4 resultados para 3-Dimensional

em Massachusetts Institute of Technology


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We address the computational role that the construction of a complete surface representation may play in the recovery of 3--D structure from motion. We present a model that combines a feature--based structure--from- -motion algorithm with smooth surface interpolation. This model can represent multiple surfaces in a given viewing direction, incorporates surface constraints from object boundaries, and groups image features using their 2--D image motion. Computer simulations relate the model's behavior to perceptual observations. In a companion paper, we discuss further perceptual experiments regarding the role of surface reconstruction in the human recovery of 3--D structure from motion.

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Chow and Liu introduced an algorithm for fitting a multivariate distribution with a tree (i.e. a density model that assumes that there are only pairwise dependencies between variables) and that the graph of these dependencies is a spanning tree. The original algorithm is quadratic in the dimesion of the domain, and linear in the number of data points that define the target distribution $P$. This paper shows that for sparse, discrete data, fitting a tree distribution can be done in time and memory that is jointly subquadratic in the number of variables and the size of the data set. The new algorithm, called the acCL algorithm, takes advantage of the sparsity of the data to accelerate the computation of pairwise marginals and the sorting of the resulting mutual informations, achieving speed ups of up to 2-3 orders of magnitude in the experiments.

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Methods are presented (1) to partition or decompose a visual scene into the bodies forming it; (2) to position these bodies in three-dimensional space, by combining two scenes that make a stereoscopic pair; (3) to find the regions or zones of a visual scene that belong to its background; (4) to carry out the isolation of objects in (1) when the input has inaccuracies. Running computer programs implement the methods, and many examples illustrate their behavior. The input is a two-dimensional line-drawing of the scene, assumed to contain three-dimensional bodies possessing flat faces (polyhedra); some of them may be partially occluded. Suggestions are made for extending the work to curved objects. Some comparisons are made with human visual perception. The main conclusion is that it is possible to separate a picture or scene into the constituent objects exclusively on the basis of monocular geometric properties (on the basis of pure form); in fact, successful methods are shown.

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Three dimensional (3-D) integrated circuits can be fabricated by bonding previously processed device layers using metal-metal bonds that also serve as layer-to-layer interconnects. Bonded copper interconnects test structures were created by thermocompression bonding and the bond toughness was measured using the four-point test. The effects of bonding temperature, physical bonding and failure mechanisms were investigated. The surface effects on copper surface due to pre-bond clean (with glacial acetic acid) were also looked into. A maximum average bond toughness of approximately 35 J/m² was obtained bonding temperature 300 C.