35 resultados para laser processing


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Laser shock processing (LSP) is being increasingly applied as an effective technology for the improvement of metallic materials mechanical and surface properties in different types of components as a means of enhancement of their corrosion and fatigue life behavior. As reported in previous contributions by the authors, a main effect resulting from the application of the LSP technique consists on the generation of relatively deep compression residual stresses field into metallic alloy pieces allowing an improved mechanical behaviour, explicitly the life improvement of the treated specimens against wear, crack growth and stress corrosion cracking. Additional results accomplished by the authors in the line of practical development of the LSP technique at an experimental level (aiming its integral assessment from an interrelated theoretical and experimental point of view) are presented in this paper. Concretely, follow-on experimental results on the residual stress profiles and associated surface properties modification successfully reached in typical materials (especially Al and Ti alloys characteristic of high reliability components in the aerospace, nuclear and biomedical sectors) under different LSP irradiation conditions are presented along with a practical correlated analysis on the protective character of the residual stress profiles obtained under different irradiation strategies. Additional remarks on the improved character of the LSP technique over the traditional “shot peening” technique in what concerns depth of induced compressive residual stresses fields are also made through the paper

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Outline: • Introduction • Numerical model SHOCKLAS© • Single LSP pulses • Overlapped LSP pulses • Discussion and Outlook

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Laser shock processing (LSP) is increasingly applied as an effective technology for the improvement of metallic materials mechanical properties in different types of components as a means of enhancement of their fatigue life behavior. As reported in previous contributions by the authors, a main effect resulting from the application of the LSP technique consists on the generation of relatively deep compression residual stresses fields into metallic components allowing an improved mechanical behaviour, explicitly the life improvement of the treated specimens against wear, crack growth and stress corrosion cracking. Additional results accomplished by the authors in the line of practical development of the LSP technique at an experimental level (aiming its integral assessment from an interrelated theoretical and experimental point of view)are presented in this paper. Concretely, experimental results on the residual stress profiles and associated mechanical properties modification successfully reached in typical materials under different LSP irradiation conditions are presented. In this case, the specific behavior of a widely used material in high reliability components (especially in nuclear and biomedical applications) as AISI 316L is analyzed, the effect of possible “in-service” thermal conditions on the relaxation of the LSP effects being specifically characterized.

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Laser Shock Processing (LSP) has been demonstrated as an emerging technique for the induction of RS’s fields in subsurface layers of relatively thick specimens. However, the LSP treatment of relatively thin specimens brings, as an additional consequence, the possible bending in a process of laser shock forming. This effect poses a new class of problems regarding the attainment of specified RS’s depth profiles in the mentioned type of sheets, and, what can be more critical, an overall deformation of the treated component. The analysis of the problem of LSP treatment for induction of tentatively through-thickness RS’s fields for fatigue life enhancement in relatively thin sheets in a way compatible with reduced overall workpiece deformation due to spring-back self-equilibration is envisaged in this paper. The coupled theoretical-experimental predictive approach developed by the authors has been applied to the specification of LSP treatments for achievement of RS's fields tentatively able to retard crack propagation on normalized specimens. A convergence between numerical code results and experimental results coming from direct RS's measurement is presented as a first step for the treatment of the normalized specimens under optimized conditions and verification of the crack retardation properties virtually induced.

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In this work we have realized plasma diagnosis produced by Laser (LPP), by means of emission spectroscopy in a Laser Shock Processing (LSP). The LSP has been proposed as an alternative technology, competitive with classical surface treatments. The ionic species present in the plasma together with electron density and its temperature provide significant indicators of the degree of surface effect of the treated material. In order to analyze these indicators, we have realized spectroscopic studies of optical emission in the laser-generated plasmas in different situations. We have worked focusing on an aluminum sample (Al2024) in air and/or in LSP conditions (water flow) a Q-switched laser of Nd:YAG (λ = 1.06 μm, 10 ns of pulse duration, running at 10 Hz repetition rate). The pulse energy was set at 2,5 J per pulse. The electron density has been measured using, in every case, the Stark broadening of H Balmer α line (656.27 nm). In the case of the air, this measure has been contrasted with the value obtained with the line of 281.62 nm of Al II. Special attention has been paid to the self-absorption of the spectral lines used. The measures were realized with different delay times after the pulse of the laser (1–8 μs) and with a time window of 1 μs. In LSP the electron density obtained was between 1017 cm−3 for the shortest delays (4–6 μs), and 1016 cm−3 for the greatest delays (7,8 μs).

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In this work we propose a method for cleaving silicon-based photonic chips by using a laser based micromachining system, consisting of a ND:YVO4laser emitting at 355 nm in nanosecond pulse regime and a micropositioning system. The laser makes grooved marks placed at the desired locations and directions where cleaves have to be initiated, and after several processing steps, a crack appears and propagate along the crystallographic planes of the silicon wafer. This allows cleavage of the chips automatically and with high positioning accuracy, and provides polished vertical facets with better quality than the obtained with other cleaving process, which eases the optical characterization of photonic devices. This method has been found to be particularly useful when cleaving small-sized chips, where manual cleaving is hard to perform; and also for polymeric waveguides, whose facets get damaged or even destroyed with polishing or manual cleaving processing. Influence of length of the grooved line and speed of processing is studied for a variety of silicon chips. An application for cleaving and characterizing sol–gel waveguides is presented. The total amount of light coupled is higher than when using any other procedure.

