920 resultados para Epoxy layers
Resumo:
Two types of carbon nanotube nanocomposite strain sensors were prepared by mixing carbon nanotubes with epoxy (nanocomposite sensor) and sandwiching a carbon nanotube film between two epoxy layers (sandwich sensor). The conductivity, response and sensitivity to static and dynamic mechanical strains in these sensors were investigated. The nanocomposite sensor with 2-3 wt.% carbon nanotube demonstrated high sensitivity to mechanical strain and environmental temperature, with gauge factors of 5-8. On the other hand, a linear relationship between conductivity and dynamic mechanical strain was observed in the sandwich sensor. The sandwich sensor was also not sensitive to temperature although its strain sensitivity (gauge factor of about 3) was lower as compared with the nanocomposite sensor. Both sensors have excellent response to static and dynamic strains, thereby having great potential for strain sensing applications.
Resumo:
Plasma processing of carbon fibers (CFs) is aimed to provide better contact and adhesion between individual plies without decrease in the CF mechanical resistance. This paper deals with surface modification of CFs by an atmospheric pressure dielectric barrier discharge (DBD) for enhancing the adhesion between the CF and the polymeric matrix. The scanning electron microscopy of the treated samples revealed many small particles distributed over entire surface of the fiber. These particles are product of the fiber surface etching during the DBD treatment that removes the epoxy layer covering as-received samples. The alteration of the CF surface morphology was also confirmed by the Atomic force microscopy (AFM), which indicated that the CF roughness increased as a result of the plasma treatment. The analysis of the surface chemical composition provided by X-ray photoelectron spectroscopy showed that oxygen and nitrogen atoms are incorporated onto the surface. The polar oxygen groups formed on the surface lead to the increasing of the CF surface energy. The results of interlaminar shear strength test (short beam) of CFs/polypropylene composites demonstrated a greater shear resistance of the composites made with CFs treated by DBD than the one with untreated fibers. Both the increase in surface roughness and the surface oxidation contribute for the enhancement of CF adhesion properties. © 2012 IEEE.
Resumo:
This paper presents a preliminary study on the dielectric properties and curing of three different types of epoxy resins mixed at various stichiometric mixture of hardener, flydust and aluminium powder under microwave energy. In this work, the curing process of thin layers of epoxy resins using microwave radiation was investigated as an alternative technique that can be implemented to develop a new rapid product development technique. In this study it was observed that the curing time and temperature were a function of the percentage of hardener and fillers presence in the epoxy resins. Initially dielectric properties of epoxy resins with hardener were measured which was directly correlated to the curing process in order to understand the properties of cured specimen. Tensile tests were conducted on the three different types of epoxy resins with hardener and fillers. Modifying dielectric properties of the mixtures a significant decrease in curing time was observed. In order to study the microstructural changes of cured specimen the morphology of the fracture surface was carried out by using scanning electron microscopy.
Resumo:
dThe work looks at the response to three-point loading of carbon-epoxy (CF-EP) composites with inserted buffer strip (BS) material. Short beam Shear tests were performed to study the load-deflection response as well as fracture features through macroscopy on the CF-EP system containing the interleaved PTFE-coated fabric material. Significant differences were noticed in the response of the CF-EP system to the bending process consequent to the architectural modification. It was inferred that introduction of small amounts of less adherent layers of material at specific locations causes a decrement in the load carrying capability. Further the number and the ease with which interface separation occurs is found to depend on the extent to which the inserted layer is present in either single or multiple layer positions.
Resumo:
The paper reports the failure features observed in low mass repeatedly (pendulum) impacted glass epoxy composites with and without the mid section having either 2-layers or 3-layers of flexible foam. Features such as through width and inclined cracks as well as adhering of foam observed in the experiments are explained. The significance of the foam material in modifying the impact response of the composite is stressed.
