Planarization machining of sapphire wafers with boron carbide and colloidal silica as abrasives
| Data(s) |
15/07/2009
|
|---|---|
| Identificador | |
| Idioma(s) |
eng |
| Publicador |
Elsevier |
| Relação |
http://dro.deakin.edu.au/eserv/DU:30052754/hu-planarizationmaching-2009.pdf http://dx.doi.org/10.1016/j.apsusc.2009.05.056 |
| Palavras-Chave | #sapphire #abrasives #grinding #polishing #planarization #silica |
| Tipo |
Journal Article |
