937 resultados para Standard IEEE 1149.1.


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The increasing complexity of VLSI circuits and the reduced accessibility of modern packaging and mounting technologies restrict the usefulness of conventional in-circuit debugging tools, such as in-circuit emulators for microprocessors and microcontrollers. However, this same trend enables the development of more complex products, which in turn require more powerful debugging tools. These conflicting demands could be met if the standard scan test infrastructures now common in most complex components were able to match the debugging requirements of design verification and prototype validation. This paper analyses the main debug requirements in the design of microprocessor-based applications and the feasibility of their implementation using the mandatory, optional and additional operating modes of the standard IEEE 1149.1 test infrastructure.

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Tests on printed circuit boards and integrated circuits are widely used in industry,resulting in reduced design time and cost of a project. The functional and connectivity tests in this type of circuits soon began to be a concern for the manufacturers, leading to research for solutions that would allow a reliable, quick, cheap and universal solution. Initially, using test schemes were based on a set of needles that was connected to inputs and outputs of the integrated circuit board (bed-of-nails), to which signals were applied, in order to verify whether the circuit was according to the specifications and could be assembled in the production line. With the development of projects, circuit miniaturization, improvement of the production processes, improvement of the materials used, as well as the increase in the number of circuits, it was necessary to search for another solution. Thus Boundary-Scan Testing was developed which operates on the border of integrated circuits and allows testing the connectivity of the input and the output ports of a circuit. The Boundary-Scan Testing method was converted into a standard, in 1990, by the IEEE organization, being known as the IEEE 1149.1 Standard. Since then a large number of manufacturers have adopted this standard in their products. This master thesis has, as main objective: the design of Boundary-Scan Testing in an image sensor in CMOS technology, analyzing the standard requirements, the process used in the prototype production, developing the design and layout of Boundary-Scan and analyzing obtained results after production. Chapter 1 presents briefly the evolution of testing procedures used in industry, developments and applications of image sensors and the motivation for the use of architecture Boundary-Scan Testing. Chapter 2 explores the fundamentals of Boundary-Scan Testing and image sensors, starting with the Boundary-Scan architecture defined in the Standard, where functional blocks are analyzed. This understanding is necessary to implement the design on an image sensor. It also explains the architecture of image sensors currently used, focusing on sensors with a large number of inputs and outputs.Chapter 3 describes the design of the Boundary-Scan implemented and starts to analyse the design and functions of the prototype, the used software, the designs and simulations of the functional blocks of the Boundary-Scan implemented. Chapter 4 presents the layout process used based on the design developed on chapter 3, describing the software used for this purpose, the planning of the layout location (floorplan) and its dimensions, the layout of individual blocks, checks in terms of layout rules, the comparison with the final design and finally the simulation. Chapter 5 describes how the functional tests were performed to verify the design compliancy with the specifications of Standard IEEE 1149.1. These tests were focused on the application of signals to input and output ports of the produced prototype. Chapter 6 presents the conclusions that were taken throughout the execution of the work.

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IEEE 1451 is Standard to connect transduscers through a communication network. This article describes a supervisory system implementaion according to IEEE 1451 Standard using Java. This software, named NCAP, may be used in several industrial applications, besides making feasible to obtain TEDS as a report or by Internet. NCAP communicates with transduscer module through RS232 Interface and was testes in industrial automation processes. © 2009 IEEE.

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Os sensores inteligentes são dispositivos que se diferenciam dos sensores comuns por apresentar capacidade de processamento sobre os dados monitorados. Eles tipicamente são compostos por uma fonte de alimentação, transdutores (sensores e atuadores), memória, processador e transceptor. De acordo com o padrão IEEE 1451 um sensor inteligente pode ser dividido em módulos TIM e NCAP que devem se comunicar através de uma interface padronizada chamada TII. O módulo NCAP é a parte do sensor inteligente que comporta o processador. Portanto, ele é o responsável por atribuir a característica de inteligência ao sensor. Existem várias abordagens que podem ser utilizadas para o desenvolvimento desse módulo, dentre elas se destacam aquelas que utilizam microcontroladores de baixo custo e/ou FPGA. Este trabalho aborda o desenvolvimento de uma arquitetura hardware/software para um módulo NCAP segundo o padrão IEEE 1451.1. A infra-estrutura de hardware é composta por um driver de interface RS-232, uma memória RAM de 512kB, uma interface TII, o processador embarcado NIOS II e um simulador do módulo TIM. Para integração dos componentes de hardware é utilizada ferramenta de integração automática SOPC Builder. A infra-estrutura de software é composta pelo padrão IEEE 1451.1 e pela aplicação especí ca do NCAP que simula o monitoramento de pressão e temperatura em poços de petróleo com o objetivo de detectar vazamento. O módulo proposto é embarcado em uma FPGA e para a sua prototipação é usada a placa DE2 da Altera que contém a FPGA Cyclone II EP2C35F672C6. O processador embarcado NIOS II é utilizado para dar suporte à infra-estrutura de software do NCAP que é desenvolvido na linguagem C e se baseia no padrão IEEE 1451.1. A descrição do comportamento da infra-estrutura de hardware é feita utilizando a linguagem VHDL

