Influence of kaolinite/carbon black hybridization on combustion and thermal decomposition behaviors of NR composites

A series of NR composites filled with modified kaolinite (MK), carbon black (CB) and the hybrid fillercontained MK and CB, were prepared by melt blending. The microstructure, combustion and thermaldecomposition behaviors of NR composites were characterized by TEM, XRD, infrared spectroscopy, conecalorimeter test (CCT) and thermal-gravimetric analysis (TG). The results show that the filler hybridizationcan improve the dispensability and shape of the kaolinite sheets in the rubber matrix and change theinterface bond between kaolinite particles and rubber molecules. NR-3 filled by 10 phr MK and 40 phr CBhas the lowest heat release rate (HRR), mass loss rate (MLR), total heat release (THR), smoke productionrate (SPR) and the highest char residue among all the NR composites. Therefore, the hybridization ofthe carbon black particles with the kaolinite particles can effectively improve the thermal stability andcombustion properties of NR composites.

Investigating limitations of SURF approach for thermal imaging analysis and mapping

Wildlife conservation involves an understanding of a specific animal, its environment and the interaction within a local ecosystem. Unmanned Aerial Vehicles (UAVs) present cost effective, non-intrusive solution for detecting animals over large areas and the use thermal imaging cameras offer the ability detect animals that would otherwise be concealed to visible light cameras. This report examines some of limitations on using SURF for the development of large maps using multiple stills images extracted from the thermal imaging video camera which contain wildlife (eg. Koala in them).

Thermal sensitivity analysis of spacecraft battery

Transient thermal sensitivity is studied for systems that are subjected to conductive heat transfer within themselves and radiative heat transfer with the surrounding environment, including solar heat radiation, The battery in the Indian national communication satellite is one such system for which the studies are conducted with respect to panel conduction, conductance of insulating blanket, power dissipation within the battery, and absorptance and emittance of various elements, Comparison of sensitivities revealed that battery temperature is sensitive to its power dissipation during the beginning of life of the spacecraft, whereas toward the end of life of the spacecraft mission, the effect of absorptance of optical solar reflector is dominating, The influence of optical property values of the multilayer insulation blanket is almost negligible. Among the parameters studied in this analysis, the battery temperature is found to be mast sensitive to emittance of the optical solar reflector.

Thermal vibration analysis of orthotropic nanoplates based on nonlocal continuum mechanics

This paper presents the thermal vibration analysis of orthotropic nanoplates such as graphene, using the two variable refined plate theory and nonlocal continuum mechanics for small scale effects. The nanoplate is modeled based on two variable refined plate theory and the axial stress caused by the thermal effects is also considered. The two variable refined plate theory takes account of transverse shear effects and parabolic distribution of the transverse shear strains through the thickness of the plate, hence it is unnecessary to use shear correction factors. Nonlocal governing equations of motion for the nanoplate are derived from the principle of virtual displacements. The closed form solution for thermal-vibration frequencies of a simply supported rectangular nanoplate has been obtained by using Navier's method of solution. Numerical results obtained by the present theory are compared with available solutions in the literature and the molecular dynamics results. The influences of the small scale coefficient, the room or low temperature, the high temparature, the half wave number and the aspect ratio of nanoplate on the natural frequencies are considered and discussed in detail. It can be concluded that the present theory, which does not require shear correction factor, is not only simple but also comparable to the first-order and higher order shear deformation theory. The present analysis results can be used for the design of the next generation of nanodevices that make use of the thermal vibration properties of the nanoplates. (C) 2012 Elsevier B.V. All rights reserved.

Thermal vibration analysis of monolayer graphene embedded in elastic medium based on nonlocal continuum mechanics

This paper presents the thermal vibration analysis of single-layer graphene sheet embedded in polymer elastic medium, using the plate theory and nonlocal continuum mechanics for small scale effects. The graphene is modeled based on continuum plate theory and axial stress caused by the thermal effects is also considered. Nonlocal governing equation of motion for this graphene sheet system is derived from the principle of virtual displacements. The closed form solution for thermal-vibration frequencies of a simply supported rectangular nanoplate has been obtained by using the Navier's method of solution. Numerical results obtained by the present theory are compared with available solutions in the literature and the molecular dynamics results. The influences of the small scale coefficient, the room or low temperature, the high temperature, the half wave number and the aspect ratio of nanoplate on the natural frequencies are considered and discussed in detail. The thermal vibration analysis of single- and double-layer graphene sheets are considered for the analysis. The mode shapes of the respective graphene system are also captured in this work. The present analysis results can be used for the design of the next generation of nanodevices that make use of the thermal vibration properties of the graphene.

