Evaluation Of The Effect Of Different Methods Of Microabrasion And Polishing On Surface Roughness Of Dental Enamel.

The microabrasion technique of enamel consists of selectively abrading the discolored areas or causing superficial structural changes in a selective way. In microabrasion technique, abrasive products associated with acids are used, and the evaluation of enamel roughness after this treatment, as well as surface polishing, is necessary. This in-vitro study evaluated the enamel roughness after microabrasion, followed by different polishing techniques. Roughness analyses were performed before microabrasion (L1), after microabrasion (L2), and after polishing (L3).Thus, 60 bovine incisive teeth divided into two groups were selected (n=30): G1- 37% phosphoric acid (37%) (Dentsply) and pumice; G2- hydrochloric acid (6.6%) associated with silicon carbide (Opalustre - Ultradent). Thereafter, the groups were divided into three sub-groups (n=10), according to the system of polishing: A - Fine and superfine granulation aluminum oxide discs (SofLex 3M); B - Diamond Paste (FGM) associated with felt discs (FGM); C - Silicone tips (Enhance - Dentsply). A PROC MIXED procedure was applied after data exploratory analysis, as well as the Tukey-Kramer test (5%). No statistical differences were found between G1 and G2 groups. L2 differed statistically from L1 and showed superior amounts of roughness. Differences in the amounts of post-polishing roughness for specific groups (1A, 2B, and 1C) arose, which demonstrated less roughness in L3 and differed statistically from L2 in the polishing system. All products increased enamel roughness, and the effectiveness of the polishing systems was dependent upon the abrasive used.

Effect of different polishing systems on the surface roughness of microhybrid composites

The use of composite resins in dentistry is well accepted for restoring anterior and posterior teeth. Many polishing protocols have been evaluated for their effect on the surface roughness of restorative materials. This study compared the effect of different polishing systems on the surface roughness of microhybrid composites. Thirty-six specimens were prepared for each composite $#91;Charisma® (Heraeus Kulzer), Fill Magic® (Vigodent), TPH Spectrum® (Dentsply), Z100® (3M/ESPE) and Z250® (3M/ESPE)] and submitted to surface treatment with Enhance® and PoGo® (Dentsply) points, sequential Sof-Lex XT® aluminum oxide disks (3M/ESPE), and felt disks (TDV) combined with Excel® diamond polishing paste (TDV). Average surface roughness (Ra) was measured with a mechanical roughness tester. The data were analyzed by two-way ANOVA with repetition of the factorial design and the Tukey-Kramer test (p<0.01). The F-test result for treatments and resins was high (p<0.0001 for both), indicating that the effect of the treatment applied to the specimen surface and the effect of the type of resin on surface roughness was highly significant. Regarding the interaction between polishing system and type of resin used, a p value of 0.0002 was obtained, indicating a statistically significant difference. A Ra of 1.3663 was obtained for the Sof-Lex/TPH Spectrum interaction. In contrast, the Ra for the felt disk+paste/Z250 interactions was 0.1846. In conclusion, Sof-Lex polishing system produced a higher surface roughness on TPH Spectrum resin when compared to the other interactions.

A Laboratory Investigation of An Accelerated Polishing Method for Determining the Skid Resistance Potential of Aggregates, MLR-76-02 and R-264, 1976

An initial feasibility study indicated that the "Purdue Accelerated Polishing Method" gave repeatable results when testing the skid resistance of laboratory specimens. The results also showed a rough correlation with the field performance of the same aggregate sources. The research was then expanded to include all available asphalt aggregates. The results of the expanded study indicated that the method is not presently capable of developing and measuring the full skid potential of the various aggregate sources. Further research in the area of polishing times and/or pressures is needed.