Resumo:
foam, either stacked together as three layers (MC) or inserted at three different positions (3L) while arranging the stacking sequence during the fabrication of glass fiber-epoxy composites, form the subject of investigation. This stacking variation resulted in a different interfacial area between these foam materials and the glass-epoxy regions in the laminates. This area in designed to be maximum for the 3L variety. The energy of impact being high enough to cause development of the crack in the samples, how the change in interfacial area affects the traverse of the crack front and the failure feature of the laminated composite are reported in the form of photomacrographs in this work. The results point to significant changes for the impact data, like for instance the peak load attained by the different samples, through thickness crack propagation and tensile fracture features on the non-impacted end for the plain variety, separation about the mid-zone for the MC laminates and two or more layer separations for the 3L variety. The separation for the foam-bearing systems occur invariably at the interface and here again one of the (two identical) interfaces only is chosen for the separation.
Resumo:
The effect on the macroscopic compressive failure features of introduction of two flexible foam layers, either together at mid-region or separately at two locations that are away from the midregion, into a glass-epoxy (G-E) system is studied in this work. In this experimental approach an attempt to look at the possible influence the foam/G-E interface region has on the way the materials respond to compressive loading is made by involving an analyses of macrofractographic features. While foam-free samples fail by extensive ear formation and separation nearer to the mid-region, the foam bearing ones display pronounced interface separation. The positioning of the foam sheet(s) has a bearing on the failure features.
Resumo:
The moisture absorption and changes in compression strengths in glass-epoxy (G-E composites without and with discrete quantities of graphite powders introduced into the resin mix prior to its spreading on specific glass fabric (layers) during the lay-up (stacking) sequence forms the subject matter of this report. The results point to higher moisture absorption for graphite bearing specimens. The strengths of graphite-free coupons show a continuous decrease, while the filler bearing ones show an initial rise followed by a drop for larger exposure times. Scanning Fractographic features were examined for an understanding of the process. The observations were explained invoking the effect of matrix plasticizing and the role of interfacial regions.
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The present study focuses on developing functionally graded syntactic foams (FGSFs) based on a layered co-curing technique. The FGSFs were characterized for compressive and flexural properties and compared with plain syntactic foams. The results showed that the specific compressive modulus was 3-67% higher in FGSFs compared to plain syntactic foams. FGSF exhibited 5-34% and 34-87% higher specific modulus and strength, respectively in flexural mode. The microscopic examinations of comparative responses of the filler and matrix to deformation suggest that the failure is dominated by the matrix. The gradient in the composition of syntactic foams helps in effectively distributing the stress throughout the microstructure and results in improved mechanical performance of syntactic foams. From the microscopy studies, it is evident that, the failure mechanism in the FGSF under flexural loading is governed by a crack that initiated on the tensile side of the specimen and propagated through the thickness to cause complete fracture. The microscopic observations further clearly demonstrate the existence of seamless interfaces between the layers and a clear difference in the cenosphere concentration across the interface, affirming the gradation in the prepared samples. The results show that appropriate compositions of FGSFs can be selected to develop materials with improved mechanical performance. POLYM. COMPOS., 36:685-693, 2015. (c) 2014 Society of Plastics Engineers
Resumo:
The ballistic performance of equi-mass plates made from (i) stainless steel (SS); (ii) carbon fibre/epoxy (CF) laminate and (iii) a hybrid plate of both materials has been characterised for a spherical steel projectile. The hybrid plate was orientated with steel on the impact face (SSCF) and on the distal face (CFSS). The penetration velocity (V 50) was highest for the SS plate and lowest for the CF plate. A series of double impact tests were performed, with an initial velocity V I and a subsequent velocity V II at the same impact site. An interaction diagram in (V I,V II) space was constructed to delineate penetration from survival under both impacts. The degree of interaction between the two impact events was greater for the CFSS plate than for the SSCF plate, implying that the distal face has the major effect upon the degree of interaction.