Thermal Strain Analysis of a Flip-Chip Package by a Modified Hybrid Method

介绍一种可用于微电子封装局部应变场分析的实验/计算混合方法,该方法结合了有限元的整体/局部模型和实时的激光云纹干涉技术,利用激光云纹干涉技术所测得的应变场来校核有限元整体模型的计算结果,并用整体模型的结果作为局部模型的边界条件,对实验难以确定的封装结构局部位置的应力、应变场进行分析.用这种方法对可控坍塌倒装封装结构在热载荷作用下焊球内的应变场分布进行了分析,结果表明该方法能够提供封装结构内应力-应变场分布的准确和可靠的结果,为微电子封装的可靠性分析提供重要的依据. For the reliability analysis of electronic packages, strains in very localized areas, such as an interconnection or a corner, need to be determined. In this paper, a modified hybrid method of global/local modeling and real time moire interferometry is presented. In this method, a simplified, coarsely meshed global model is developed to get rough information about the deformation of the microelectronic package. In order to make sure the global model has been reasonably simplified and the material properties ...

A thermal-elastic analysis on laser-induced reverse bulging and plugging in circular brass foil

A new failure mode is observed in circular brass foils induced by laser beam. The new failure is based on the following experimental facts : (1) the peripheries of the circular brass foils are fixed and the surfaces of the foils are radiated by laser beam ; (2) the laser beam used is considered to be non-Gaussian spatially, actually an approximately uniform distribution limited in a certain size spot ; (3) the pulse on time of laser beam should be 250 μs, i.e. so called long duration pulse laser. The failure process consists of three stages ; i.e. thermal bulging, localized shear deformation and perforation by plugging. The word reverse in reverse bulging and plugging mode means that bulging and plugging occur in the direction of incident laser beam. To study the newly-discovered type of failure quantitatively, analytical solutions for the axisymmetric temperature field and deflection curve are derived. The calculated results show that the newly discovered failure mode is attributed to the spatial structure effect of laser beam indeed.

Thermal-creep analysis of concrete bridges

The creep effects on sequentially built bridges are analysed by the theory of thermal creep. Two types of analysis are used: time dependent and steady state. The traditional uniform creep analysis is also introduced briefly. Both simplified and parabolic normalising creep-temperature functions are used in the analysis for comparison. Numerical examples are presented, calculated by a computer program based on the theory of thermal creep and using the displacement method. It is concluded that different assumptions within thermal creep can lead to very different results when compared with uniform creep analysis. The steady-state analysis of monolithically built structures can serve as a limit to evaluate total creep effects for both monolithically and sequentially built structures. The importance of the correct selection of the normalising creep-temperature function is demonstrated.

Coupled thermal-magnetic analysis on thermally actuated superconducting flux pump

This paper presents numerical analysis of the thermally actuated superconducting flux pump. Visualization of the behavior of the magnetic flux helps our understanding of flux injection mechanism. In addition, in order to confirm validity of the result, we conducted a preliminary flux pump experiment. This result qualitatively agrees well with the experimental one. The flux pump system utilizes a particular behavior that permeability of some materials such as Gadolinium is sensitive to the temperature. In this paper a simple heater is used to control the flux pump system. © 2010 IEEE.

Thermal stress analysis for GaInAsP multiple quantum well wafer chemically bonded to Si (100)

An n-InP-based InGaAsP multiple-quantum-well wafer was bonded with p-Si by chemical surface activated bonding at 70 degrees C, and then annealed at 450 degrees C. Different thermal expansion coefficients between InP and Si will induce thermal stresses in the bonded wafer. Planar and cross-sectional distributions of thermal stress in the bonded InP-Si pairs were analyzed by a two-dimensional finite element method. In addition, the normal, peeling, and shear stresses were calculated by an analytic method. Furthermore, x-ray double crystalline diffraction was applied to measure the thermal strain and the strain caused by the mismatching of the crystalline orientation between InP (100) and Si (100). The wavelength redshift of the photoluminescence (PL) spectrum due to thermal strain was investigated via the calculation of the band structure, which is in agreement with the measured PL spectra.

Super-FRS超导磁体失超瞬态热应力分析；Quench transient thermal stress analysis of super-FRS dipoles

国际反质子与离子大科学工程(FAIR)项目是一个大型的国际合作项目,其中Super-FRS超导二极磁体由中国科学院近代物理研究所研制。利用ADINA有限元程序对项目中的超导Super-FRS磁体线圈的失超过程进行了模拟分析。利用C程序对ADINA程序进行二次开发以便对有限元求解器的调用和载荷的控制。分析结果显示:在失超过程中产生的最大热应力为26 MPa,可能产生的声波频率在35 Hz左右。