Development of a Filter Aid Proportioning, Mixing, and Feeding System for a Polishing Filter

The purpose of this work was to study the characteristics of the most commonly used filter aid materials and their influences on the design of proportioning, mixing, and feeding system for polishing filter family. Based on the literature survey and hands-on experience a system was designed with defined equipment and capital and operating costs. The system was designed to serve precoating and bodyfeeding applications and is easily extended to be used in multiple filter processes. Also a test procedure was carried out where influences of flux and filter cloths to accumulated cake were studied. Filter aid is needed in challenging conditions to improve filtration efficiency and cleaning, and thus extend the operating life of the filter media. Filter aid preparation and feeding system was designed for the use of two different filter aids; precoat and bodyfeed. Precoating is used before the filtration step initiates. If the solids in the filterable solution have a tendency to clog the filter bag easily, precoat is used on the filter bag to obtain better filtration efficiency and quality. Diatomite or perlite is usually used as a precoating substance. The intention is to create a uniform cake to the overall surface of the filter cloth, with predetermined thickness, 2 – 5 mm. This ensures that the clogging of the filter cloth is reduced and the filtration efficiency is increased. Bodyfeed is used if the solids in the filterable solution have a tendency to form a sticky impermeable filter cake. The cake properties are enhanced by maintaining the permeability of the accumulating cake by using the filter aid substance as bodyfeed during the filtration process.

A Multi-scale Model for Copper Dishing in Chemical-Mechanical Polishing

The present success in the manufacture of multi-layer interconnects in ultra-large-scale integration is largely due to the acceptable planarization capabilities of the chemical-mechanical polishing (CMP) process. In the past decade, copper has emerged as the preferred interconnect material. The greatest challenge in Cu CMP at present is the control of wafer surface non-uniformity at various scales. As the size of a wafer has increased to 300 mm, the wafer-level non-uniformity has assumed critical importance. Moreover, the pattern geometry in each die has become quite complex due to a wide range of feature sizes and multi-level structures. Therefore, it is important to develop a non-uniformity model that integrates wafer-, die- and feature-level variations into a unified, multi-scale dielectric erosion and Cu dishing model. In this paper, a systematic way of characterizing and modeling dishing in the single-step Cu CMP process is presented. The possible causes of dishing at each scale are identified in terms of several geometric and process parameters. The feature-scale pressure calculation based on the step-height at each polishing stage is introduced. The dishing model is based on pad elastic deformation and the evolving pattern geometry, and is integrated with the wafer- and die-level variations. Experimental and analytical means of determining the model parameters are outlined and the model is validated by polishing experiments on patterned wafers. Finally, practical approaches for minimizing Cu dishing are suggested.

A Multi-scale Model for Copper Dishing in Chemical-Mechanical Polishing

The present success in the manufacture of multi-layer interconnects in ultra-large-scale integration is largely due to the acceptable planarization capabilities of the chemical-mechanical polishing (CMP) process. In the past decade, copper has emerged as the preferred interconnect material. The greatest challenge in Cu CMP at present is the control of wafer surface non-uniformity at various scales. As the size of a wafer has increased to 300 mm, the wafer-level non-uniformity has assumed critical importance. Moreover, the pattern geometry in each die has become quite complex due to a wide range of feature sizes and multi-level structures. Therefore, it is important to develop a non-uniformity model that integrates wafer-, die- and feature-level variations into a unified, multi-scale dielectric erosion and Cu dishing model. In this paper, a systematic way of characterizing and modeling dishing in the single-step Cu CMP process is presented. The possible causes of dishing at each scale are identified in terms of several geometric and process parameters. The feature-scale pressure calculation based on the step-height at each polishing stage is introduced. The dishing model is based on pad elastic deformation and the evolving pattern geometry, and is integrated with the wafer- and die-level variations. Experimental and analytical means of determining the model parameters are outlined and the model is validated by polishing experiments on patterned wafers. Finally, practical approaches for minimizing Cu dishing are suggested.

