Development of a new epoxy resin for superconducting magnet impregnation

A novel epoxy resin system based on a low viscosity Bisphenol-A (DGEBA)/Bisphenol-F (DGEBF) blend has been investigated for use in tight-wound superconducting magnet impregnation. The principle is to decrease the Bisphenol-A resin system viscosity by adding the low viscosity Bisphenol-F resin. The rheological and mechanical properties of the blend system are compared to the pure Bisphenol-A resin and also to the Bisphenol-F resin both cured with acid anhydride. For the vacuum/pressure impregnation, both the pure Bisphenol-F resin system and DGEBA/DGEBF blend system can be applied without S-glass fabric between coil layers due to its higher rigidity at low temperature and good resistance to thermal shock. This resin system have been tested for impregnation of copper and NbTi wire wound coils whilst Bisphenol-A resin system have been used for testing Nb3Sn coil impregnation where S-glass braid is present as wire insulation.

Dielectric thermal analysis as a tool for quantitative-evaluation of the viscosity and the kinetics of epoxy resin cure

Dielectric thermal analysis has been proved as a valuable tool for monitoring the epoxy curing process and the related rheological properties in the fabrication of polymer-matrix composite materials. This technique also has the potential to be applied in the monitoring of magnet impregnation processes as well as in quality control. In this work we present the quantitative evaluation of the viscosity changing and the curing kinetics for a commercial Stycast epoxy resin system at different temperatures through the impedance analysis. The results showed correlation between the real component of the complex impedance and the isothermal reaction extent. Comparing the dielectric analysis result with the viscosity measured by rotational rheometer we observed a similar behavior reported for dynamic mechanic analysis. The results comparison have shown that the kinetics parameters obtained from DSC and DETA analysis showed different sensitivities related to the characteristics of curing stages. We concluded that the dielectric thermal analysis should be applied in quantitative evaluation of cure kinetics.

Effect of functionalized kaolinite on the curing kinetics of cycloaliphatic epoxy/anhydride system

Silane grafted kaolinite (KGS) was prepared through grinding kaolinite and then grafting with 3-aminopropyltriethoxysilane. The influence of KGS on the curing kinetics of cycloaliphatic epoxy resin was studied by non-isothermal differential scanning calorimetry at different heating rates. The reaction activation energy (Ea) was determined based on the Flynn–Wall–Ozawa method. The results of dynamic differential scanning calorimetry (DSC) kinetic analysis show that the surface hydroxyl groups of clay decreases the Ea from 70.6 kJ mol− 1 to 62.8 kJ mol− 1 and accelerates the curing reaction of the epoxy resin. The silane grafting reactions consume the surface hydroxyl groups of kaolinite and lead to a decrease in the catalytic efficiency of KGS in the curing of epoxy resin.

WETTABILITY OF EPOXY RESIN ON CARBON FIBER

The micrographs of epoxy resin on single carbon fiber at room temperature and the temperature dependent contact angle on single carbon fiber were investigated using field environmental scanning electron microscope (FESEM). The results showed that the contact angle decreases significantly with increasing temperature. The advantage of this experimental approach was that can directly reflected the wettability of epoxy resin to fiber. But the experimental process was complicated, and there were many influence factors. The reason is that the wettability of epoxy resin on parallel sheet can be improved at higher temperatures. The spreading procedures for the epoxy resin droplet on carbon fiber cluster were observed by means of drop shape analysis system ( DSA) in parallel and perpendicular directions of the aligned fibers.

Studies on short Nylon-6 fiber - elastomer composites with epoxy resin as bonding agent