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This paper presents a NCAP embedded on DE2 kit with Nios II processor and uClinux to development of a network gateway with two interfaces, wireless (ZigBee) and wired (RS232) based on IEEE 1451. Both the communications, wireless and wired, were developed to be point-to-point and working with the same protocols, based on IEEE 1451.0-2007. The tests were made using a microcomputer, which through of browser was possible access the web page stored in the DE2 kit and send commands of control and monitoring to both TIMs (WTIM and STIM). The system describes a different form of development of the NCAP node to be applied in different environments with wired or wireless in the same node. © 2011 IEEE.

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The unprecedented and relentless growth in the electronics industry is feeding the demand for integrated circuits (ICs) with increasing functionality and performance at minimum cost and power consumption. As predicted by Moore's law, ICs are being aggressively scaled to meet this demand. While the continuous scaling of process technology is reducing gate delays, the performance of ICs is being increasingly dominated by interconnect delays. In an effort to improve submicrometer interconnect performance, to increase packing density, and to reduce chip area and power consumption, the semiconductor industry is focusing on three-dimensional (3D) integration. However, volume production and commercial exploitation of 3D integration are not feasible yet due to significant technical hurdles.

At the present time, interposer-based 2.5D integration is emerging as a precursor to stacked 3D integration. All the dies and the interposer in a 2.5D IC must be adequately tested for product qualification. However, since the structure of 2.5D ICs is different from the traditional 2D ICs, new challenges have emerged: (1) pre-bond interposer testing, (2) lack of test access, (3) limited ability for at-speed testing, (4) high density I/O ports and interconnects, (5) reduced number of test pins, and (6) high power consumption. This research targets the above challenges and effective solutions have been developed to test both dies and the interposer.

The dissertation first introduces the basic concepts of 3D ICs and 2.5D ICs. Prior work on testing of 2.5D ICs is studied. An efficient method is presented to locate defects in a passive interposer before stacking. The proposed test architecture uses e-fuses that can be programmed to connect or disconnect functional paths inside the interposer. The concept of a die footprint is utilized for interconnect testing, and the overall assembly and test flow is described. Moreover, the concept of weighted critical area is defined and utilized to reduce test time. In order to fully determine the location of each e-fuse and the order of functional interconnects in a test path, we also present a test-path design algorithm. The proposed algorithm can generate all test paths for interconnect testing.

In order to test for opens, shorts, and interconnect delay defects in the interposer, a test architecture is proposed that is fully compatible with the IEEE 1149.1 standard and relies on an enhancement of the standard test access port (TAP) controller. To reduce test cost, a test-path design and scheduling technique is also presented that minimizes a composite cost function based on test time and the design-for-test (DfT) overhead in terms of additional through silicon vias (TSVs) and micro-bumps needed for test access. The locations of the dies on the interposer are taken into consideration in order to determine the order of dies in a test path.

To address the scenario of high density of I/O ports and interconnects, an efficient built-in self-test (BIST) technique is presented that targets the dies and the interposer interconnects. The proposed BIST architecture can be enabled by the standard TAP controller in the IEEE 1149.1 standard. The area overhead introduced by this BIST architecture is negligible; it includes two simple BIST controllers, a linear-feedback-shift-register (LFSR), a multiple-input-signature-register (MISR), and some extensions to the boundary-scan cells in the dies on the interposer. With these extensions, all boundary-scan cells can be used for self-configuration and self-diagnosis during interconnect testing. To reduce the overall test cost, a test scheduling and optimization technique under power constraints is described.

In order to accomplish testing with a small number test pins, the dissertation presents two efficient ExTest scheduling strategies that implements interconnect testing between tiles inside an system on chip (SoC) die on the interposer while satisfying the practical constraint that the number of required test pins cannot exceed the number of available pins at the chip level. The tiles in the SoC are divided into groups based on the manner in which they are interconnected. In order to minimize the test time, two optimization solutions are introduced. The first solution minimizes the number of input test pins, and the second solution minimizes the number output test pins. In addition, two subgroup configuration methods are further proposed to generate subgroups inside each test group.

