Microstructure and texture evolution during accumulative roll bonding of aluminium alloy AA5086

In the present investigation, a strongly bonded strip of an aluminium-magnesium based alloy AA5086 is successfully produced through accumulative roll bonding (ARB). A maximum of up to eight passes has been used for the purpose. Microstructural characterization using electron backscatter diffraction (EBSD) technique indicates the formation of submicron sized (similar to 200-300 nm) subgrains inside the layered microstructure. The material is strongly textured where individual layers possess typical FCC rolling texture components. More than three times enhancement in 0.2% proof stress (PS) has been obtained after 8 passes due to grain refinement and strain hardening. (C) 2011 Elsevier B.V. All rights reserved.

Accumulative roll bonding of aluminum alloys 2219/5086 laminates: Microstructural evolution and tensile properties

The present study describes the course of microstructure evolution during accumulative roll bonding (ARB) of dissimilar aluminum alloys AA2219 and AA5086. The two alloys were sandwiched as alternate layers and rolled at 300 degrees C up to 8 passes with 50% height reduction per pass. A strong bonding between successive layers accompanied by substantial grain refinement (similar to 200-300 nm) is achieved after 8 passes of ARB. The processing schedule has successfully maintained the iso-strain condition up to 6 cycles between the two alloys. Afterwards, the fracture and fragmentation of AA5086 layers dominate the microstructure evolution. Mechanical properties of the 8 pass ARB processed material were evaluated in comparison to the two starting alloy sheets via room temperature tensile tests along the rolling direction. The strength of the 8 pass ARB processed material lies between that of the two starting alloys while the ductility decreases after ARB than that of the two constituent starting alloys. These differences in mechanical behavior have been attributed to the microstructural aspects of the individual layer and the fragmentation process. (C) 2011 Elsevier Ltd. All rights reserved.

Microstructure and texture evolution during accumulative roll bonding of aluminium alloys AA2219/AA5086 composite laminates

Accumulative roll bonding of two aluminium alloys, AA2219 and AA5086 was carried out up to 8 passes. During the course of ARB, the deformation inhomogeneity between the two alloy layers results in interfacial instability after the 4th pass, necking of the AA5086 layers after the 6th pass and fracture along the necked regions after the 7th and 8th pass. The EBSD analysis shows deformation bands along the interfaces after 8 passes of ARB. The ARB-processed materials predominantly show characteristic deformation texture components. The weak texture after the 2nd pass results from the combination of a weakly-textured starting AA2219 layer and a strongly-textured starting AA5086 layer. A strong deformation texture forms due to the high imposed strain after a higher number of ARB passes. Subgrain formation and related shear banding induces copper/S components in the case of the small elongated grains, while planar slip leads to the formation of brass component in the large elongated grains.

Development of microstructure and texture in Copper during warm accumulative roll bonding

The evolution of microstructure and texture gradient in warm Accumulative Roll Bonded Cu-Cu multilayer has been studied. Grain size distribution is multimodal and exhibits variation from middle to surface layer. Evolution of texture is largely influenced by shear, in addition to rolling deformation. This leads to the formation of a texture comprising of high fraction of Brass and rolling direction-rotated cube components. Partial recrystallization was observed. Deformed and recrystallized grains were separated using a partition scheme based on grain orientation spread and textures were analyzed for both the partition. Retention of deformation texture components in recrystallized grains suggests the mechanism of recrystallization as continuous recrystallization. Shear deformation plays an important role in grain refinement through continuous recrystallization. (C) 2012 Elsevier Inc. All rights reserved.

Texture and microstructure evolution during cold rolling of Cu-Fe laminates prepared by accumulative roll bonding

Multi-layered materials have been made from Cu-Fe with approximately equal volume fractions using the Accumulated Roll Bonding (ARB) technique with less than 1 μm thickness of the individual layers. The so-obtained multi-layers have been subjected to deformation by cold rolling to 25, 50, 75, 87 and 93% reduction in thickness. A detailed characterization has been carried out using X-ray diffraction (line profile analysis and texture measurement) and electron (scanning and transmission) microscopy. It has been found that Fe layers are disintegrated whereas Cu retains its continuity within a layer. Microstructural Characterization from X-Ray Line profile Analysis (XRDLPA) through Variance Method reveals that large amount of strain is initially carried by Cu layers during deformation. In the Cu-Fe layer, the texture is comparatively weaker in Cu layer and strong in Fe layers. Brass Component increases up to 75% reduction and then decreases, while the ratio of Cu/S and Bs/S remains almost constant through out the deformation. After 50% reduction, dynamic recovery is predominant as indicated by the increase in the amount of low angle grain boundaries and decrease in dislocation density. The presence of R component indicates continuous dynamic recovery and recrystallization (CDRR) at the advanced stage of deformation.