Resumo:
A novel epoxy resin system based on a low viscosity Bisphenol-A (DGEBA)/Bisphenol-F (DGEBF) blend has been investigated for use in tight-wound superconducting magnet impregnation. The principle is to decrease the Bisphenol-A resin system viscosity by adding the low viscosity Bisphenol-F resin. The rheological and mechanical properties of the blend system are compared to the pure Bisphenol-A resin and also to the Bisphenol-F resin both cured with acid anhydride. For the vacuum/pressure impregnation, both the pure Bisphenol-F resin system and DGEBA/DGEBF blend system can be applied without S-glass fabric between coil layers due to its higher rigidity at low temperature and good resistance to thermal shock. This resin system have been tested for impregnation of copper and NbTi wire wound coils whilst Bisphenol-A resin system have been used for testing Nb3Sn coil impregnation where S-glass braid is present as wire insulation.
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Weight reduction and improved damage tolerance characteristics were the prime drivers to develop new family of materials for the aerospace/ aeronautical industry. Aiming this objective, a new lightweight Fiber/ Metal Laminate (FML) has been developed. The combination of metal and polymer composite laminates can create a synergistic effect on many properties. The mechanical properties of FML shows improvements over the properties of both aluminum alloys and composite materials individually. Due to their excellent properties, FML are being used as fuselage skin structures of the next generation commercial aircrafts. One of the advantages of FML when compared with conventional carbon fiber/epoxy composites is the low moisture absorption. The moisture absorption in FML composites is slower when compared with polymer composites, even under the relatively harsh conditions, due to the barrier of the aluminum outer layers. Due to this favorable atmosphere, recently big companies such as EMBRAER, Aerospatiale, Boing, Airbus, and so one, starting to work with this kind of materials as an alternative to save money and to guarantee the security of their aircrafts.
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Composite materials made of epoxy resin and barium titanate (BT) electrospun nanostructured fibers were prepared. BT fibers were synthesized from a sol based on barium acetate, titanium isopropoxide, and poly(vinyl pyrrolidone). The fibers were heat-treated at different temperatures and characterized by X-ray diffraction, scanning electron microscopy (SEM), and Raman spectroscopy. Mats of BT fibers heat-treated at 800 C were embedded in epoxy resin into suitable molds. The composites were characterized by SEM, and dielectric measurements were performed by means of dielectric spectroscopy. The dielectric permittivity and dielectric modulus of epoxy resin/BT-fiber composites were measured for two types of samples: with the electrodes parallel and perpendicular to the BT fiber layers. Interestingly, composite samples with electrodes perpendicular to the fiber layers and a BT content as low as 2 vol % led to dielectric permittivities three times higher than that of pure epoxy resin. © 2013 American Chemical Society.
Resumo:
This thesis presents the achievements and scientific work conducted using a previously designed and fabricated 64 x 64-pixel ion camera with the use of a 0.35 μm CMOS technology. We used an array of Ion Sensitive Field Effect Transistors (ISFETs) to monitor and measure chemical and biochemical reactions in real time. The area of our observation was a 4.2 x 4.3 mm silicon chip while the actual ISFET array covered an area of 715.8 x 715.8 μm consisting of 4096 ISFET pixels in total with a 1 μm separation space among them. The ion sensitive layer, the locus where all reactions took place was a silicon nitride layer, the final top layer of the austriamicrosystems 0.35 μm CMOS technology used. Our final measurements presented an average sensitivity of 30 mV/pH. With the addition of extra layers we were able to monitor a 65 mV voltage difference during our experiments with glucose and hexokinase, whereas a difference of 85 mV was detected for a similar glucose reaction mentioned in literature, and a 55 mV voltage difference while performing photosynthesis experiments with a biofilm made from cyanobacteria, whereas a voltage difference of 33.7 mV was detected as presented in literature for a similar cyanobacterial species using voltamemtric methods for detection. To monitor our experiments PXIe-6358 measurement cards were used and measurements were controlled by LabVIEW software. The chip was packaged and encapsulated using a PGA-100 chip carrier and a two-component commercial epoxy. Printed circuit board (PCB) has also been previously designed to provide interface between the chip and the measurement cards.