Study of the tightness of the metallization used on top of a thin film capacitor cell

Dissertação de mestrado integrado em Engenharia de Materiais

Thermal effects in Ni/Au and Mo/Au gate metallization AlGaN/GaN HEMT's reliability

AlGaN/GaN high electron mobility transistors (HEMT) are key devices for the next generation of high-power, high-frequency and high-temperature electronics applications. Although significant progress has been recently achieved [1], stability and reliability are still some of the main issues under investigation, particularly at high temperatures [2-3]. Taking into account that the gate contact metallization is one of the weakest points in AlGaN/GaN HEMTs, the reliability of Ni, Mo, Pt and refractory metal gates is crucial [4-6]. This work has been focused on the thermal stress and reliability assessment of AlGaN/GaN HEMTs. After an unbiased storage at 350 o C for 2000 hours, devices with Ni/Au gates exhibited detrimental IDS-VDS degradation in pulsed mode. In contrast, devices with Mo/Au gates showed no degradation after similar storage conditions. Further capacitance-voltage characterization as a function of temperature and frequency revealed two distinct trap-related effects in both kinds of devices. At low frequency (< 1MHz), increased capacitance near the threshold voltage was present at high temperatures and more pronounced for the Ni/Au gate HEMT and as the frequency is lower. Such an anomalous “bump” has been previously related to H-related surface polar charges [7]. This anomalous behavior in the C-V characteristics was also observed in Mo/Au gate HEMTs after 1000 h at a calculated channel temperatures of around from 250 o C (T2) up to 320 ºC (T4), under a DC bias (VDS= 25 V, IDS= 420 mA/mm) (DC-life test). The devices showed a higher “bump” as the channel temperature is higher (Fig. 1). At 1 MHz, the higher C-V curve slope of the Ni/Au gated HEMTs indicated higher trap density than Mo/Au metallization (Fig. 2). These results highlight that temperature is an acceleration factor in the device degradation, in good agreement with [3]. Interface state density analysis is being performed in order to estimate the trap density and activation energy.

Reduction of front-metallization grid shading in concentrator cells through laser micro-grooved cover glass

Concentrator solar cell front-grid metallizations are designed so that the trade-off between series resistance and shading factor (SF) is optimized for a particular irradiance. High concentrator photovoltaics (CPV) typically requires a metallic electrode pattern that covers up to 10% of the cell surface. The shading effect produced by this front electrode results in a significant reduction in short-circuit current (I SC) and hence, in a significant efficiency loss. In this work we present a cover glass (originally meant to protect the cell surface) that is laser-grooved with a micrometric pattern that redirects the incident solar light towards interfinger regions and away from the metallic electrodes, where they would be wasted in terms of photovoltaic generation. Quantum efficiency (QE) and current (I)-voltage (V) characterization under concentration validate the proof-of-concept, showing great potential for CPV applications

SERS Active Surface in Two Steps, Patterning and Metallization

Robust and reproducible metallized nano/microstructured surfaces of polymeric surfaces have been successfully prepared by direct laser interference patterning (DLIP) of commercial polymeric films followed by sputtering of metallic thin films. The SERS spectra for 2-thioaniline adsorbed on a structured polycarbonate surfaces covered with a gold or platinum film showed a ca. three order of magnitude enhancement over a flat surface with the same metal film. The method here reported is suitable for mass production of substrates for SERS since large areas (several cm2) can be structured in ca. 1–5 s.

Metallization of cyanide-modified Pt(111) electrodes with copper

Date of Acceptance: 12/07/2015 The support of the University of Aberdeen is gratefully acknowledged. CW acknowledges a summer studentship from the Carnegie Trust for the Universities of Scotland.

Metallization of cyanide-modified Pt(111) electrodes with copper

Date of Acceptance: 12/07/2015 The support of the University of Aberdeen is gratefully acknowledged. CW acknowledges a summer studentship from the Carnegie Trust for the Universities of Scotland.

A cost study of common surface finish systems for steel structures

This paper presents part of a study aimed at finding a suitable, yet cost-effective, surface finish for a steel structure subject to the car washing environment and corrosive chemicals. The initial, life cycle and average equivalent annual (AEAC) costs for surface finishing methods were calculated for a steel structure using the LCCC algorithm developed by American Galvanizers Association (AGA). The cost study consisted of 45 common surface finish systems including: hot-dip galvanization (HDG), metallization, acrylic, alkyd and epoxy as well as duplex coatings such as epoxy zinc and inorganic zinc (IOZ). The results show that initial, life cycle and AEAC costs for hot dip galvanization are the lowest among all the other methods, followed by coal tar epoxy painting. The annual average cost of HDG for this structure was estimated about €0.22/m2, while the other cost-effective alternatives were: IOZ, polyurea, epoxy waterborne and IOZ/epoxy duplex coating.

Nanopatterning and functionalization of phospholipid-based Langmuir-Blodgett and Langmuir-Schaefer films

Durant les dernières décennies, la technique Langmuir-Blodgett (LB) s’est beaucoup développée dans l’approche « bottom-up » pour la création de couches ultra minces nanostructurées. Des patrons constitués de stries parallèles d’environ 100 à 200 nm de largeur ont été générés avec la technique de déposition LB de monocouches mixtes de 1,2-dilauroyl-sn-glycéro-3-phosphatidylcholine (DLPC) et de 1,2-dipalmitoyl-sn-glycéro-3-phosphatidylcholine (DPPC) sur des substrats de silicium et de mica. Afin d’amplifier la fonctionnalité de ces patrons, la 1-palmitoyl-2-(16-(S-methyldithio)hexadécanoyl)-sn-glycéro-3-phosphatidylcholine (DSDPPC) et la 1-lauroyl-2-(12-(S-methyldithio)dodédecanoyl)-sn-glycéro-3-phosphatidylcholine (DSDLPC) ont été employées pour la préparation de monocouches chimiquement hétérogènes. Ces analogues de phospholipide possèdent un groupement fonctionnel méthyldisulfide qui est attaché à la fin de l’une des chaînes alkyles. Une étude exhaustive sur la structure de la phase des monocouches Langmuir, Langmuir-Schaefer (LS) et LB de la DSDPPC et de la DSDLPC et leurs différents mélanges avec la DPPC ou la DLPC est présentée dans cette thèse. Tout d’abord, un contrôle limité de la périodicité et de la taille des motifs des stries parallèles de DPPC/DLPC a été obtenu en variant la composition lipidique, la pression de surface et la vitesse de déposition. Dans un mélange binaire de fraction molaire plus grande de lipide condensé que de lipide étendu, une vitesse de déposition plus lente et une plus basse pression de surface ont généré des stries plus continues et larges. L’addition d’un tensioactif, le cholestérol, au mélange binaire équimolaire de la DPPC/DLPC a permis la formation de stries parallèles à de plus hautes pressions de surface. La caractérisation des propriétés physiques des analogues de phospholipides a été nécessaire. La température de transition de phase de la DSDPPC de 44.5 ± 1.5 °C comparativement à 41.5 ± 0.3 °C pour la DPPC. L’isotherme de la DSDPPC est semblable à celui de la DPPC. La monocouche subit une transition de phase liquide-étendue-à-condensée (LE-C) à une pression de surface légèrement supérieure à celle de la DPPC (6 mN m-1 vs. 4 mN m-1) Tout comme la DLPC, la DSDLPC demeure dans la phase LE jusqu’à la rupture de la monocouche. Ces analogues de phospholipide existent dans un état plus étendu tout au long de la compression de la monocouche et montrent des pressions de surface de rupture plus basses que les phospholipides non-modifiés. La morphologie des domaines de monocouches Langmuir de la DPPC et de la DSDPPC à l’interface eau/air a été comparée par la microscopie à angle de Brewster (BAM). La DPPC forme une monocouche homogène à une pression de surface (π) > 10 mN/m, alors que des domaines en forme de fleurs sont formés dans la monocouche de DSDPPC jusqu’à une π ~ 30 mN m-1. La caractérisation de monocouches sur substrat solide a permis de démontrer que le patron de stries parallèles préalablement obtenu avec la DPPC/DLPC était reproduit en utilisant des mélanges de la DSDPPC/DLPC ou de la DPPC/DSDLPC donnant ainsi lieu à des patrons chimiquement hétérogènes. En général, pour obtenir le même état de phase que la DPPC, la monocouche de DSDPPC doit être comprimée à de plus hautes pressions de surface. Le groupement disulfide de ces analogues de phospholipide a été exploité, afin de (i) former des monocouches auto-assemblées sur l’or et de (ii) démontrer la métallisation sélective des terminaisons fonctionnalisées des stries. La spectrométrie de photoélectrons induits par rayons X (XPS) a confirmé que la monocouche modifiée réagit avec la vapeur d’or pour former des thiolates d’or. L’adsorption de l’Au, de l’Ag et du Cu thermiquement évaporé démontre une adsorption préférentielle de la vapeur de métal sur la phase fonctionnalisée de disulfide seulement à des recouvrements sub-monocouche.

Buried screen-printed contacts for silicon solar cells

A Simple way to improve solar cell efficiency is to enhance the absorption of light and reduce the shading losses. One of the main objectives for the photovoltaic roadmap is the reduction of metalized area on the front side of solar cell by fin lines. Industrial solar cell production uses screen-printing of metal pastes with a limit in line width of 70-80 μm. This paper will show a combination of the technique of laser grooved buried contact (LGBC) and Screen-printing is able to improve in fine lines and higher aspect ratio. Laser grooving is a technique to bury the contact into the surface of silicon wafer. Metallization is normally done with electroless or electrolytic plating method, which a high cost. To decrease the relative cost, more complex manufacturing process was needed, therefore in this project the standard process of buried contact solar cells has been optimized in order to gain a laser grooved buried contact solar cell concept with less processing steps. The laser scribing process is set at the first step on raw mono-crystalline silicon wafer. And then the texturing etch; phosphorus diffusion and SiNx passivation process was needed once. While simultaneously optimizing the laser scribing process did to get better results on screen-printing process with fewer difficulties to fill the laser groove. This project has been done to make the whole production of buried contact solar cell with fewer steps and could present a cost effective opportunity to solar cell industries.

A reducao de pelotas de minerio de ferro pela utilizacao de carvoes nao desgaseificados e desgaseificados com diferentes relacoes cfix/fetot

Através de ensaios isotérmicos de redução (950°C) e com velocidade de aquecimento constante, estuda-se o comportamento do sistema carvão-pelota de minério de ferro (CVRD, tipo RD) sob o ponto de vista dos graus de redução e respectivamente graus de metalização obtidos. Os ensaios de redução foram realizados em reatores estáticos, aquecidos eletricamente num forno vertical. Foram utilizados, como redutores sólidos, os carvões de Charqueadas (RS) e de Butiá-Recreio(RS), tanto no estado não desgaseificado, como no estado desgaseificado e com diferentes relações Cfix/Fetot. Foram traçadas curvas dos graus de redução e metalização obtidos contra o tempo, sendo as mesmas analisadas quanto: a influência da natureza do carvão, da presença de matéria volátil e da relação Cfix/Fetot. Também foram determinadas constantes de velocidade da reação global de redução na sistema estudado.

Interface microstructure of alumina mechanically metallized with Ti brazed to Fe–Ni–Co using different fillers

NASCIMENTO,R.M. et al.Interface microstructure of alumina mechanically metallized with Ti brazed to Fe–Ni–Co using different fillers. Materials Science and Engineering A, v.466, n.1/2, p. 195-200, 2007.

Caracterização Microestrutural e Tribocorrosiva de Sistemas Metalocerâmicos Odontológicos do Tipo Ni-Cr/Porcelana E Ni-Cr/Ti/Porcelana

The partial fixed prosthodontics restoration is used to rehabilitate form and function of partial or total compromised teeth, having to remain permanently joined to remainder tooth. The most useful material on prosthodontics is the feldspar porcelain, commercialized as aluminosilicate powders. Dental porcelains are presented with limited mechanical properties to rehabilitate extensive spaces. The association with Ni-Cr metallic systems (metal-ceramic system) allows that the metallic substructure compensates the fragile porcelain nature, preserving the thermal insulation and aesthetics desirable, as well as reducing the possibility of cracking during matication efforts. Cohesive flaws by low mechanical strength connect the metallic substructure to the oral environment, characterized by a electrolytic solution (saliva), by aggressive temperature, pH cyclic changes and mechanical requests. This process results on ionic liberation that could promote allergic or inflammatory responses, and/or clinical degradation of ceramometal system. The aim of this study was to evaluate the presence of an intermediate titanium layer on the microscopic fracture behavior of porcelains on ceramometal systems. Plasma deposition of titanium films result in regular passivating oxide layers which act as barriers to protect the metallic substrate against the hazardous effects of corrosive saliva. Tribocorrosion tests were performed to simulate the oral environment and mechanical stress, making it possible the early detection of crack formation and growth on metal-ceramic systems, which estimate the adherence between the compounds of this system. Plain samples consisting of dental feldspar porcelain deposited either onto metallic substrates or titanium films were fired and characterized by scanning electron microscopy. The result showed that the titanium film improved the adherence of the system compared to conventional metal-ceramic interfaces, thus holding crack propagation

Estudo da influência da temperatura de brasagem nas uniões zircônia/aço inox 304 utilizando metalização mecânica

Metal-Ceramic (M/C) Zirconia-stainless steel interfaces have been processed through brazing techniques due to the excellent combination of properties such as high temperature stability, high corrosion resistance and good mechanical properties. However, some M/C interfaces show some defects, like porosity and cracks results in the degradation of the interfaces, leading even to its total rupture. Most of time, those defects are associated with an improper brazing parameters selection to the M/C system. In this work, ZrO2 Y-TZP and ZrO2 Mg - PSZ were joint with the stainless steel grade 304 by brazing using a eutectic silver-copper (Ag28Cu) interlayer alloy with different thermal cycles. Ceramic surfaces were previous mechanically metallized with titanium to improve adhesion of the system. The effect of temperature on the M/C interface was studied. SEM-EDS and 3 point flexural bend test were performed to evaluate morphology, chemical composition and mechanical resistance of the M/C interfaces. Lower thermal cycle temperatures produced better results of mechanical resistance, and more regular/ homogeneous reaction layers between braze alloy and metal-ceramic surfaces. Also was proved the AgCu braze alloy activation in situ by titanium

Metalização mecânica de ZrO2 com Ti para brasagem ZrO2/Aço com ligas de adição sem metal ativo

Metal/ceramic interfaces using zirconia have dominated the industrial applications in the last decade, due to the high mechanical strength and fracture toughness of zirconia, especially at temperatures below 300 ºC. Also noteworthy is the good ionic conductivity in high temperatures of this component. In this work joining between ZrO2 Y-TZP and ZrO2 Mg-PSZ with austenitic stainless steel was studied. These joints were brazed at high-vacuum after mechanical metallization with Ti using filler alloys composed by Ag-Cu and Ag-Cu-Ni. The influence of the metallization, and the affinity between the different groups (ceramic / filler alloys) was evaluated, in order to achieve strong metal/ceramic joints. Evaluation of joints and interfaces, also the characterization of base materials was implemented using various techniques, such as: x-ray diffraction, leak test, three-point flexural test and scanning electron microscopy with chemical analysis. The microstructural analysis revealed physical and chemical bonds in the metal/ceramic interfaces, providing superior leak proof joints and stress cracking, in order to a good joint in all brazed samples. Precipitation zones and reaction layers with eutetic characteristics were observed between the steel and the filler metal

Ultrasonic density measurement cell design and simulation of non-ideal effects

This paper presents a theoretical analysis of a density measurement cell using an unidimensional model composed by acoustic and electroacoustic transmission lines in order to simulate non-ideal effects. The model is implemented using matrix operations, and is used to design the cell considering its geometry, materials used in sensor assembly, range of liquid sample properties and signal analysis techniques. The sensor performance in non-ideal conditions is studied, considering the thicknesses of adhesive and metallization layers, and the effect of residue of liquid sample which can impregnate on the sample chamber surfaces. These layers are taken into account in the model, and their effects are compensated to reduce the error on density measurement. The results show the contribution of residue layer thickness to density error and its behavior when two signal analysis methods are used. (c) 2006 Elsevier B.V. All rights reserved.