The thesis describes the development and evaluation of epoxy resin as interfacial bonding agent for short Nylon-6 fiber elastomer composites. Epoxy resin is well known for its adhesive property. The potential use of it as interfacial bonding agent in short fiber composite is not explored yet. Three rubbers viz., acrylonitrile butadiene rubber (NBR), Neoprene rubber (CR) and styrene butadiene rubber (SBR) were selected and different fiber loading were tried. The resin concentration was optimized for each fiber loading with respect to cure characteristics and mechanical properties. Rheological characteristics and thermal degradation of the composites containing different fiber loading and different resin concentrations were studied in detail to find the effect of epoxy resin bonding system. The mechanical properties were studied in detail. The short Nylon -6 fiber improved most of the mechanical properties of all the three rubbers. Tensile strength showed a dip at 10 phr fiber loading in the case of CR while it was continuously increased with fiber loading in the case of NBR and SBR. All the composites showed anisotropy in mechanical properties. The epoxy resin is an effective bonding agent for short Nylon -6 fiber reinforced NBR and CR composites. Epoxy resin improved tensile strength, abrasion resistance and modulus of these composites. SEM studies confirmed the improved bonding of fiber and matrix in the presence of epoxy bonding agent. Epoxy resin was not effective as bonding agent in the case of short Nylon fiber- SBR composite. From the rheological studies of the composites with and without bonding agent it was observed that all the composite exhibited pseudoplasticity, which decreased with temperature. At higher shear rates all the mixes showed plug flow. SEM pictures showed that maximum orientation of fibers occured at a shear rate, just before the onset of plug flow. The presence of fiber reduced the temperature sensitivity of the flow at a given shear rate. Die swell was reduced in the presence of fiber. Shear viscosity of the composite was increased in the presence of resin. Die swell was increased in the presence of epoxy resin for composites at all shear rates. The thermal degradation of NBR and SBR composites with and without bonding agent followed single step degradation pattern. Thermal stability of the composites was improved in the presence of bonding agent. The degradation of virgin elastomer and the composites followed first order kinetics.

The effect of final irrigation on the penetrability of an epoxy resin-based sealer into dentinal tubules: a confocal microscopy study

Introduction The aim of this study was to compare the effect of QMix, BioPure MTAD, 17 % EDTA, and saline on the penetrability of a resin-based sealer into dentinal tubules using a confocal laser scanning microscope (CLSM) and to describe the cleaning of root canal walls by SEM. Methods Eighty distobuccal roots from upper molars were selected and randomly divided into four groups (n=20) before root canal preparation according to the solution used in the final rinse protocol (FRP): QG (QMix), MG (BioPure MTAD), EG (17 % EDTA), and CG (control group: saline). Ten roots of each group were prepared for SEM, and images (×2000) from the canal walls were acquired. The remaining canals were filled with a single gutta-percha cone and AH Plus with 0.1 % Rhodamine B. The specimens were horizontally sectioned at 4 mm from the apex, and the slices were analyzed in CLSM (×10). Sealer penetration was analyzed with Adobe Photoshop software. Results QG and EG presented similar amounts of sealer penetration (P>.05). MG and CG presented the lowest penetrability values (P<.05). The best results for smear layer removal of the apical third of the root canal were achieved by the QG and EG groups when compared with MG and CG (P<.05). Conclusions Seventeen percent EDTA and QMix promoted sealer penetration superior to that achieved by BioPure MTAD and saline. Clinical relevance Despite studies have not confirmed the relationship between sealing ability of endodontic sealers and their penetration in dentinal tubules, sealer penetration assumes importance, since endodontic sealers, unlike guttapercha, are able to penetrate in dentinal tubules, isthmus, and accessory canals, filling the root canal system.

Evaluation of epoxy resin sealer after three root canal filling techniques by confocal laser scanning microscopy

The aim of this study was to evaluate the penetration of endodontic sealer into the dentin tubules, the integrity of the sealer layer perimeter, and the sealer area at the apical third after different filling techniques by confocal laser scanning microscopy (CLSM). Forty-five mandibular premolars were mechanically prepared with ProTaper files, until F5 file. Thereafter, they were filled with an epoxy-resin sealer (AH Plus) mixed with Rhodamine B dye (0.1% proportion) and allocated in three groups: Group 1, single master cone; Group 2, cold lateral compaction; and Group 3, Thermafil. For confocal laser scanning microscopy analysis, the specimens were transversely sectioned at 4 mm from the apex. The images at x10 and x40 were analyzed by Imagetool 3.0 software. Significant differences were not found among the three experimental groups according the dentin-impregnate area by the sealer (P = 0.68) and between the sealer and root canal perimeter (P = 0.18). However, root canal filling techniques were significantly different when apical sealer areas were compared (P = 0.001). Thermafil group showed smaller sealer areas (8.09%) while cold lateral compaction and gutta-percha master cone showed similar areas (17.37 and 21.18%, respectively). The dentin-impregnated area was not dependent on the root canal filling technique. Single master cone, cold lateral condensation and Thermafil techniques presented integrity of the sealer perimeter close to 100% and Thermafil resulted in a significantly thinner sealer layer. Microsc. Res. Tech. 75:12771280, 2012. (C) 2012 Wiley Periodicals, Inc.

