Plane strain problem of growing crack for a perfectly plastic solid

In this paper, fundamental equations of the plane strain problem based on the 3-dimensional plastic flow theory are presented for a perfectly-plastic solid The complete governing equations for the growing crack problem are developed. The formulae for determining the velocity field are derived.The asymptotic equation consists of the premise equation and the zero-order governing equation. It is proved that the Prandtl centered-fan sector satisfies asymptotic equation but does not meet the needs of hlgher-order governing equations.

Numerical investigation on stable crack growth in plane stress

Large deformation finite element analysis has been carried out to investigate the stress-strain fields ahead of a growing crack for compact tension .a=W D 0:5/ and three-point bend .a=W D 0:1 and 0:5/ specimens under plane stress condition. The crack growth is controlled by the experimental J -integral resistance curves measured by Sun et al. The results indicate that the distributions of opening stress, equivalent stress and equivalent strain ahead of a growing crack are not sensitive to specimen geometry. For both stationary and growing cracks, similar distributions of opening stress and triaxiality can be found along the ligament. During stable crack growth, the crack-tip opening displacement (CTOD) resistance curve and the cohesive fracture energy in the fracture process zone are independent of specimen geometry and may be suitable criteria for characterizing stable crack growth in plane stress.

An automatic algorithm for mixed mode crack growth rate based on drop potential method

A new automatic algorithm for the assessment of mixed mode crack growth rate characteristics is presented based on the concept of an equivalent crack. The residual ligament size approach is introduced to implementation this algorithm for identifying the crack tip position on a curved path with respect to the drop potential signal. The automatic algorithm accounting for the curvilinear crack trajectory and employing an electrical potential difference was calibrated with respect to the optical measurements for the growing crack under cyclic mixed mode loading conditions. The effectiveness of the proposed algorithm is confirmed by fatigue tests performed on ST3 steel compact tension-shear specimens in the full range of mode mixities from pure mode Ito pure mode II. (C) 2015 Elsevier Ltd. All rights reserved.

Crack growth by grain boundary cavitation in the transient and extensive creep regimes

Crack growth due to cavity growth and coalescence along grain boundaries is analyzed under transient and extensive creep conditions in a compact tension specimen. Account is taken of the finite geometry changes accompanying crack tip blunting. The material is characterized as an elastic-power law creeping solid with an additional contribution to the creep rate arising from a given density of cavitating grain boundary facets. All voids are assumed present from the outset and distributed on a given density of cavitating grain boundary facets. The evolution of the stress fields with crack growth under three load histories is described in some detail for a relatively ductile material. The full-field plane strain finite element calculations show the competing effects of stress relaxation due to constrained creep, diffusion and crack tip blunting. and of stress increase due to the instantaneous elastic response to crack growth. At very high crack growth rates the Hui-Riedel fields dominate the crack tip region. However. the high growth rates are not sustained for any length of time in the compact tension geometry analyzed. The region of dominance of the Hui-Riedel field shrinks rapidly so that the near-tip fields are controlled by the HRR-type field shortly after the onset of crack growth. Crack growth rates under various conditions of loading and spanning the range of times from small scale creep to extensive creep are obtained. We show that there is a strong similarity between crack growth history and the behaviour of the C(t) and C(t) parameters. so that crack growth rates correlate rather well with C(t) and C(t). A relatively brittle material is also considered that has a very different near-tip stress field and crack growth history.

