Microscale thermal engineering of electronic systems

The electronics industry is encountering thermal challenges and opportunities with lengthscales comparable to or much less than one micrometer. Examples include nanoscale phonon hotspots in transistors and the increasing temperature rise in onchip interconnects. Millimeter-scale hotspots on microprocessors, resulting from varying rates of power consumption, are being addressed using two-phase microchannel heat sinks. Nanoscale thermal data storage technology has received much attention recently. This paper provides an overview of these topics with a focus on related research at Stanford University.

Flexibility and Efficiency in a Computer Program for Designing Circuits

This report is concerned with the problem of achieving flexibility (additivity, modularity) and efficiency (performance, expertise) simultaneously in one AI program. It deals with the domain of elementary electronic circuit design. The proposed solution is to provide a deduction-driven problem solver with built-in-control-structure concepts. This problem solver and its knowledge base in the applicaitn areas of design and electronics are descrbed. The prgram embodying it is being used to explore the solutionof some modest problems in circuit design. It is concluded that shallow reasoning about problem-solver plans is necessary for flexibility, and can be implemented with reasonable efficiency.