Solute solute and solvent solute interactions in solid solutions of Cu+Sn, Au+Sn and Cu+Au+Sn alloys

The chemical potentials of tin in its α-solid solutions with Cu, Au and Cu + Au alloys have been measured using a gas-solid equilibration technique. The variation of the excess chemical potential of tin with its composition in the alloy is related to the solute-solute repulsive interaction, while the excess chemical potential at infinite dilution of the solute is a measure of solvent-solute interaction energies. It is shown that solute-solute interaction is primarily determined by the concentration of (s + p) electrons in the conduction band, although the interaction energies are smaller than those predicted by either the rigid band model or calculation based on Friedel oscillations in the potential function. Finally, the variation of the solvent-solute interaction with solvent composition in the ternary system can be accounted for in terms of a quasi-chemical treatment which takes into account the clustering of the solvent atoms around the solute.

Heat of Mixing and Activities in Liquid Al-Sn Alloys

The microscopic electron theory based on the pseudopotential formalism has been applied to the calculation of the heats of mixing and of activities in liquid Al·Sn alloys. The calculated values for both quantities were found to be in reasonable agreement with ,the experimental data.

Isothermal transformation of beta-phase in Cu-rich Cu-Al-Sn alloys

Microstructural changes resulting from isothermal decomposition of the beta-phase have been studied in Cu-rich binary Cu-Al and ternary Cu-Al-Sn alloys containing up to 3 at.% Sn at temperatures from 873 to 673 K. Results are presented as TTT diagrams. The decomposition occurs in several stages, each of which involves the establishment of metastable equilibrium between beta and one or more of the product phases alpha, beta(1) and gamma(2). Addition of Sn has been shown to increase the stability of the ordered beta(1)-phase in relation to beta. In alloys containing more than 2 at.% Sn, the beta(1) emerges as a stable phase. At low Sn concentrations beta(1) is metastable. An important new finding is the existence of three-phase equilibrium microstructure containing alpha, beta(1) and gamma(2). Increasing addition of Sn alters the morphology of beta(1) from rosettes to dendrites and finally to Widmanstatten needles.

Martensitic transitions and the nature of ferromagnetism in the austenitic and martensitic states of Ni-Mn-Sn alloys

Structural and magnetic transformations in the Heusler-based system Ni0.50Mn0.50¿xSnx are studied by x-ray diffraction, optical microscopy, differential scanning calorimetry, and magnetization. The structural transformations are of austenitic-martensitic character. The austenite state has an L21 structure, whereas the structures of the martensite can be 10M , 14M , or L10 depending on the Sn composition. For samples that undergo martensitic transformations below and around room temperature, it is observed that the magnetic exchange in both parent and product phases is ferromagnetic, but the ferromagnetic exchange, characteristic of each phase, is found to be of different strength. This gives rise to different Curie temperatures for the austenitic and martensitic states.

Thermodynamics of oxygen in liquid copper-tin alloys

The activity coefficients of oxygen in copper-tin alloys at 1 1 00°C have been measured by two different equilibrium methodsthe cell Pt, Ni + NiO I ZrOz solid electrolyte I O[Cu + Sn], cermet. Pt and the equilibrium between Cu + Sn alloys and SnO + SiO, slags established via SnO vapour. The results from both types of measurement confirm the work of Block and co-workers and show that other data are in error. The deoxidation equilibria for Sn in liquid copper, with solid SnO, as deoxidation product, have been evaluated at temperatures of interest in copper smelting.