Two-Phase Metallic Thermal Interface Materials Processed Through Liquid Phase Sintering Followed by Accumulative Roll Bonding

Thermal interface materials (TIMs) form a mechanical and thermal link between a heat source and a heat sink. Thus, they should have high thermal conductivity and high compliance to efficiently transfer heat and accommodate any differential strain between the heat source and the sink, respectively. This paper reports on the processing and the characterization of potential metallic TIM composite solders comprising of Cu, a high conductivity phase, uniformly embedded in In matrix, a highly compliant phase. We propose the fabrication of such a material by a two-step fabrication technique comprising of liquid phase sintering (LPS) followed by accumulative roll bonding (ARB). To demonstrate the efficacy of the employed two-step processing technique, an In-40 vol. % Cu composite solder was produced first using LPS with short sintering periods (30 or 60 s at 160 degrees C) followed by ARB up to five passes, each pass imposing a strain of 50%. Mechanical response and electrical and thermal conductivities of the fabricated samples were evaluated. It was observed that processing through ARB homogenizes the distribution of Cu in an In matrix, disintegrates the agglomerates of Cu powders, and also significantly increases thermal and electrical conductivities, almost attaining theoretically predicted values, without significantly increasing the flow stress. Furthermore, the processing technique also allows the insertion of desired foreign species, such as reduced graphene oxide, in In-Cu for further enhancing a target property, such as electrical conductivity.

Electron back scattered diffraction (EBSD) characterization of warm rolled and accumulative roll bonding (ARB) processed ferrite

An interstitial free (IF) steel was severely deformed using accumulative roll bonding (ARB) process and warm rolling. The maximum equivalent strains for ARB and warm rolling were 4.8 and 4.0, respectively. The microstructure and micro-texture were studied using optical microscopy and scanning electron microscopy equipped with electron back scattered diffraction (EBSD). The grain size and misorientation obtained by both methods are in the same range. The microstructure in the ARB samples after 6 cycles is homogeneous, although a grain size gradient is observed at the layers close to the surface. The through thickness texture gradient in the ARB samples is different from the warm rolled samples. While a shear texture (⟨110⟩//rolling plane normal direction (ND)) at the surface and rolling texture at the center region is developed in the ARB  samples, the overall texture is weak. The warm rolled samples display a sharp rolling texture through the thickness with increasing the sharpness toward the center. These differences are attributed to the fact that the central region of ARB strip is comprised of material that was once at the surface. The ARB process  can suppress the formation of shear bands which are conventional at warm rolled IF steels. EBSD study on the sample with 6th cycle of ARB following the annealing at 750 ◦C verified a texture gradient through the thickness of the sheet. The shear orientations at the surface and at the quarter thickness layers can be identified even after annealing. The overall weak texture and existence of shear orientations make ARB processed samples unfavorable for sheet metal forming in compare with warm rolled samples.

Nucleation and growth during reactions in accumulative roll bonding of Ti/Al multilayers

A two-stage process in the formation of TiAl₃ was found in the accumulative roll bonding (ARB) Ti/Al multilayers. The distribution of layer spacing did not become broad enough to lose the main features of the double exothermal behaviour. A modified model based on thin films was set up to describe the kinetic characteristics of the formation of TiAl₃ in ARB samples.

The kinetics of two-stage formation of TiAl3 in multilayered Ti/Al foils prepared by accumulative roll bonding

The solid-state reactions of Ti/Al multilayered samples produced by Accumulative Roll Bonding (ARB) have been investigated using differential scanning calorimetry, X-ray diffraction and scanning electron microscopy. The kinetics of the formation of the intermetallic compound TiAl3 was highlighted. Experimental evidence and analysis of the data shows that, there was a two-stage process in the formation of TiAl₃ in the ARB Ti/Al reactive multilayered samples. Calorimetric and microstructural analyses also suggest that the interdiffusion of Al and Ti which led to solid solutions preceded the formation of intermetallic compounds. Despite the apparent chaos in the thickness of the ARB multilayered samples, the distribution of layer spacing did not become broad enough to lose the main features of the double exothermal behaviour. Isothermal DSC shows a larger Avarami constant in ARB Ti/Al multilayered structures than was found in Ti/Al thin films. A modified model based on thin films was set up to describe the kinetic characteristics of the formation of the intermetallic compound TiAl₃ in ARB samples.

