (SEs) were interconnected by total internal reflection (TIR) mirrors instead of conventional S-bends. For obtaining smooth interfaces, potassium hydroxide anisotropic chemical etching of silicon was utilized to make the matrix switch for the first time. The device has a compact size of 20 x 1.6 mm(2) and a fast response of 7.5 mu s. The power consumption of each 2 x 2 SE and the average excess loss per mirror were 145 mW and -1.1 dB, respectively. Low path dependence of +/- 0.7 dB in total excess loss was obtained because of the symmetry of propagation paths in this novel matrix switch.

A 4x4 strictly nonblocking silicon-on-insulator thermo-optic switch matrix

A 4 x 4 strictly nonblocking thermo-optic switch matrix implemented with a 2 x 2 Mach-Zehnder switch unit was fabricated in silicon-on-insulator wafer. Insertion losses of the shortest and the longest path in the device are about 14.8 dB and 19.2 dB, respectively. The device presents a very low loss dependent on wavelength. For one switch unit, the power consumption needed for operation is measured to be 0.270 W-0.288 W and the switching time is about 13 +/- 1 mu s.

A silicon-on-insulator-based thermo-optic waveguide switch with low insertion loss and fast response

A silicon-on-insulator-based thermo-optic waveguide switch integrated with spot size converters is designed and fabricated by inductively coupled plasma reactive ion etching. The device shows good characteristics, including low, insertion loss of 8 +/- 1 dB for wavelength 1530-1580 nm and fast response times of 4.6 As for rising edge and 1.9 mu s for failing edge. The extinction ratios of the two channels are 19.1 and 18 dB, respectively.

Fabrication of a 4x4 strictly nonblocking SOI switch matrix

A 4 x 4 strictly nonblocking thermo-optical switch matrix based on Mach-Zehnder (MZ) switching unit was designed and fabricated in silicon-on-insulator (SOI) wafer. The paired multi-mode interferometers (MMI) were used as power splitters and combiners in MZ structures. The device presents an average insertion loss of 17 dB and an average crosstalk of 16.5 dB. The power consumption needed for operation is reduced to 0.288 W by adding isolating trenches. The switching time of the device is about 15 mu s, which is much faster than that of silica-based switches. (C) 2005 Elsevier B.V. All rights reserved.

Thermo-optical switch matrix based on silicon-on-insulator waveguides

A thermo-optical waveguide switch matrix is designed and fabricated on silicon-on-insulator wafer. Multi-mode interferometers are used as power splitters and combiners in a Mach-Zehnder structure. Inductively coupled plasma reactive ion etching is used to fabricate the waveguides. The rise and fall times of the switch matrix are 13 mu s and 7 mu s, respectively. Switch cells have an average switching power consumption of 340 mW.

Thermally tunable optical filter with crystalline silicon as cavity

A novel method to fabricate a thermally tunable filter with a tuning range of 26 nm from 1.504 to 1.530 mum is reported. The high-reffectivity bottom mirror is deposited in the hole formed by anisotropically etching in the basic solution from the backside of the slice with the buried SiO2 layer in silicon-on-insulator substrate as the etching-stop layer. Because of the formation of the mesa and the removing of the substrate of the hole, the power from the metal heater can be more effectively consumed in the crystalline silicon cavity. So it lowers the power consumption and the filter has a higher tuning range. (C) 2004 Elsevier B.V. All rights reserved.

Silicon-on-insulator-based waveguide switch with fast response

Based on thermo-optical effect of silicon, a 2 x 2 switch is fabricated in silicon-on-insulator by chemical etching. The switch presents an extinction ratio of 26 dB and a power consumption of 169 mW. The response time F similar to 10.5 mus.