Mechanisms and sources of passive intermodulation in printed circuits

Modern wireless systems are expected to operate in multiple frequency bands and support diverse communications standards to provide the high volume and speed of data transmission. Today's major limitations of their performance are imposed by interference, spurious emission and noise generated by high-power carriers in antennas and passive components of the RF front-end. Passive Intermodulation (PIM), which causes the combinatorial frequency generation in the operational bands, presents a primary challenge to signal integrity, system efficacy and data throughput. © 2013 IEEE.

Printed circuits; final report,

Program authorized by Dept. of the Navy, Bureau of Aeronautics.

Effects of Geometrical Discontinuities on Distributed Passive Intermodulation in Printed Lines

This paper presents the results of experimental study of passive intermodulation (PIM) generation in microstrip lines with U-shaped and meandered strips, impedance tapers, and strips with the profiled edges. It is shown that the geometrical discontinuities in printed circuits may have a noticeable impact on distributed PIM generation even when their effect is indiscernible in the linear regime measurements. A consistent interpretation of the observed phenomena has been proposed on the basis of the phase synchronism in the four-wave mixing process. The results of this study reveal new features of PIM production important for the design and characterization of low-PIM microstrip circuits. © 2010 IEEE.

Effects of Interface Conditions and Long-Term Stability of Passive Intermodulation Response in Printed Lines

An experimental investigation of the effect of conductor-to-substrate interface on distributed passive intermodulation (PIM) generation in printed microstrip lines has been undertaken using the custom-designed microwave laminates with removed surface bonding layers and with the commercial adhesion promotion applied to the conductor underside. The study of long-term stability of PIM performance of the printed circuits is reported for the first time. The comprehensive measurement results, observations of the selfimprovement of the PIM performance and the effect of panel bending on PIM generation in printed boards with different finishing are presented. A consistent physical interpretation of the observed phenomena is proposed. The results of this study provide new important considerations for the design and characterisation of low-PIM printed circuits.

Passive Intermodulation in Distributed Circuits with Cascaded Discrete Nonlinearities

The principle aspects of passive intermodulation (PIM) characterisation in distributed printed circuits with cascaded lumped nonlinearities are presented. Mechanisms of PIM generations have been investigated experimentally and modelled using the formalism of X-parameters. The devised equivalent circuit models are applied to the analysis of microstrip lines with distributed and cascaded lumped sources of nonlinearity. The dynamic measurements have revealed that PIM generation rates in straight and meandered microstrip lines differ and significantly deviate from those expected for the respective discrete sources of nonlinearity. The obtained results indicate that multiple physical sources of nonlinearity contribute to PIM generation in printed circuits. Finally, it is demonstrated that the electrical discontinuities can have significant effect on the overall PIM response of the distributed passive circuits and cause PIM product leakage and parasitic coupling between isolated circuit elements.

Thermogravimetric study of the decomposition of printed circuit boards from mobile phones

Thermal decomposition of printed circuits boards (PCB) is studied, using thermogravimetric analysis to compare the thermal behavior of PCB of mobile phones before and after the removal of the metallic fraction by acid washing. Several dynamic and dynamic + isothermal runs have been carried out at different heating rates (5, 10 and 20 K min−1), from room temperature to more than 1100 K. Also runs in the presence and in the absence of oxygen were performed (combustion and pyrolysis runs). Moreover, TG–MS experiments were performed (both in inert and oxidizing atmosphere) in order to better understand the thermal decomposition of these wastes and identify some compounds emitted during the controlled heating of these materials. Different reaction models are proposed, one for pyrolysis and one for combustion of the two kinds of wastes studied, which proved to simulate appropriately the experimental results at all the heating rates simultaneously.

Modifications to reduce drag out at a printed circuit board manufacturer /

Mode of access: Internet.

Fast heuristic techniques for placing and wiring printed circuit boards /

Thesis--University of Illinois at Urbana-Champaign.

Design of the program-controlled semiconductor and printed circuit board test console /

"October 21, 1963"

Diagnosis of printed circuit cards on a programmable test equipment /

Originally published as the author's thesis (M.S.)--University of Illinois at Urbana-Champaign, 1970.

Printed circuit laboratory manual /

This manual provides a description of the laboratory and a step-by-step outline of the manufacturing techniques employed at Sandia Corporation, Livermore Laboratory (SCLL), in the fabrication of the etched circuit boards.