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In this work we study the optimization of laser-fired contact (LFC) processing parameters, namely laser power and number of pulses, based on the electrical resistance measurement of an aluminum single LFC point. LFC process has been made through four passivation layers that are typically used in c-Si and mc-Si solar cell fabrication: thermally grown silicon oxide (SiO2), deposited phosphorus-doped amorphous silicon carbide (a-SiCx/H(n)), aluminum oxide (Al2O3) and silicon nitride (SiNx/H) films. Values for the LFC resistance normalized by the laser spot area in the range of 0.65–3 mΩ cm2 have been obtained

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Continuous and long-pulse lasers have been used for the forming of metal sheets in macroscopic mechanical applications. However, for the manufacturing of micro-electromechanical systems (MEMS), the use of ns laser pulses provides a suitable parameter matching over an important range of sheet components that, preserving the short interaction time scale required for the predominantly mechanical (shock) induction of deformation residual stresses, allows for the successful processing of components in a medium range of miniaturization without appreciable thermal deformation.. In the present paper, the physics of laser shock microforming and the influence of the different experimental parameters on the net bending angle are presented.

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In the Laser-Fired Contact (LFC) process, a laser beam fires a metallic layer through a dielectric passivating layer into the silicon wafer to form an electrical contact with the silicon bulk [1]. This laser technique is an interesting alternative for the fabrication of both laboratory and industrial scale high efficiency passivated emitter and rear cell (PERC). One of the principal characteristics of this promising technique is the capability to reduce the recombination losses at the rear surface in crystalline silicon solar cells. Therefore, it is crucial to optimize LFC because this process is one of the most promising concepts to produce rear side point contacts at process speeds compatible with the final industrial application. In that sense, this work investigates the optimization of LFC processing to improve the back contact in silicon solar cells using fully commercial solid state lasers with pulse width in the ns range, thus studying the influence of the wavelength using the three first harmonics (corresponding to wavelengths of 1064 nm, 532 nm and 355 nm). Previous studies of our group focused their attention in other processing parameters as laser fluence, number of pulses, passivating material [2, 3] thickness of the rear metallic contact [4], etc. In addition, the present work completes the parametric optimization by assessing the influence of the laser wavelength on the contact property. In particular we report results on the morphology and electrical behaviour of samples specifically designed to assess the quality of the process. In order to study the influence of the laser wavelength on the contact feature we used as figure of merit the specific contact resistance. In all processes the best results have been obtained using green (532 nm) and UV (355 nm), with excellent values for this magnitude far below 1 mΩcm2.

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Laser material processing is being extensively used in photovoltaic applications for both the fabrication of thin film modules and the enhancement of the crystalline silicon solar cells. The two temperature model for thermal diffusion was numerically solved in this paper. Laser pulses of 1064, 532 or 248 nm with duration of 35, 26 or 10 ns were considered as the thermal source leading to the material ablation. Considering high irradiance levels (108–109 W cm−2), a total absorption of the energy during the ablation process was assumed in the model. The materials analysed in the simulation were aluminium (Al) and silver (Ag), which are commonly used as metallic electrodes in photovoltaic devices. Moreover, thermal diffusion was also simulated for crystalline silicon (c-Si). A similar trend of temperature as a function of depth and time was found for both metals and c-Si regardless of the employed wavelength. For each material, the ablation depth dependence on laser pulse parameters was determined by means of an ablation criterion. Thus, after the laser pulse, the maximum depth for which the total energy stored in the material is equal to the vaporisation enthalpy was considered as the ablation depth. For all cases, the ablation depth increased with the laser pulse fluence and did not exhibit a clear correlation with the radiation wavelength. Finally, the experimental validation of the simulation results was carried out and the ability of the model with the initial hypothesis of total energy absorption to closely fit experimental results was confirmed.