The Flow Theory of Mechanism-Based Strain Gradient Plasticity

The flow theory of mechanism-based strain gradient (MSG) plasticity is established in this paper following the same multiscale, hierarchical framework for the deformation theory of MSG plasticity in order to connect with the Taylor model in dislocation mechanics. We have used the flow theory of MSG plasticity to study micro-indentation hardness experiments. The difference between deformation and flow theories is vanishingly small, and both agree well with experimental hardness data. We have also used the flow theory of MSG plasticity to investigate stress fields around a stationary mode-I crack tip as well as around a steady state, quasi-statically growing crack tip. At a distance to crack tip much larger than dislocation spacings such that continuum plasticity still applies, the stress level around a stationary crack tip in MSG plasticity is significantly higher than that in classical plasticity. The same conclusion is also established for a steady state, quasi-statically growing crack tip, though only the flow theory can be used because of unloading during crack propagation. This significant stress increase due to strain gradient effect provides a means to explain the experimentally observed cleavage fracture in ductile materials [J. Mater. Res. 9 (1994) 1734, Scripta Metall. Mater. 31 (1994) 1037; Interface Sci. 3(1996) 169].

Low-cost high-efficiency GaN LED on large-area si substrate

The use of large size Si substrates for epitaxy of nitride light emitting diode (LED) structures has attracted great interest because Si wafers are readily available in large diameter at low cost. In addition, such wafers are compatible with existing processing lines for the 6-inch and larger wafer sizes commonly used in the electronics industry. With the development of various methods to avoid wafer cracking and reduce the defect density, the performance of GaN-based LED and electronic devices has been greatly improved. In this paper, we review our methods of growing crack-free InGaN-GaN multiple quantum well (MQW) LED structures of high crystalline quality on Si(111) substrates. The performance of processed LED devices and its dependence on the threading dislocation density were studied. Full wafer-level LED processing using a conventional 6-inch III-V processing line is also presented, demonstrating the great advantage of using large-size Si substrates for mass production of GaN LED devices.

Subcritical fatigue in fuse networks

We obtain the Paris law of fatigue crack propagation in a fuse network model where the accumulated damage in each resistor increases with time as a power law of the local current amplitude. When a resistor reaches its fatigue threshold, it burns irreversibly. Over time, this drives cracks to grow until the system is fractured into two parts. We study the relation between the macroscopic exponent of the crack-growth rate -entering the phenomenological Paris law-and the microscopic damage accumulation exponent, gamma, under the influence of disorder. The way the jumps of the growing crack, Delta a, and the waiting time between successive breaks, Delta t, depend on the type of material, via gamma, are also investigated. We find that the averages of these quantities, <Delta a > and <Delta t >/< t(r)>, scale as power laws of the crack length a, <Delta a > proportional to a(alpha) and <Delta t >/< t(r)> proportional to a(-beta), where < t(r)> is the average rupture time. Strikingly, our results show, for small values of gamma, a decrease in the exponent of the Paris law in comparison with the homogeneous case, leading to an increase in the lifetime of breaking materials. For the particular case of gamma = 0, when fatigue is exclusively ruled by disorder, an analytical treatment confirms the results obtained by simulation. Copyright (C) EPLA, 2012

Effect of constraint on ductile crack growth and ductile-brittle fracture transition of a carbon steel

Ductile-brittle fracture transition was investigated using compact tension (CT) specimens from -70oC to 40oC for a carbon steel. Large deformation finite element analysis has been carried out to simulate the stable crack growth in the compact tension (CT, a/W=0.6), three point-point bend (SE(B), a/W=0.1) and centre-cracked tension (M(T), a/W=0.5) specimens. Experimental crack tip opening displacement (CTOD) resistance curve was employed as the crack growth criterion. Ductile tearing is sensitive to constraint and tearing modulus increases with reduced constraint level. The finite element analysis shows that path-dependence of J-integral occurs from the very beginning of crack growth and ductile crack growth elevates the opening stress on the remaining ligament. Cleavage may occur after some ductile crack growth due to the increase of opening stress. For both stationary and growing cracks, the magnitude of opening stress increases with increasing in-plane constraint. The ductile-brittle transition takes place when the opening stress ahead of the crack tip reaches the local cleavage stress as the in-plane constraint of the specimen increases.

