Influência dos parâmetros térmicos de solidificação na transição colunar/equiaxial em ligas do sistema Sn-Pb sob condições transitórias de extração de calor

O principal objetivo deste trabalho é desenvolver um estudo teórico/experimental sobre a influência dos parâmetros térmicos de solidificação (V _L e T) na transição colunar/equiaxial das ligas Sn 5%Pb, Sn 15%Pb, Sn 20%Pb e Sn 25%Pb sob condições de solidificação unidirecional horizontal refrigerada à água. Inicialmente, são calculadas experimentalmente as velocidades da isoterma líquidus e as taxas de resfriamento das ligas em questão cujos resultados são comparados com as previsões teóricas de um modelo numérico. Em seguida, a posição da transição colunar/equiaxial é determinada por meio da análise macroestrutural assim como são avaliados os efeitos impostos por correntes convectivas devido ao efeito do soluto no comportamento da transição colunar/equiaxial das referidas ligas. Finalmente, é realizado um estudo experimental comparativo para as ligas estudadas quando solidificadas unidirecionalmente em diferentes sistemas refrigerados à água.

Influência da convecção termossolutal nos espaçamentos dendríticos primários durante a solidificação direcional horizontal de ligas Sn-Pb

Este trabalho apresenta um estudo teórico-experimental sobre os efeitos da convecção termossolutal sobre os espaçamentos dendríticos primários de ligas hipoeutéticas Sn-Pb. Assim, um dispositivo experimental de configuração horizontal refrigerado a água foi construído e amostras do referido sistema de ligas foram solidificadas direcionalmente sob condições transientes de extração de calor. Um método teórico-experimental é aplicado para determinar as velocidades de deslocamento da isoterma liquidus, os gradientes térmicos e as taxas de resfriamento. São também apresentados resultados para os respectivos coeficientes de transferência de calor na interface metal/molde os quais foram calculados a partir de uma análise comparativa realizada entre os perfis experimentais de temperatura e valores teóricos fornecidos por um método numérico baseado em volumes finitos. Alguns modelos teóricos para a previsão dos espaçamentos dendríticos primários são comparados com os resultados experimentais obtidos. Finalmente, um estudo comparativo é realizado entre resultados encontrados neste trabalho e aqueles apresentados na literatura para os espaçamentos dendríticos primários das ligas Sn-Pb investigadas quando solidificadas direcionalmente nos sistemas verticais ascendente e descendente, sob as mesmas condições. A análise das microestruturas indica que os espaçamentos dendríticos primários são bastante influenciados pela direção de crescimento do sólido.

Espaçamentos dendríticos primários da liga Sn-5%Pb solidificada direcionalmente em um sistema horizontal

Este trabalho desenvolve um estudo teórico-experimental sobre a correlação entre parâmetros térmicos e os espaçamentos dendríticos primários da liga Sn-5%Pb solidificada direcionalmente em um sistema horizontal sob condições transientes de extração de calor. Os perfis de temperatura foram medidos em diferentes posições do lingote e os dados obtidos foram armazenados automaticamente. São apresentados resultados para o coeficiente de transferência de calor na interface metal/molde o qual foi calculado a partir de uma análise comparativa entre os perfis térmicos experimentais e valores teóricos fornecidos por um modelo numérico. Um método teórico-experimental é aplicado para determinar as velocidades de deslocamento da isoterma liquidus e as taxas de resfriamento. Os resultados teóricos e experimentais levantados apresentaram boa concordância. Um estudo comparativo é realizado entre os dados encontrados neste trabalho e aqueles apresentados na literatura para os espaçamentos dendríticos primários da liga investigada quando solidificada direcionalmente nos sistemas verticais ascendente e descendente, sob as mesmas condições assumidas neste trabalho. A análise das microestruturas indica que os espaçamentos dendríticos primários são bastante influenciados pelos parâmetros térmicos de solidificação.

Microstructure and mechanical properties of spray-formed Al-Si-Pb alloys

Liquid phase co-spray forming (LPCSF) was employed to produce two Al-Si-Pb alloys. The preforms thus obtained were then subjected to hot extrusion at different extrusion ratios. Following extrusion, the materials were tensile tested at room temperature. The distribution of Pb particles and the microstructural characterization in as-formed preforms and in the extruded rods were studied on the basis of SEM observation. The influence of the Pb content on the mechanical properties was investigated. (C) 2002 Published by Elsevier Science B.V.