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La mayoría de las aplicaciones forestales del escaneo laser aerotransportado (ALS, del inglés airborne laser scanning) requieren la integración y uso simultaneo de diversas fuentes de datos, con el propósito de conseguir diversos objetivos. Los proyectos basados en sensores remotos normalmente consisten en aumentar la escala de estudio progresivamente a lo largo de varias fases de fusión de datos: desde la información más detallada obtenida sobre un área limitada (la parcela de campo), hasta una respuesta general de la cubierta forestal detectada a distancia de forma más incierta pero cubriendo un área mucho más amplia (la extensión cubierta por el vuelo o el satélite). Todas las fuentes de datos necesitan en ultimo termino basarse en las tecnologías de sistemas de navegación global por satélite (GNSS, del inglés global navigation satellite systems), las cuales son especialmente erróneas al operar por debajo del dosel forestal. Otras etapas adicionales de procesamiento, como la ortorectificación, también pueden verse afectadas por la presencia de vegetación, deteriorando la exactitud de las coordenadas de referencia de las imágenes ópticas. Todos estos errores introducen ruido en los modelos, ya que los predictores se desplazan de la posición real donde se sitúa su variable respuesta. El grado por el que las estimaciones forestales se ven afectadas depende de la dispersión espacial de las variables involucradas, y también de la escala utilizada en cada caso. Esta tesis revisa las fuentes de error posicional que pueden afectar a los diversos datos de entrada involucrados en un proyecto de inventario forestal basado en teledetección ALS, y como las propiedades del dosel forestal en sí afecta a su magnitud, aconsejando en consecuencia métodos para su reducción. También se incluye una discusión sobre las formas más apropiadas de medir exactitud y precisión en cada caso, y como los errores de posicionamiento de hecho afectan a la calidad de las estimaciones, con vistas a una planificación eficiente de la adquisición de los datos. La optimización final en el posicionamiento GNSS y de la radiometría del sensor óptico permitió detectar la importancia de este ultimo en la predicción de la desidad relativa de un bosque monoespecífico de Pinus sylvestris L. ABSTRACT Most forestry applications of airborne laser scanning (ALS) require the integration and simultaneous use of various data sources, pursuing a variety of different objectives. Projects based on remotely-sensed data generally consist in upscaling data fusion stages: from the most detailed information obtained for a limited area (field plot) to a more uncertain forest response sensed over a larger extent (airborne and satellite swath). All data sources ultimately rely on global navigation satellite systems (GNSS), which are especially error-prone when operating under forest canopies. Other additional processing stages, such as orthorectification, may as well be affected by vegetation, hence deteriorating the accuracy of optical imagery’s reference coordinates. These errors introduce noise to the models, as predictors displace from their corresponding response. The degree to which forest estimations are affected depends on the spatial dispersion of the variables involved and the scale used. This thesis reviews the sources of positioning errors which may affect the different inputs involved in an ALS-assisted forest inventory project, and how the properties of the forest canopy itself affects their magnitude, advising on methods for diminishing them. It is also discussed how accuracy should be assessed, and how positioning errors actually affect forest estimation, toward a cost-efficient planning for data acquisition. The final optimization in positioning the GNSS and optical image allowed to detect the importance of the latter in predicting relative density in a monospecific Pinus sylvestris L. forest.

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Continuous and long-pulse lasers have been extensively used for the forming of metal sheets for macroscopic mechanical applications. However, for the manufacturing of Micro-Mechanical Systems (MMS), the applicability of such type of lasers is limited by the long relaxation time of the thermal fields responsible for the forming phenomena. As a consequence, the final sheet deformation state is attained only after a certain time, what makes the generated internal residual stress fields more dependent on ambient conditions and might difficult the subsequent assembly process. The use of short pulse (ns) lasers provides a suitable parameter matching for the laser forming of an important range of sheet components used in MEMS. The short interaction time scale required for the predominantly mechanic (shock) induction of deformation residual stresses allows the successful processing of components in a medium range of miniaturization (particularly important according to its frequent use in such systems). In the present paper, Laser Shock Micro-Forming (LSμF) is presented as an emerging technique for Microsystems parts shaping and adjustment along with a discussion on its physical foundations and practical implementation possibilities developed by the authors.

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The present investigation addresse the influence of laser welding process-ing parameters used for joining dis-similar metals (ferritic to austenitic steel), on the induced residual stress field. Welding was performed on a Nd:YAG laser DY033 (3300 W) in a continuous wave (CW), keyhole mode. The base metals (BM) employed in this study are AISI 1010 carbon steel (CS) and AISI 304L austenitic stainless steel (SS). Pairs of dissimilar plates of 200 mm x 45 mm x 3 mm were butt joined by laser welding. Different sets of parameters were used to engineer the base metals apportionment at joint formation, namely distinct dilution rates. Residual strain scanning, carried out by neutron diffraction was used to assess the joints. Through-thickness residual stress maps were determined for the laser welded samples of dis-similar steels using high spatial reso-lution. As a result, an appropriate set of processing parameters, able to mi-nimize the local tensile residual stress associated to the welding process, was found.

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In this study, autogenous laser welding was used to join thin plates of low carbon ferritic and austenitic stainless steel. Due to the differences in the thermo-physical properties of base metals, this kind of weld exhibits a complex microstructure, which frequently leads to an overall loss of joint quality. Four welded samples were prepared by using different sets of processing parameters, with the aim of minimizing the induced residual stress field. The dissimilar austenitic-ferritic joints obtained under all welding conditions were uniform and free of defects. Variations in beam position did not influence the weld geometiy, which is a typical keyhole welding. Microstructural characterization and residual strain scanning (by neutron diffraction) were used to assess the features of the joints. By varying laser beam power density and by displacing the laser beam towards the carbon steel side, an optimum combination of processing parameters was found.

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Study of the temperature distribution in Si nanowires under microscopic laser beam excitation