A Finite Element Analysis of a Crack Penetrating or Deflecting into an Interface in a Thin Laminate

The crack tip driving force of a crack growing from a pre-crack that is perpendicular to and terminating at an interface between two materials is investigated using a linear fracture mechanics theory. The analysis is performed both for a crack penetrating the interface, growing straight ahead, and for a crack deflecting into the interface. The results from finite element calculations are compared with asymptotic solutions for infinitesimally small crack extensions. The solution is found to be accurate even for fairly large amounts of crack growth. Further, by comparing the crack tip driving force of the deflected crack with that of the penetrating crack, it is shown how to control the path of the crack by choosing the adhesion of the interface relative to the material toughness.

Effect of Laser Shock Peening on Fatigue Crack Propagation of Aeronautical Structures

Laser Shock Peening (LSP) is a surface enhancement treatment which induces a significant layer of beneficial compressive residual stresses up to several mm underneath the surface of metal components in order to improve the detrimental effects of crack growth behavior rate in it. The aim of this thesis is to predict the crack growth behavior of thin Aluminum specimens with one or more LSP stripes defining a compressive residual stress area. The LSP treatment has been applied as crack retardation stripes perpendicular to the crack growing direction, with the objective of slowing down the crack when approaching the LSP patterns. Different finite element approaches have been implemented to predict the residual stress field left by the laser treatment, mostly by means of the commercial software Abaqus/Explicit. The Afgrow software has been used to predict the crack growth behavior of the component following the laser peening treatment and to detect the improvement in fatigue life comparing to the specimen baseline. Furthermore, an analytical model has been implemented on the Matlab software to make more accurate predictions on fatigue life of the treated components. An educational internship at the Research and Technologies Germany- Hamburg department of Airbus helped to achieve knowledge and experience to write this thesis. The main tasks of the thesis are the following: -To up to date Literature Survey related to laser shock peening in metallic structures -To validate the FE models developed against experimental measurements at coupon level -To develop design of crack growth slow down in centered and edge cracked tension specimens based on residual stress engineering approach using laser peened patterns transversal to the crack path -To predict crack growth behavior of thin aluminum panels -To validate numerical and analytical results by means of experimental tests.

Short fatigue crack path determinants in polycrystalline Ni-base superalloys

Fifty seven short fatigue cracks in the Ni-base superalloy AP1 have been examined, to ascertain how the paths taken by growing fatigue cracks are determined. The observations were made on the surface of a smooth specimen, and on the exposed fracture surfaces. Three dimensional reconstructions of the vulnerable microstructures in the vicinity of the cracks were produced. Initiation occurred in mode II, with the lines of intersection of the initiation sites with the specimen top surface orientated at approximately 45° to the tensile axis. These initiation sites developed in slip bands which crossed a large grain and at least one other grain via a grain boundary with a low angle of misorientation. 'River markings' on one of the initiation facets, indicated that the crack first opened from the top centre of the initiation grain. Subsequent to initiation, the growth paths of these cracks are related to the misorientations of the grains and the progress of the crack front.

Short and long fatigue crack growth in a SiC reinforced aluminium alloy

Fatigue crack growth behaviour in a 15 wt% SiC particulate reinforced 6061 aluminium alloy has been examined using pre-cracked specimens. Crack initiation and early growth of fatigue cracks in smooth specimens has also been investigated using the technique of periodic replication. The composite contained a bimodal distribution of SiC particle sizes, and detailed attention was paid to interactions between the SiC particles and the growing fatigue-crack tip. At low stress intensity levels, the proportion of coarse SiC particles on the fatigue surfaces was much smaller than that on the metallographic sections, indicating that the fatigue crack tends to run through the matrix avoiding SiC particles. As the stress intensity level increases, the SiC particles ahead of the growing fatigue crack tip are fractured and the fatigue crack then links the fractured particles. The contribution of this monotonic fracture mode resulted in a higher growth rate for the composite than for the unreinforced alloy. An increase in the proportion of cracked, coarse SiC particles on the fatigue surface was observed for specimens tested at a higher stress ratio.