Proximity effect in Ag-Pb alloys

The superconducting properties and the microstructure of the Ag_100-xPb_x alloys, 1 ≤ x ≤ 5, prepared by rapid quenching from the liquid state with and without subsequent heat treatments, have been studied. The x-ray diffraction measurements show that supersaturated solid solutions of Pb in Ag can be obtained up to 3.2 at.% Pb as compared to less than 0.1 at.% Pb at equilibrium. It was found that by suitable heat treatment it is possible to vary the size and distribution of the Pb precipitates in the Ag matrix and reproducible superconducting properties in the alloy can be observed. The superconducting transition temperature of these samples can be qualitatively explained by the Silvert and Singh's theoretical calculation. The theory developed for the case of layer structure can be extended to three dimensions to explain the critical current versus temperature behavior. The critical current versus field behavior of these alloys can be explained by the modification of the Josephson effect. Combining these results together with the critical magnetic field measurements and the microstructure studies of the alloys, it can be concluded that the three-dimensional proximity effect is the main mechanism for the superconductivity in the Ag-Pb alloys. Based on the Hilsch empirical formula which was based on experimental results obtained on layer structures, the experimental data in this investigation show that the electron-phonon-electron interaction in silver is attractive. The interaction parameter NV obtained is approximately 0.06, which would lead to a value of 10^-5 °K for the superconducting transition temperature of Ag. These values are in agreement with other determinations which were done on vapor-deposited metallic film sandwiches. Hence, the Hilsch empirical relation valid for layer structures is also valid in the three-dimensional case. Because the transition temperature and the critical current can be varied in a wide range by controlling the heat treatments, the Ag-Pb superconductors might have some useful applications.

In(Ti,Sn)-O 与Sn(Pb)Zn-Te 的电子结构研究

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Continuous production of metal matrix composites from the semisolid state

Continuous strip metal matrix composite (MMC) casting of 0.3 mm diameter hard-drawn stainless steel (316L) wire in a quasi-eutectic SnPb (64Sn36Pb) matrix was performed by a two-roll melt drag processing (TRMDping) method, with the wire being dragged through a semisolid puddle with a fibre contact time of approximately 0.2 s. A slag weir placed at the nozzle contained two wire guide holes: one located near the upper roll, and the other located between the rolls. A successful continuous composite strip casting with good fibre alignment was achieved by inserting and embedding the wire into the matrix using the guide hole between the rolls. Degeneration of eutectic/dendrite structures led to the formation of globular structures. The occurrence and formation mechanisms of cracks, de-lamination and voids in the matrix were discussed. TRMDping is economically viable and has significant benefits over other MMC fabrication methods. © (2013) Trans Tech Publications, Switzerland.

Electrical and Superconducting Properties in Lap Joints for YBCO Tapes

Conselho Nacional de Desenvolvimento Científico e Tecnológico (CNPq)

Morphology and thermal characteristics of nano-sized Pb-Sn inclusions in Al

Nanoembedded aluminum alloys with bimetallic dispersoids of Sn and Pb of compositions Sn-82-Pb-18,Pb- Sn-64-Pb-36, and Sn-54-Pb-46 were synthesized by rapid solidification. The two phases, face-centered-cubic Pb and tetragonal Sn solid-solution, coexist in all the particles. The crystallographic relation between the two phases and the matrix depends upon the solidification pathways adopted by the particles. For Al-(Sn-82-Pb-18), we report a new orientation relation given by [011]Al//[010]Sn and (011)Al//(101)Sn. Pb exhibits a cube-on-cube orientation with Al in few particles, while in others no orientation relationship could be observed. In contrast, Pb in Sn-64-Pb-36 and Sn-54-Pb-46 particles always exhibits cube-on-cube orientation with the matrix. Sn does not show any orientation relationship with Al or Pb in these cases. Differential scanning calorimetry studies revealed melting at eutectic temperature for all compositions, although solidification pathways are different. Attempts were made to correlate these with the melting and heterogeneous nucleation. characteristics.

Numerical studies on columnar-to-equiaxed transition in directional solidification of binary alloys

A numerical study on columnar-to-equiaxed transition (CET) during directional solidification of binary alloys is presented using a macroscopic solidification model. The position of CET is predicted numerically using a critical cooling rate criterion reported in literature. The macroscopic solidification model takes into account movement of solid phase due to buoyancy, and drag effect on the moving solid phase because of fluid motion. The model is applied to simulate the solidification process for binary alloys (Sn-Pb) and to estimate solidification parameters such as position of the liquidus, velocity of the liquidus isotherm, temperature gradient ahead of the liquidus, and cooling rate at the liquidus. Solidification phenomena under two cooling configurations are studied: one without melt convection and the other involvin thermosolutal convection. The numerically predicted positions of CET compare well with those of experiments reported in literature. Melt convection results in higher cooling rate, higher liquidus isotherm velocities, and stimulation of occurrence of CET in comparison to the nonconvecting case. The movement of solid phase aids further the process of CET. With a fixed solid phase, the occurrence of CET based on the same critical cooling rate is delayed and it occurs at a greater distance from the chill.