Estudo de Eletrodeposição de Ligas Cu-Sn em Meio de Citrato de Sódio

Revestimentos produzidos a partir de ligas de Cu-Sn apresentam grande interesse em função de suas propriedades, originando uma grande capacidade de aplicação industrial, especialmente em indústrias de componentes e materiais eletrônicos. Tais ligas também têm sido comercialmente utilizadas como revestimentos em metais diferentes, como o aço, para protegê-los contra a corrosão e melhorar sua aparência. Na presente dissertação, técnicas de voltametria cíclica, cronoamperometria e voltametria de varredura anódica linear foram utilizadas para o estudo dos processos de deposição de Cu e/ou Sn a partir de dois conjuntos de soluções contendo CuCl2.2H2O e SnCl2.2H2O nas razões de Cu:Sn = 1:10 e 10:1, além de Na3C6H5O7 1,00 mol/L, em pH = 6,0. As curvas de voltametria cíclica realizadas sobre o eletrodo de grafita foram utilizadas para o cálculo das constantes de equilíbrio dos complexos de ambos os metais com citrato de sódio, bem como na determinação dos potenciais catódicos aplicados nos ensaios de cronoamperometria. Após a deposição da liga nos potenciais estipulados para cada uma das duas soluções, os revestimentos de liga Cu-Sn foram ressolubilizados em solução de NaNO3 0,5 mol/L, empregando varredura anódica linear para a avaliação de suas composições químicas. Os resultados iniciais mostraram que a variação da concentração de Cu (II) e do potencial aplicado influenciaram no teor de cobre na liga. Contudo, percebeu-se que o teor de estanho não sofreu grandes variações, independente das concentrações das soluções e do potencial aplicado. Na solução com maior concentração de cobre foram alcançados teores dos metais na liga em maior proximidade com o da liga de bronze comercial. Com base nesses resultados, foram produzidos revestimentos de ligas sobre substrato de aço carbono, a partir de soluções contendo CuCl2.2H2O e SnCl2.2H2O na razão de 10:1, empregando a técnica de cronoamperometria potenciostática. Quatro diferentes valores de potencial (-0,39V, -0,67V, -1,00V, -1,20V e -1,94V vs. Ag/AgClsat.) foram aplicados, obtendo-se camadas cujas colorações variaram do rosa claro ao marrom escuro, sempre sem brilho. A eficiência de corrente catódica (Ef) decresceu conforme o potencial aplicado se tornou mais negativo. Nesta mesma direção, verificou-se um aumento do teor de estanho na liga depositada e menores tamanhos de grão. Porém, quando o potencial tornou-se mais negativo (-1,20V e -1,94V), observou-se a presença de cristalitos de diferentes tamanhos e de dendritos. Revestimentos com melhores resistências à corrosão em solução de NaCl 0,5 mol/L foram produzidos nos potenciais de -1,00V e -1,20V, cujas composições foram 99,40 % m/m Cu / 0,60 % m/m Sn e 97,70 % m/m Cu / 2,30 % m/m Sn, respectivamente. As análises por DRX permitiram verificar que estes revestimentos eram constituídos, principalmente, da fase α-CuSn

Influence of thermal parameters on the dendritic arm spacing and the microhardness of Al-5.5wt.%Sn alloy directionally solidified

As ligas Al-Sn são amplamente utilizados em aplicações tribológicas. Nesse estudo, análises térmica, microestrutural e dureza (HV) foram realizadas ao longo de um lingote da liga Al-5,5%Sn, obtido por solidificação direcional horizontal transitória. Os principais parâmetros analisados incluem a velocidade de deslocamento da isoterma liquidus (V_L) e a taxa de resfriamento (T_R). Esses parâmetros térmicos desempenham um papel fundamental na formação da microestrutura. A microestrutura dendrítica foi caracterizada através dos espaçamentos dentríticos primários (λ₁), os quais foram determinados, experimentalmente, e correlacionados com V_L, e T_R. O comportamento apresentado pela liga Al- 5,5% Sn, durante a solidificação,é semelhante ao de outras ligas de alumínio, isto é, observa-se rede dendrítica mais grosseira com a diminuição da taxa de resfriamento, indicando que a imiscibilidade entre o alumínio e estanho não tem um efeito significativo sobre o relação entre o espaçamento dendrítico primário e taxa de resfriamento. A dependência da microdureza em V_L, T_R e no λ₁ foi também analisada. Verificaram-se menores valores de HV para maiores T_R. Por outro lado, os valores HV aumentam com valores crescentes de λ₁.

The effects of humidity on tin whisker growth by immersion tin plating and tin solder dipping surface finishes

The drive to replace lead (Pb) from electronics has led to the replacement of tin (Sn) alloys as the terminal plating for electronic devices. However, the deposition of Sn based alloys as the component surface finish tends to induce Sn whisker that causes unintended electric shorts when the conductive whiskers grow across to the adjacent conductor. Internal stress is considered as the driving force that causes the growth of Sn whiskers. In this study, stress type of elevated temperature/ humidity exposure at 55C/85%RH with the storage for up to 24 months was conducted to define the acceleration factor in samples with deposition of immersion Sn plating and Sn solder dipping. The addition of Nickel (Ni) under-layer was also applied to examine the correlation to field conditions. The results showed that the whisker length increased in high humidity irrespective of the deposition methods. It was also shown that pure Sn solder dipping mitigated the whisker growth but does not completely prevent it when alloying Sn with 0.4%wtCu. Additionally, Ni under-layer was indicated to be more efficient in mitigating the growth of whisker by prolonging the incubation time for whisker formation.

Fabricação e caracterização metalográfica e mecânica de tiras de ligas metálicas fundidas e tixolaminadas no estado semi-sólido de diferentes intervalos de solidificação

Coordenação de Aperfeiçoamento de Pessoal de Nível Superior (CAPES)

Estudo de corrosão das fases componentes de amálgamas dentários

Fundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP)

On the degradation mechanisms under the influence of pedological factors through the study of archeological bronze patina