Finally, the dissertation presents a programmable method for shift-clock stagger assignment to reduce power supply noise during SoC die testing in 2.5D ICs. An SoC die in the 2.5D IC is typically composed of several blocks and two neighboring blocks that share the same power rails should not be toggled at the same time during shift. Therefore, the proposed programmable method does not assign the same stagger value to neighboring blocks. The positions of all blocks are first analyzed and the shared boundary length between blocks is then calculated. Based on the position relationships between the blocks, a mathematical model is presented to derive optimal result for small-to-medium sized problems. For larger designs, a heuristic algorithm is proposed and evaluated.

In summary, the dissertation targets important design and optimization problems related to testing of interposer-based 2.5D ICs. The proposed research has led to theoretical insights, experiment results, and a set of test and design-for-test methods to make testing effective and feasible from a cost perspective.

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The aim of this paper is to deepen in the terminology of Records Management established by ISO standards, through a concrete example such as an interlinguistic comparison between UNE ISO 15489-1 and DIN ISO 15489-1, that is, between the Spanish and German versions of the ISO 15489-1. For that, the text is divided into two major and complementary parts, which are similar to both analytical perspectives adopted: the semantic one and the pragmatic one. The first one compares the words per se, taking into account the significant or word form as well as the significance or meaning. In the second part, examples of use from both languages are discussed, concerning the three terms considered essential in the text (Record, Records Management System and Records Management). The main conclusion lies in understanding how important the language is as a discrete tool of work for all information scientists, specially concerning to the standards, where the translators must show their best linguistic strategies to go unnoticed.

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Current IEEE 802.11 wireless networks are vulnerable to session hijacking attacks as the existing standards fail to address the lack of authentication of management frames and network card addresses, and rely on loosely coupled state machines. Even the new WLAN security standard - IEEE 802.11i does not address these issues. In our previous work, we proposed two new techniques for improving detection of session hijacking attacks that are passive, computationally inexpensive, reliable, and have minimal impact on network performance. These techniques utilise unspoofable characteristics from the MAC protocol and the physical layer to enhance confidence in the intrusion detection process. This paper extends our earlier work and explores usability, robustness and accuracy of these intrusion detection techniques by applying them to eight distinct test scenarios. A correlation engine has also been introduced to maintain the false positives and false negatives at a manageable level. We also explore the process of selecting optimum thresholds for both detection techniques. For the purposes of our experiments, Snort-Wireless open source wireless intrusion detection system was extended to implement these new techniques and the correlation engine. Absence of any false negatives and low number of false positives in all eight test scenarios successfully demonstrated the effectiveness of the correlation engine and the accuracy of the detection techniques.

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In this paper, a low-power, highly linear, integrated, active-RC filter exhibiting a multi-standard (IEEE 802.11a/b/g and DVB-H) application and bandwidth (3MHz, 4MHz, 9.5MHz) is present. The filter exploits digitally-controlled polysilicon resister banks and an accurate automatic tuning scheme to account for process and temperature variations. The automatic frequency calibration scheme provides better than 3% corner frequency accuracy. The Butterworth filter is design for receiver (WLAN and DVB-H mode) and transmitter (WLAN mode). The filter dissipation is 3.4 mA in RX mode and 2.3 mA (only for one path) in TX mode from 2.85-V supply. The dissipation of calibration consumes 2mA. The circuit has been fabricated in a 0.35um 47-GHz SiGe BiCMOS technology, the receiver and transmitter occupy 0.28-mm(2) and 0.16-mm(2) (calibration circuit excluded), respectively.

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Debugging electronic circuits is traditionally done with bench equipment directly connected to the circuit under debug. In the digital domain, the difficulties associated with the direct physical access to circuit nodes led to the inclusion of resources providing support to that activity, first at the printed circuit level, and then at the integrated circuit level. The experience acquired with those solutions led to the emergence of dedicated infrastructures for debugging cores at the system-on-chip level. However, all these developments had a small impact in the analog and mixed-signal domain, where debugging still depends, to a large extent, on direct physical access to circuit nodes. As a consequence, when analog and mixed-signal circuits are integrated as cores inside a system-on-chip, the difficulties associated with debugging increase, which cause the time-to-market and the prototype verification costs to also increase. The present work considers the IEEE1149.4 infrastructure as a means to support the debugging of mixed-signal circuits, namely to access the circuit nodes and also an embedded debug mechanism named mixed-signal condition detector, necessary for watch-/breakpoints and real-time analysis operations. One of the main advantages associated with the proposed solution is the seamless migration to the system-on-chip level, as the access is done through electronic means, thus easing debugging operations at different hierarchical levels.