The effects of humidity on tin whisker growth by immersion tin plating and tin solder dipping surface finishes

The drive to replace lead (Pb) from electronics has led to the replacement of tin (Sn) alloys as the terminal plating for electronic devices. However, the deposition of Sn based alloys as the component surface finish tends to induce Sn whisker that causes unintended electric shorts when the conductive whiskers grow across to the adjacent conductor. Internal stress is considered as the driving force that causes the growth of Sn whiskers. In this study, stress type of elevated temperature/ humidity exposure at 55C/85%RH with the storage for up to 24 months was conducted to define the acceleration factor in samples with deposition of immersion Sn plating and Sn solder dipping. The addition of Nickel (Ni) under-layer was also applied to examine the correlation to field conditions. The results showed that the whisker length increased in high humidity irrespective of the deposition methods. It was also shown that pure Sn solder dipping mitigated the whisker growth but does not completely prevent it when alloying Sn with 0.4%wtCu. Additionally, Ni under-layer was indicated to be more efficient in mitigating the growth of whisker by prolonging the incubation time for whisker formation.

Heterogeneous nucleation of pb particles embedded in a Zn matrix

Zinc-10 and 20 wt pct Pb alloys have been rapidly solidified by melt spinning to obtain a very fine scale dispersion of nanometer-sized Pb particles embedded in Zn matrix. The microstructure and crystallography of the Pb particles have been studied using transmission electron microscopy (TEM). Each embedded Pb particle is a single crystal, with a truncated hexagonal biprism shape with the 6/mmm Zn matrix point group symmetry surrounded by and { 0001 á },\text { \text10[`\text1] \text0 },\text and { \text10[`\text1] \text1 }0001 1010 and 1011 facets. The Pb particles solidify with a well-defined orientation relationship with the Zn matrix of ( 0001 )Zn ||(111)Pb\text and\text [ \text11[`\text2] \text0 ]Zn| ||[ 1[`1] 0 ]Pb 0001Zn(111)Pb and 1120Zn110Pb . The melting and solidification behavior of the Pb particle have been studied using differential scanning calorimetry (DSC). The Pb particles solidify with an undercooling of approximately 30 K, by heterogeneous nucleation on the {0001} facets of the surrounding Zn matrix, with an apparent contact angle of 23 deg.

Morphology and thermal characteristics of nano-sized Pb–Sn inclusions in Al

Nanoembedded aluminum alloys with bimetallic dispersoids of Sn and Pb of compositions Sn82–Pb18, Sn64–Pb36, and Sn54–Pb46 were synthesized by rapid solidification. The two phases, face-centered-cubic Pb and tetragonal Sn solid-solution, coexist in all the particles. The crystallographic relation between the two phases and the matrix depends upon the solidification pathways adopted by the particles. For Al–(Sn82–Pb18), we report a new orientation relation given by [011]Al//[010]Sn and (o11)A1//(101)Sn. Pb exhibits a cube-on-cube orientation with Al in few particles, while in others no orientation relationship could be observed. In contrast, Pb in Sn64–Pb36 and Sn54–Pb46 particles always exhibits cube-on-cube orientation with the matrix. Sn does not show any orientation relationship with Al or Pb in these cases. Differential scanning calorimetry studies revealed melting at eutectic temperature for all compositions, although solidification pathways are different. Attempts were made to correlate these with the melting and heterogeneous nucleation characteristics.

The effect of electrochemical lithiation on physicochemical properties of RF-sputtered Sn thin films

Thin films of Sn were deposited on Pt/Si substrates by sputtering technique and subjected to electrochemical lithiation studies. Electrochemical lithiation of Sn resulted in the formation of Sn-Li alloys of different compositions. Charging of Sn-coated Pt/Si electrodes was terminated at different potentials and the electrodes were examined for physicochemical properties. The scanning electron microscopy and atomic force microscopy images suggested that the Sn films expanded on lithiation. Roughness of the film increased with an increase in the quantity of Li present in Sn-Li alloy. Electrochemical impedance data suggested that the kinetics of charging became sluggish with an increase in the quantity of Li in Sn-Li alloy.