Asymmetric accumulative roll bonding of aluminium-titanium composite sheets

Aluminium-titanium (Al/Ti) composite sheets were fabricated via asymmetric accumulative roll bonding (AARB), which capitalises on additional shear to enhance plastic deformation. Multi-layers of Al alloy (AA1050) and commercially-pure Ti sheets were alternatively stacked and rolled-bonded with varied roll diameter ratios (dr) ranging from 1 to 2, for up to four passes. Annealing of selected composite sheets was subsequently carried out at 600°C for 24h to compare the rates of solid-state diffusion reactions between Al and Ti components. Mechanical tests revealed that both tensile strength and ductility of the sheets increase systematically with dr. The microstructures and the Al/Ti interfaces of the sheets were analysed in detail using TEM, SEM and FIB techniques. It is shown that not only does AARB lead to a more refined grain size of the Al matrix but also it promotes the development of a nanostructured surface layer on Ti that comprises crystallites of 50-100nm in size, which is otherwise absent in the case of symmetric ARB (i.e. dr=1). The AARB-processed sheets exhibit a larger thickness of the interdiffusion layer at the Al/Ti interfaces than the counterparts processed via the symmetric ARB route, the difference being in excess of 15%. The effects and the implications of AARB processing on mechanical behaviour and diffusion kinetics are discussed with respect to the microstructural evolutions.

Evolution of microstructure and texture during deformation and recrystallization of heavily rolled Cu-Cu multilayer

A Cu-Cu multilayer processed by accumulative roll bonding was deformed to large strains and further annealed. The texture of the deformed Cu-Cu multilayer differs from the conventional fcc rolling textures in terms of higher fractions of Bs and RD-rotated cube components, compared with the volume fraction of Cu component. The elongated grain shape significantly affects the deformation characteristics. Characteristic microstructural features of both continuous dynamic recrystallization and discontinuous dynamic recrystallization were observed in the microtexture measurements. X-ray texture measurements of annealing of heavily deformed multilayer demonstrate constrained recrystallization and resulted in a bimodal grain size distribution in the annealed material at higher strains. The presence of cube- and BR-oriented grains in the deformed material confirms the oriented nucleation as the major influence on texture change during recrystallization. Persistence of cube component throughout the deformation is attributed to dynamic recrystallization. Evolution of RD-rotated cube is attributed to the deformation of cube components that evolve from dynamic recrystallization. The relaxation of strain components leads to Bs at larger strains. Further, the Bs component is found to recover rather than recrystallize during deformation. The presence of predominantly Cu and Bs orientations surrounding the interface layer suggests constrained annealing behavior.

Evolution of Texture and Microstructure in Deformed and Annealed Copper-Iron Multilayer

The effect of multiple phases on the evolution of texture during cold rolling and annealing of a copper-iron multilayer, fabricated by accumulative roll bonding, has been studied. The presence of an iron layer affects the deformation texture of the copper layer only at very large strains. On the other hand, a strong effect of copper on iron is observed at both small and large strains. At smaller strains, the larger deformation carried by the copper suppresses the texture development in the iron, whereas, at higher strains, selection of specific orientation relationship at the interface influences the texture of the iron layer. Shear banding and continuous dynamic recrystallization were found to influence the evolution of texture in the copper layer. The influence of large plastic deformation on the recrystallization behavior of copper is demonstrated with the suppression of typical fcc annealing texture components, described as constrained recrystallization. Evolution of typical annealing texture component is suppressed because of the multilayer microstructure. The plane of the interface formed during deformation is determined by a combination of the rolling texture of individual phases, constrained annealing, and the tendency to form a low-energy interface between the two phases during annealing.

Effects of deformation-induced heating on bond strength of rolled metal multilayer

The bond strength of various metal multilayers produced by cold rolling of metal foils with different thermal conductivity was investigated. Results indicated that under the same conditions of deformation and surface preparation, the metallic multilayer system with low thermal conductivity exhibited relative high bond strength while high thermal conductivity metal system may fail to be roll-bonded together. The relationship between the deformation-induced localized heating and the bond strength were discussed. The deformation-induced localized heating in the low thermal conductivity metal multilayer systems may provide opportunities for achieving a successful accumulative roll bonding or a “cold roll/heat treatment/cold roll” process to synthesize metallic multilayer materials.

Influence of deformation-induced heating on the bond strength of rolled metal multilayers

The bond strength of various metal multilayers produced by cold rolling of metal foils with different thermal conductivity was investigated. Results indicated that the metallic multilayer system with low thermal conductivity exhibited relative high bond strength while high thermal conductivity metal system may fail to be roll-bonded together. The relationship between the deformation-induced localized heating and the bond strength were discussed.