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In questo lavoro, dopo un'introduzione sul panorama contemporaneo, si è analizzato lo standard IEEE 802.21, illustrandone i motivi che hanno portato al suo sviluppo, la timeline del processo di standardizzazione, gli obbiettivi del working group, l'architettura del sistema specificato e le sue funzionalità, con particolare riguardo all'utilità in applicazioni reali, al fine di darne un giudizio completo sulla sua effettiva efficacia. Dopo aver citato qualche esempio di possibile applicazione dello standard e descritto lo stato attuale dell'arte, si è studiata una sua implementazione cross-platform chiamata ODTONE, descrivendone i vari componenti e le loro funzionalità, ma anche sottolineando le attuali mancanze per arrivare ad una implementazione completa sotto tutti i punti di vista. Successivamente si è studiata ed implementata un'applicazione, MIH-proxy, che potesse sfruttare in modo costruttivo i servizi specificati dallo standard per creare un proxy che potesse scegliere su quale interfaccia instradare i pacchetti a seconda dello stato attuale di tutti i collegamenti, realizzato in versione unidirezionale e bidirezionale. In particolare questa applicazione è in grado di restare in ascolto di cambiamenti di stato delle interfacce di rete, e.g. quando viene stabilita una connessione oppure cade, e, di conseguenza, stabilire di volta in volta quali collegamenti utilizzare per inviare dati. Nella versione bidirezionale è anche possibile far comunicare tra loro applicazioni che normalmente utilizzerebbero il protocollo di trasporto TCP attraverso un ulteriore componente, phoxy, che si preoccupa di convertire, in modo trasparente, un flusso TCP in datagrammi UDP eventualmente cifrati. Sarà quindi possibile creare un collegamento criptato ad alta affidabilità tra le applicazioni che possa sfruttare tutte le interfacce disponibili, sia per inviare, sia per ricevere.

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Lo scopo di questa tesi è quello di illustrare gli standard IEEE 802.22 WRAN e IEEE 802.16e Mobile WiMAX. Di questi standard verranno analizzate le caratteristiche principali, i metodi di funzoinamento ed alcuni protocolli. Nel primo capitolo viene fatta una breve spiegazione delle tecnologie wireless con un focus sullo spettro radio, sulle tecniche di modulazione dell’onda radio, sugli scenari operativi LOS, nLOS ed NLOS, sulle tecniche di duplexing e le tecniche di accesos multiplo, inoltre vengono brevente illustrate alcune delle problematiche che affliggono le trasmissioni senza fili ed infine vengono illustrate i quattro più comuni livelli di QoS. Nel secondo capitolo viene illustrato lo standard IEEE 802.22 con un focus sullo stato dell’arte della tecnologia WRAN, come si è sviluppato lo standard e per quali motivi è stato redatto, lo spettro di frequeza utilizzato e come, il funzionamento delle Cognitive Radio, i dispositivi che caratterizzano le reti WRAN e la topologia di rete utilizzata. In seguito sono spiegati nello specifico i livelli fisico e MAC e le loro caratteristiche e metodi di funzionamento. Nel terzo capitolo vengono illustrate le caratteristiche dello standard IEEE 802.16e cercando di riprendere gli stessi punti toccati nel capitolo precedente con una caratterizzazione dello standard nei suoi particolari.

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The widespread deployment of wireless mobile communications enables an almost permanent usage of portable devices, which imposes high demands on the battery of these devices. Indeed, battery lifetime is becoming one the most critical factors on the end-users satisfaction when using wireless communications. In this work, the optimized power save algorithm for continuous media applications (OPAMA) is proposed, aiming at enhancing the energy efficiency on end-users devices. By combining the application specific requirements with data aggregation techniques, {OPAMA} improves the standard {IEEE} 802.11 legacy Power Save Mode (PSM) performance. The algorithm uses the feedback on the end-user expected quality to establish a proper tradeoff between energy consumption and application performance. {OPAMA} was assessed in the OMNeT++ simulator, using real traces of variable bitrate video streaming applications, and in a real testbed employing a novel methodology intended to perform an accurate evaluation concerning video Quality of Experience (QoE) perceived by the end-users. The results revealed the {OPAMA} capability to enhance energy efficiency without degrading the end-user observed QoE, achieving savings up to 44 when compared with the {IEEE} 802.11 legacy PSM.