This experimental thesis concerns the study of the long-term behaviour of ancient bronzes recently excavated from burial conditions. The scientific interest is to clarify the effect of soil parameters on the degradation mechanisms of ancient bronze alloy. The work took into consideration bronzes recovered from the archaeological sites in the region of Dobrudja, Romania. The first part of research work was dedicated to the characterization of bronze artefacts using non destructive (micro-FTIR, reflectance mode) and micro-destructive (based on sampling and analysis of a stratigraphical section by OM and SEM-EDX) methods. Burial soils were geologically classified and analyzed by chemical methods (pH, conductivity, anions content). Most of objects analyzed showed a coarse and inhomogeneous corroded structure, often made up of several corrosion layers. This has been explained by the silt nature of soils, which contain low amount of clay and are, therefore, quite accessible to water and air. The main cause of a high dissolution rate of bronze alloys is the alternate water saturation and instauration of the soil, for example on a seasonal scale. Moreover, due to the vicinity of the Black Sea, the detrimental effect of chlorine has been evidenced for few objects, which were affected by the bronze disease. A general classification of corrosion layers was achieved by comparing values of the ratio Cu/Sn in the alloy and in the patina. Decuprification is a general trend, and enrichment of copper within the corrosion layers, due to the formation of thick layers of cuprite (Cu2O), is pointed out as well. Uncommon corrosion products and degradation patterns were presented as well, and they are probably due to peculiar local conditions taking place during the burial time, such as anaerobic conditions or fluctuating environmental conditions. In order to acquire a better insight into the corrosion mechanisms, the second part of the thesis has regarded simulation experiments, which were conducted on commercial Cu-Sn alloys, whose composition resembles those of ancient artefacts one. Electrochemical measurements were conducted in natural electrolytes, such as solutions extracted from natural soil (sampled at the archaeological sites) and seawater. Cyclic potentiodynamic experiments allowed appreciating the mechanism of corrosion in both cases. Soil extract’s electrolyte has been evaluated being a non aggressive medium, while artificial solution prepared by increasing the concentration of anions caused the pitting corrosion of the alloy, which is demonstrated by optical observations. In particular, electrochemical impedance spectroscopy allows assessing qualitatively the nature of corroded structures formed in soil and seawater. A double-structured layer is proposed, which differ, in the two cases, for the nature of the internal passive layer, which result defectiveness and porous in case of seawater.

Surface segregation and oxidation studies of Cu-Sn and Cu-Pd alloys by x-ray photoelectron and auger spectroscopy

X-ray photoelectron and Auger spectroscopic techniques have been employed to study surface segregation and oxidation of Cu-1 at%Sn, Cu-9at%Pd and Cu-25at%Pd alloys. Both Cu-Pd(9%) and Cu-Pd(25%) alloys show segregation of Cu when heated above 500 K. The Pd concentration was reduced by 50% at 750 K compared to the bulk composition; the enthalpy of segregation of Cu is around - 6kJ/mol. Sn segregation is seen from 470 to 650 K in the Cu-Sn(1%) alloy, and a saturation plateau of Sn concentration above 650 K is observed. Surface oxidation of Cu-Sn(1%) and Cu-Pd(9%) alloys at 500 K showed the formation of Cu2O on the surface with total suppression of Sn or Pd on the respective alloy surfaces. On vacuum annealing the oxidised Cu-Sn alloy surface at 550 K, a displacement reaction 2Cu2O+Sn→4Cu+SnO2 was observed. However, under similar annealing of the oxidised Cu-Pd(9%) alloy surface at 500 K, oxide oxygen was totally desorbed leaving the Cu-Pd alloy surface clean. In the case of the Cu-Pd(25%) alloy, only dissociatively chemisorbed oxygen was seen at 500 K which desorbed at the same temperature. Oxygen spill-over from copper to palladium is suggested as the mechanism of oxygen desorption from the oxidised Cu-Pd alloy surfaces.

Microstructural Evolution and Some Unusual Effects During Thermo-Mechanical Cycling of Sn-Ag-Cu Alloys

Sn-Ag-Cu (SAC) solders are susceptible to appreciable microstructural coarsening during storage or service. This results in evolution of joint properties over time, and thereby influences the long-term reliability of microelectronic packages. Accurate prediction of this aging behavior is therefore critical for joint reliability predictions. Here, we study the precipitate coarsening behavior in two Sn-Ag-Cu (SAC) alloys, namely Sn-3.0Ag-0.5Cu and Sn-1.0Cu-0.5Cu, under different thermo-mechanical excursions, including isothermal aging at 150 degrees C for various lengths of time and thermo-mechanical cycling between -25 degrees C and 125 degrees C, with an imposed shear strain of similar to 19.6% per cycle, for different number of cycles. During isothermal aging and the thermo-mechanical cycling up to 200 cycles, Ag3Sn precipitates undergo rapid, monotonous coarsening. However, high number of thermo-mechanical cycling, usually between 200 and 600 cycles, causes dissolution and re-precipitation of precipitates, resulting in a fine and even distribution. Also, recrystallization of Sn-grains near precipitate clusters was observed during severe isothermal aging. Such responses are quite unusual for SAC solder alloys. In the regime of usual precipitate coarsening in these SAC alloys, an explicit parameter, which captures the thermo-mechanical history dependence of Ag3Sn particle size, was defined. Brief mechanistic description for the recrystallization of Sn grains during isothermal aging and reprecipitation of the Ag3Sn due to high number of thermo-mechanical cycles are also presented.