6 resultados para deep processing

em Massachusetts Institute of Technology


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Surface (Lambertain) color is a useful visual cue for analyzing material composition of scenes. This thesis adopts a signal processing approach to color vision. It represents color images as fields of 3D vectors, from which we extract region and boundary information. The first problem we face is one of secondary imaging effects that makes image color different from surface color. We demonstrate a simple but effective polarization based technique that corrects for these effects. We then propose a systematic approach of scalarizing color, that allows us to augment classical image processing tools and concepts for multi-dimensional color signals.

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Freehand sketching is both a natural and crucial part of design, yet is unsupported by current design automation software. We are working to combine the flexibility and ease of use of paper and pencil with the processing power of a computer to produce a design environment that feels as natural as paper, yet is considerably smarter. One of the most basic steps in accomplishing this is converting the original digitized pen strokes in the sketch into the intended geometric objects using feature point detection and approximation. We demonstrate how multiple sources of information can be combined for feature detection in strokes and apply this technique using two approaches to signal processing, one using simple average based thresholding and a second using scale space.

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This thesis presents a perceptual system for a humanoid robot that integrates abilities such as object localization and recognition with the deeper developmental machinery required to forge those competences out of raw physical experiences. It shows that a robotic platform can build up and maintain a system for object localization, segmentation, and recognition, starting from very little. What the robot starts with is a direct solution to achieving figure/ground separation: it simply 'pokes around' in a region of visual ambiguity and watches what happens. If the arm passes through an area, that area is recognized as free space. If the arm collides with an object, causing it to move, the robot can use that motion to segment the object from the background. Once the robot can acquire reliable segmented views of objects, it learns from them, and from then on recognizes and segments those objects without further contact. Both low-level and high-level visual features can also be learned in this way, and examples are presented for both: orientation detection and affordance recognition, respectively. The motivation for this work is simple. Training on large corpora of annotated real-world data has proven crucial for creating robust solutions to perceptual problems such as speech recognition and face detection. But the powerful tools used during training of such systems are typically stripped away at deployment. Ideally they should remain, particularly for unstable tasks such as object detection, where the set of objects needed in a task tomorrow might be different from the set of objects needed today. The key limiting factor is access to training data, but as this thesis shows, that need not be a problem on a robotic platform that can actively probe its environment, and carry out experiments to resolve ambiguity. This work is an instance of a general approach to learning a new perceptual judgment: find special situations in which the perceptual judgment is easy and study these situations to find correlated features that can be observed more generally.

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Understanding how the human visual system recognizes objects is one of the key challenges in neuroscience. Inspired by a large body of physiological evidence (Felleman and Van Essen, 1991; Hubel and Wiesel, 1962; Livingstone and Hubel, 1988; Tso et al., 2001; Zeki, 1993), a general class of recognition models has emerged which is based on a hierarchical organization of visual processing, with succeeding stages being sensitive to image features of increasing complexity (Hummel and Biederman, 1992; Riesenhuber and Poggio, 1999; Selfridge, 1959). However, these models appear to be incompatible with some well-known psychophysical results. Prominent among these are experiments investigating recognition impairments caused by vertical inversion of images, especially those of faces. It has been reported that faces that differ "featurally" are much easier to distinguish when inverted than those that differ "configurally" (Freire et al., 2000; Le Grand et al., 2001; Mondloch et al., 2002) ??finding that is difficult to reconcile with the aforementioned models. Here we show that after controlling for subjects' expectations, there is no difference between "featurally" and "configurally" transformed faces in terms of inversion effect. This result reinforces the plausibility of simple hierarchical models of object representation and recognition in cortex.

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This paper reports the surface morphologies and ablation of crystalline silicon wafers irradiated by infra-red 775 nm Ti:sapphire femtosecond laser. The effects of energy fluences (below and above single-pulse modification) with different number of pulses were studied. New morphological features such as pits, cracks formation, Laser-Induced Periodic Surface Structures (LIPSS) and ablation were observed. The investigation indicated that there are two distinct mechanisms under femtosecond laser irradiation: low fluence regime with different morphological features and high fluence regime with high material removal and without complex morphological features.

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We contribute a quantitative and systematic model to capture etch non-uniformity in deep reactive ion etch of microelectromechanical systems (MEMS) devices. Deep reactive ion etch is commonly used in MEMS fabrication where high-aspect ratio features are to be produced in silicon. It is typical for many supposedly identical devices, perhaps of diameter 10 mm, to be etched simultaneously into one silicon wafer of diameter 150 mm. Etch non-uniformity depends on uneven distributions of ion and neutral species at the wafer level, and on local consumption of those species at the device, or die, level. An ion–neutral synergism model is constructed from data obtained from etching several layouts of differing pattern opening densities. Such a model is used to predict wafer-level variation with an r.m.s. error below 3%. This model is combined with a die-level model, which we have reported previously, on a MEMS layout. The two-level model is shown to enable prediction of both within-die and wafer-scale etch rate variation for arbitrary wafer loadings.