Chromatic stability of acrylic resins of artificial eyes submitted to accelerated aging and polishing

Conselho Nacional de Desenvolvimento Científico e Tecnológico (CNPq)

Evaluation of enamel surface after bracket debonding and polishing

INTRODUÇÃO: a preservação da estrutura de esmalte após a remoção dos acessórios ortodônticos é obrigação do clínico. Portanto, procura-se um protocolo de descolagem com bases científicas. OBJETIVO: objetivou-se avaliar por microscopia eletrônica de varredura (MEV) a influência de quatro protocolos de remoção de braquetes e polimento da superfície do esmalte e propor um protocolo que minimize os danosà superfície do esmalte. MÉTODOS: doze incisivos permanentes bovinos foram divididos em quatro grupos de acordo com os instrumentos utilizados para a descolagem dos braquetes e remoção do remanescente adesivo. Os braquetes foram descolados com o alicate de descolagem reto (Ormco Corp.) nos grupos 1 e 2, e com o instrumento de descolagem Lift-Off (3M Unitek) nos grupos 3 e 4. Os remanescentes adesivos dos grupos 1 e 3 foram removidos com o alicate removedor de resina longo (Ormco Corp.) e dos grupos 2 e 4 com broca de carboneto de tungstênio (Beavers Dental) em alta-rotação. As superfícies, após cada etapa da descolagem e polimento, foram avaliadas em réplicas de resina epóxica e foram obtidas eletromicrografias com aumento de 50 e 200X. RESULTADOS: os quatro protocolos de remoção de acessórios ortodônticos e polimento ocasionaram irregularidades no esmalte. Conclusão: a remoção do braquete com o alicate de descolagem reto, seguido da remoção do remanescente adesivo com broca de carboneto de tungstênio e polimento final com pasta de pedra-pomes foi o procedimento que ocasionou menores danos ao esmalte, sendo o protocolo sugerido para a remoção dos acessórios ortodônticos.

Surface roughness and hardness of a composite resin: influence of finishing and polishing and immersion methods

This study evaluated the finishing and polishing effect on the surface roughness and hardness of the Filtek Supreme XT, in fluoride solutions. Specimens were prepared (n = 140) with half of the samples finished and polished with Super-Snap (R) disks. The experimental groups were divided according to the presence or absence of finishing and polishing and immersion solutions (artificial saliva, sodium fluoride solution at 0.05%-manipulated, Fluordent Reach, Oral B, Fluorgard). The specimens remained immersed in artificial saliva for 24 hours and were then subjected to initial analysis (baseline) of surface roughness and Vickers microhardness. Next, they were immersed in different fluoride solutions for 1 min/day, for 60 days. Afterwards, a new surface roughness and microhardness reading was conducted. The data were submitted to a two-way ANOVA and Tukey's test (5% significance level). For the comparison of mean roughness and hardness at baseline and after 60 days, the paired Student t test was used. The results showed that the surface roughness and microhardness of the Filtek Supreme XT were influenced by the finishing and polishing procedure, independently of the immersion methods.

Composite surfaces after finishing and polishing techniques

Purpose: To evaluate the effect of finishing and polishing techniques on surface roughness of resin-based composites (RBCs). Materials and Methods: Forty specimens of each material were cured under Mylar strips and immersed in artificial saliva for 1 wk. Samples were tested with a profilometer to obtain baseline average surface roughness (Ra). Specimens of both RBCs were then finished and polished according to four techniques: (1) Sof-Lex disks; (2) Sof-Lex disks followed by Prisma Gloss; (3) Enhance points; (4) Enhance points followed by Prisma Gloss application. New readings of the roughness pattern were carried out and the difference of post-polishing and baseline values were analyzed. Results: ANOVA test (alpha= 0.05) did not show differences between materials (P= 0.9393) nor interaction effects (P= 0.3094), but significant difference among the finishing/polishing techniques were detected (P= 0.0157). Tukey's test showed that the smoothest surface was obtained when the specimens were treated by Sof-Lex followed by Prosma Gloss polishing paste; and the worst results were obtained after using Enhance points alone.

Streptococcus mutans Biofilm Adhesion on Composite Resin Surfaces After Different Finishing and Polishing Techniques

Fundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP)

Effect of different finishing and polishing techniques on the surface roughness of microfilled, hybrid and packable composite resins

Fundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP)