Measuring Bottleneck Link Speed in Package-Switched Networks

The quality of available network connections can often have a large impact on the performance of distributed applications. For example, document transfer applications such as FTP, Gopher and the World Wide Web suffer increased response times as a result of network congestion. For these applications, the document transfer time is directly related to the available bandwidth of the connection. Available bandwidth depends on two things: 1) the underlying capacity of the path from client to server, which is limited by the bottleneck link; and 2) the amount of other traffic competing for links on the path. If measurements of these quantities were available to the application, the current utilization of connections could be calculated. Network utilization could then be used as a basis for selection from a set of alternative connections or servers, thus providing reduced response time. Such a dynamic server selection scheme would be especially important in a mobile computing environment in which the set of available servers is frequently changing. In order to provide these measurements at the application level, we introduce two tools: bprobe, which provides an estimate of the uncongested bandwidth of a path; and cprobe, which gives an estimate of the current congestion along a path. These two measures may be used in combination to provide the application with an estimate of available bandwidth between server and client thereby enabling application-level congestion avoidance. In this paper we discuss the design and implementation of our probe tools, specifically illustrating the techniques used to achieve accuracy and robustness. We present validation studies for both tools which demonstrate their reliability in the face of actual Internet conditions; and we give results of a survey of available bandwidth to a random set of WWW servers as a sample application of our probe technique. We conclude with descriptions of other applications of our measurement tools, several of which are currently under development.

"System in package technology" - design for manufacture challenges

Purpose – To present key challenges associated with the evolution of system-in-package technologies and present technical work in reliability modeling and embedded test that contributes to these challenges. Design/methodology/approach – Key challenges have been identified from the electronics and integrated MEMS industrial sectors. Solutions to optimising the reliability of a typical assembly process and reducing the cost of production test have been studied through simulation and modelling studies based on technology data released by NXP and in collaboration with EDA tool vendors Coventor and Flomerics. Findings – Characterised models that deliver special and material dependent reliability data that can be used to optimize robustness of SiP assemblies together with results that indicate relative contributions of various structural variables. An initial analytical model for solder ball reliability and a solution for embedding a low cost test for a capacitive RF-MEMS switch identified as an SiP component presenting a key test challenge. Research limitations/implications – Results will contribute to the further development of NXP wafer level system-in-package technology. Limitations are that feedback on the implementation of recommendations and the physical characterisation of the embedded test solution. Originality/value – Both the methodology and associated studies on the structural reliability of an industrial SiP technology are unique. The analytical model for solder ball life is new as is the embedded test solution for the RF-MEMS switch.

Computational approach for reliable and robust system-in-package design

A computational modelling approach integrated with optimisation and statistical methods that can aid the development of reliable and robust electronic packages and systems is presented. The design for reliability methodology is demonstrated for the design of a SiP structure. In this study the focus is on the procedure for representing the uncertainties in the package design parameters, their impact on reliability and robustness of the package design and how these can be included in the design optimisation modelling framework. The analysis of thermo-mechanical behaviour of the package is conducted using non-linear transient finite element simulations. Key system responses of interest, the fatigue life-time of the lead-free solder interconnects and warpage of the package, are predicted and used subsequently for design purposes. The design tasks are to identify the optimal SiP designs by varying several package input parameters so that the reliability and the robustness of the package are improved and in the same time specified performance criteria are also satisfied

Reliability based design optimisation for system-in-package

This paper discusses a reliability based optimisation modelling approach demonstrated for the design of a SiP structure integrated by stacking dies one upon the other. In this investigation the focus is on the strategy for handling the uncertainties in the package design inputs and their implementation into the design optimisation modelling framework. The analysis of fhermo-mechanical behaviour of the package is utilised to predict the fatigue life-time of the lead-free board level solder interconnects and warpage of the package under thermal cycling. The SiP characterisation is obtained through the exploitation of Reduced Order Models (ROM) constructed using high fidelity analysis and Design of Experiments (DoE) methods. The design task is to identify the optimal SiP design specification by varying several package input parameters so that a specified target reliability of the solder joints is achieved and in the same time design requirements and package performance criteria are met

Design for reliability for wafer level system in package

This paper discusses the Design for Reliability modelling of several System-in-Package (SiP) structures developed by NXP and advanced on the basis of Wafer Level Packaging (WLP). Two different types of Wafer Level SiP (WLSiP) are presented and discussed. The main focus is on the modelling approach that has been adopted to investigate and analyse the board level reliability of the presented SiP configurations. Thermo-mechanical non-linear Finite Element Analysis (FEA) is used to analyse the effect of various package design parameters on the reliability of the structures and to identify design trends towards package optimisation. FEA is used also to gain knowledge on moulded wafer shrinkage and related issues during the wafer level fabrication. The paper provides a brief outline and demonstration of a design methodology for reliability driven design optimisation of SiP. The study emphasises the advantages of applying the methodology to address complex design problems where several requirements may exist and uncertainties and interactions between parameters in the design are common.

System integration design in MEMS - A case study of micromachined load cell

One of the critical issues in large scale commercial exploitation of MEMS technology is its system integration. In MEMS, a system design approach requires integration of varied and disparate subsystems with one of a kind interface. The physical scales as well as the magnitude of signals of various subsystems vary widely. Known and proven integration techniques often lead to considerable loss in advantages the tiny MEMS sensors have to offer. Therefore, it becomes imperative to think of the entire system at the outset, at least in terms of the concept design. Such design entails various aspects of the system ranging from selection of material, transduction mechanism, structural configuration, interface electronics, and packaging. One way of handling this problem is the system-in-package approach that uses optimized technology for each function using the concurrent hybrid engineering approach. The main strength of this design approach is the fast time to prototype development. In the present work, we pursue this approach for a MEMS load cell to complete the process of system integration for high capacity load sensing. The system includes; a micromachined sensing gauge, interface electronics and a packaging module representing a system-in-package ready for end characterization. The various subsystems are presented in a modular stacked form using hybrid technologies. The micromachined sensing subsystem works on principles of piezo-resistive sensing and is fabricated using CMOS compatible processes. The structural configuration of the sensing layer is designed to reduce the offset, temperature drift, and residual stress effects of the piezo-resistive sensor. ANSYS simulations are carried out to study the effect of substrate coupling on sensor structure and its sensitivity. The load cell system has built-in electronics for signal conditioning, processing, and communication, taking into consideration the issues associated with resolution of minimum detectable signal. The packaged system represents a compact and low cost solution for high capacity load sensing in the category of compressive type load sensor.

Synergism between high-pressure processing and active packaging against Listeria monocytogenes in ready-to-eat chicken breast

The effects of high-pressure processing (HPP) in conjunction with an essential oil-based active packaging on the surface of ready-to-eat (RTE) chicken breast were investigated as post-processing listericidal treatment. Three different treatments were used, and all samples were vacuum packed: (i) HPP at 500. MPa for 1. min (control), (ii) active packaging based on coriander essential oil, and (iii) active packaging and HPP. When applied individually, active packaging and pressurisation delayed the growth of Listeria monocytogenes. The combination of HPP and active packaging resulted in a synergistic effect reducing the counts of the pathogen below the detection limit throughout 60. days storage at 4. °C. However, when these samples were stored at 8. °C, growth did occur, but again a delay in growth was observed. The effects on colour and lipid oxidation were also studied during storage and were not significantly affected by the treatments. Active packaging followed by in-package pressure treatment could be a useful approach to reduce the risk of L. monocytogenes in cooked chicken without impairing its quality. Industrial relevance: Ready-to-eat products are of great economic importance to the industry. However, they have been implicated in several outbreaks of listeriosis. Therefore, effective ways to reduce the risk from this pathogenic microorganism can be very attractive for manufacturers. This study showed that the use of active packaging followed by HPP can enhance the listericidal efficiency of the treatment while using lower pressure levels, and thus having limited effects on colour and lipid oxidation of RTE chicken breast.

Design and analysis of micro-channel heat-exchanger embedded in Low Temperature Co-fire Ceramic (LTCC)

Increased device density, switching speeds of integrated circuits and decrease in package size is placing new demands for high power thermal-management. The convectional method of forced air cooling with passive heat sink can handle heat fluxes up-to 3-5W/cm2; however current microprocessors are operating at levels of 100W/cm2, This demands the usage of novel thermal-management systems. In this work, water-cooling systems with active heat sink are embedded in the substrate. The research involved fabricating LTCC substrates of various configurations - an open-duct substrate, the second with thermal vias and the third with thermal vias and free-standing metal columns and metal foil. Thermal testing was performed experimentally and these results are compared with CFD results. An overall thermal resistance for the base substrate is demonstrated to be 3.4oC/W-cm2. Addition of thermal vias reduces the effective resistance of the system by 7times and further addition of free standing columns reduced it by 20times.

Modelling the behavior of solder joints for wafer level SiP

Design for manufacture of system-in-package (SiP) structures is dependent on a number of physical processes that affect the final quality of the package in terms of its performance and reliability. Solder joints are key structures in a SiP and their behavior can be the critical factor in terms of reliability. This paper discusses the results from a research programme on design for manufacturing of system in package (SiP) technologies. The focus of the paper is on thermo-mechanical modelling of solder joints. This includes the behavior of the joints during testing plus some important insights into the reflow process and how physical phenomena taking place at the assembly stage can affect solder joint behavior. Finite element analysis of a numerical model of an SiP structure with various design parameters is discussed. The goal of this analysis is to identify the most promising combination of design parameters which guarantee longer lifetime of the solder joints and hence the SiP component. The parameters that were studied are the size of the package (i.e. number of solder joints per row), the presence of the underfill and/or the reinforcement as well as the thickness of the passive die. Discussion was also provided on phenomena that take place during the reflow process where the solder joints are formed. In particular, the formation of intermetallics at the solder-pad interfaces

Design and modeling challenges for high density packaging

Today most of the IC and board designs are undertaken using two-dimensional graphics tools and rule checks. System-in-package is driving three-dimensional design concepts and this is posing a number of challenges for electronic design automation (EDA) software vendors. System-in-package requires three-dimensional EDA tools and design collaboration systems with appropriate manufacturing and assembly rules for these expanding technologies. Simulation and Analysis tools today focus on one aspect of the design requirement, for example, thermal, electrical or mechanical. System-in-Package requires analysis and simulation tools that can easily capture the complex three dimensional structures and provided integrated fast solutions to issues such as thermal management, reliability, electromagnetic interference, etc. This paper discusses some of the challenges faced by the design and analysis community in providing appropriate tools to engineers for System-in-Package design

Implementação do protocolo LMP de gerência de enlace em redes GMPLS ópticas

Pós-graduação em Ciência da Computação - IBILCE

Characterization of polylactic acid films for food packaging as affected by dielectric barrier discharge atmospheric plasma

Dielectric barrier discharge (DBD) air plasma is a novel technique for in-package decontamination of food, but it has not been yet applied to the packaging material. Characterization of commercial polylactic acid (PLA) films was done after in-package DBD plasma treatment at different voltages and treatment times to evaluate its suitability as food packaging material. DBD plasma increased the roughness of PLA film mainly at the site in contact with high voltage electrode at both the voltage levels of 70 and 80 kV. DBD plasma treatments did not induce any change in the glass transition temperature, but significant increase in the initial degradation temperature and maximum degradation temperature was observed. DBD plasma treatment did not adversely affect the oxygen and water vapor permeability of PLA. A very limited overall migration was observed in different food simulants and was much below the regulatory limits. Industrial relevance: In-package DBD plasma is a novel and innovative approach for the decontamination of foods with potential industrial application. This paper assesses the suitability of PLA as food packaging material for cold plasma treatment. It characterizes the effect of DBD plasma on the packaging material when used for in-package decontamination of food. The work described in this research offers a promising alternative to classical methods used in fruit and vegetable industries where in-package DBD plasma can serve as an effective decontamination process and avoids any post-process recontamination or hazards from the package itself.

Advanced parametrical modelling of 24 GHz radar sensor IC packaging components

This paper deals with the development of an advanced parametrical modelling concept for packaging components of a 24 GHz radar sensor IC used in automotive driver assistance systems. For fast and efficient design of packages for system-in-package modules (SiP), a simplified model for the description of parasitic electromagnetic effects within the package is desirable, as 3-D field computation becomes inefficient due to the high density of conductive elements of the various signal paths in the package. By using lumped element models for the characterization of the conductive components, a fast indication of the design's signal-quality can be gained, but so far does not offer enough flexibility to cover the whole range of geometric arrangements of signal paths in a contemporary package. This work pursues to meet the challenge of developing a flexible and fast package modelling concept by defining parametric lumped-element models for all basic signal path components, e.g. bond wires, vias, strip lines, bumps and balls. © Author(s) 2011. CC Attribution 3.0 License.

Nuevos horizontes en materia de viajes combinados

Los viajes combinados han ocupado tradicionalmente un lugar destacado dentro de la amplia gama de servicios ofrecidos por los operadores turísticos. Por ello, el Consejo de la Unión Europea adoptó en 1990 la Directiva 90/314/CEE, de 13 de junio, relativa a los viajes combinados, las vacaciones combinadas y los circuitos combinados, con el fin de eliminar, o cuanto menos mitigar, la especial situación de indefensión en que se encontraba aquél que los contrataba. Desde la aprobación de esta Directiva han pasado casi veinticinco años y ante el surgimiento de problemas derivados de la aparición de nuevos modelos de negocio y formas de contratación de los servicios turísticos que ni siquiera se plantearon en aquel momento, se ha hecho necesaria la revisión de una normativa a todas luces obsoleta e incapaz de proteger adecuadamente a los usuarios de estos servicios. Así, el 9 de julio de 2013 la Comisión Europea aprobó la Propuesta de Directiva del Parlamento Europeo y del Consejo relativa a los viajes combinados y los servicios asistidos de viaje, por la que se modifican el Reglamento (CE) nº 2006/2004 y la Directiva 2011/83/UE y por la que se deroga la Directiva 90/314/CEE. El objetivo de este trabajo se centra en analizar las modificaciones propuestas por la C C omisión respecto al ámbito de aplicación de la Directiva 90/314/CEE y su posible repercusión en las legislaciones internas, sobre todo teniendo en cuenta el enfoque de armonización máxima que se pretende dar al nuevo texto.