Study on microwave dielectric properties of epoxy resin mixtures used for rapid product development

This paper presents a preliminary study on the dielectric properties and curing of three different types of epoxy resins mixed at various stichiometric mixture of hardener, flydust and aluminium powder under microwave energy. In this work, the curing process of thin layers of epoxy resins using microwave radiation was investigated as an alternative technique that can be implemented to develop a new rapid product development technique. In this study it was observed that the curing time and temperature were a function of the percentage of hardener and fillers presence in the epoxy resins. Initially dielectric properties of epoxy resins with hardener were measured which was directly correlated to the curing process in order to understand the properties of cured specimen. Tensile tests were conducted on the three different types of epoxy resins with hardener and fillers. Modifying dielectric properties of the mixtures a significant decrease in curing time was observed. In order to study the microstructural changes of cured specimen the morphology of the fracture surface was carried out by using scanning electron microscopy.

Characteristics of epoxy resin/SiO2 nanocomposite insulation : effects of plasma surface treatment on the nanoparticles

The present study compares the effects of two different material processing techniques on modifying hydrophilic SiO2 nanoparticles. In one method, the nanoparticles undergo plasma treatment by using a custom-developed atmospheric-pressure non-equilibrium plasma reactor. With the other method, they undergo chemical treatment which grafts silane groups onto their surface and turns them into hydrophobic. The treated nanoparticles are then used to synthesize epoxy resin-based nanocomposites for electrical insulation applications. Their characteristics are investigated and compared with the pure epoxy resin and nanocomposite fabricated with unmodified nanofillers counterparts. The dispersion features of the nanoparticles in the epoxy resin matrix are examined through scanning electron microscopy (SEM) images. All samples show evidence that the agglomerations are smaller than 30 nm in their diameters. This indicates good dispersion uniformity. The Weibull plot of breakdown strength and the recorded partial discharge (PD) events of the epoxy resin/plasma-treated hydrophilic SiO2 nanocomposite (ER/PTI) suggest that the plasma-treated specimen yields higher breakdown strength and lower PD magnitude as compared to the untreated ones. In contrast, surprisingly, lower breakdown strength is found for the nanocomposite made by the chemically treated hydrophobic particles, whereas the PD magnitude and PD numbers remain at a similar level as the plasma-treated ones.

Reinforced insulation properties of epoxy resin/SiO2 nanocomposites by atmospheric pressure plasma modification

Nanocomposite dielectrics hold a promising future for the next generation of insulation materials because of their excellent physical, chemical, and dielectric properties. In the presented study, we investigate the use of plasma processing technology to further enhance the dielectric performance of epoxy resin/SiO2 nanocomposite materials. The SiO2 nanoparticles are treated with atmospheric-pressure non-equilibrium plasma prior to being added into the epoxy resin host. Fourier transform infrared spectroscopy (FTIR) results reveal the effects of the plasma process on the surface functional groups of the treated nanoparticles. Scanning electron microscopy (SEM) results show that the plasma treatment appreciably improves the dispersion uniformity of nanoparticles in the host polymer. With respect to insulation performance, the epoxy/plasma-treated SiO2 specimen shows a 29% longer endurance time than the epoxy/untreated SiO2 nanocomposite under electrical aging. The Weibull plots of the dielectric breakdown field intensity suggest that the breakdown strength of the nanocomposite with the plasma pre-treatment on the nanoparticles is improved by 23.3%.

Surface insulation performance of epoxy resin/silica nanocomposite material

Composite polymer insulators provide many advantages over the traditional porcelain insulators and they are increasingly being used at both transmission and distribution levels. In the present paper, an epoxy resin/silica nanocomposite dielectric material (NDM) structure is proposed and fabricated. Hydrophobic fumed silica is incorporated in epoxy resin matrix and acetone is adopted as media agent to effectively achieve homogenous dispersion of the nano-scale silica filler. The acetone also acts as diluents to reduce viscosity before the curing phase of epoxy resin and enables bubbles to escape from being trapped. Through partial discharge (PD) and surface aging tests, it is illustrated that the inception of surface discharge of the proposed NDM is relatively higher than that of the non-filled counterpart, and a better PD resistivity was observed in the negative half cycle regarding to applied AC voltage. Results of surface aging test indicate that surface discharge activity is retarded over the test conducting time. By contrast, surface discharge developed to the opposite way on the non-filled sample. Therefore, the proposed NDM could provide better safety reliability and lower maintenance cost to industrial application compared with nonfilled conventional epoxy resin.

Epoxy resin chamber for high voltage breakdown studies in high vacuum

As the study of electrical breakdown phenomena in vacuum systems, gains more importance, a thorough understanding of the breakdown mechanism at high voltages necessitates a chamber for experimental studies. An epoxy-resin chamber has been constructed by casting ring sections which were joined together. The advantages of such a chamber over the conventional metal or glass chamber are given especially as regards the electric field configuration, high voltage lead-in, and the ease of construction. Special facilities can be incorporated while constructing the chamber which makes it more versatile; for example, in pre-breakdown current measurements, electron beam focusing studies, etc.

Synthesis of Co(II), Ni(II) and Cu(II) Complexes from Schiff base Ligand and Reactivity Studies with Thermosetting Epoxy Resin

A hybrid thermosetting maleimido epoxy compound 4-(N-maleimidophenyl) glycidylether (N-MPGE) containing Co(II), Ni(II) and Cu(II) ions was prepared by curing N-MPGE and tetradentate Schiff base Co(II), Ni(II) and Cu(II) complexes. The curing polymerization reaction of N-MPGE with metal complexes as curing agents was studied. The cured samples were studied for thermal stability, chemical (acid/alkali/solvent) and water absorption resistance and homogeneity of the cured systems. The tetradentate Schiff base, 3-(Z)-2-piperazin-1-yl-ethylimino]-1,3-dihydro indol-2-one was synthesized by the condensation of Isatin (Indole-2, 3-dione) with 1-(2-aminoethyl)piperazine (AEP). Its complexes with Co(II), Ni(II) and Cu(II) have been synthesized and characterized by microanalysis, conductivity, Uv-Visible, FT-IR, TGA and magnetic susceptibility measurements. The spectral data revealed that the ligand acts as a neutral tetradentate Schiff base and coordinating through the azomethine nitrogen, two piperazine nitrogen atoms and carbonyl oxygen.

Mechanical properties of Nylon-6/LDPE blends containing an epoxy resin compatibilizer

Binary and ternary blends of nylon-6/low density polyethylene (nylon-6/LDPE) and Nylon-6/LDPE/poly(ethylene-co-glycidyl methacrylate) were prepared by melt mixing. The blends exhibit two phase morphology with LDPE dispersed in the form of spherical domains in the nylon-6 matrix. The mechanical properties of the blends were measured by standard methods. It is shown that the use of the epoxy copolymer as a compatibilizer improves the impact strength of the blend as compared to nylon-6, which is attributed to better stress transfer across the interface due to the compatibilizer. The data for each mechanical property were also fitted into a best fit model equation and the method of steepest ascent was applied to arrive at the optimum composition of the blend for that property.

Compressive and Flexural Properties of Functionally Graded Fly Ash Cenosphere-Epoxy Resin Syntactic Foams

The present study focuses on developing functionally graded syntactic foams (FGSFs) based on a layered co-curing technique. The FGSFs were characterized for compressive and flexural properties and compared with plain syntactic foams. The results showed that the specific compressive modulus was 3-67% higher in FGSFs compared to plain syntactic foams. FGSF exhibited 5-34% and 34-87% higher specific modulus and strength, respectively in flexural mode. The microscopic examinations of comparative responses of the filler and matrix to deformation suggest that the failure is dominated by the matrix. The gradient in the composition of syntactic foams helps in effectively distributing the stress throughout the microstructure and results in improved mechanical performance of syntactic foams. From the microscopy studies, it is evident that, the failure mechanism in the FGSF under flexural loading is governed by a crack that initiated on the tensile side of the specimen and propagated through the thickness to cause complete fracture. The microscopic observations further clearly demonstrate the existence of seamless interfaces between the layers and a clear difference in the cenosphere concentration across the interface, affirming the gradation in the prepared samples. The results show that appropriate compositions of FGSFs can be selected to develop materials with improved mechanical performance. POLYM. COMPOS., 36:685-693, 2015. (c) 2014 Society of Plastics Engineers