Analysis of conjugate laminar mixed convection cooling in a shrouded array of electronic components

The temperature variation in the insulation around an electronic component, mounted on a horizontal circuit board is studied numerically. The flow is assumed to be laminar and fully developed. The effect of mixed convection and two different types of insulation are considered. The mass, momentum and energy conservation equations in the fluid and conduction equation in the insulation are solved using the SIMPLER algorithm. Computations are carried out for liquid Freon and water, for different conductivity ratios, and different Rayleigh numbers. It is demonstrated that the temperature variation within the insulation becomes important when the thermal conductivity of the insulation is less than ten times the thermal conductivity of the cooling medium.

Low Reynolds number turbulence models for accurate thermal simulations of electronic components

The electronics industry and the problems associated with the cooling of microelectronic equipment are developing rapidly. Thermal engineers now find it necessary to consider the complex area of equipment cooling at some level. This continually growing industry also faces heightened pressure from consumers to provide electronic product miniaturization, which in itself increases the demand for accurate thermal management predictions to assure product reliability. Computational fluid dynamics (CFD) is considered a powerful and almost essential tool for the design, development and optimization of engineering applications. CFD is now widely used within the electronics packaging design community to thermally characterize the performance of both the electronic component and system environment. This paper discusses CFD results for a large variety of investigated turbulence models. Comparison against experimental data illustrates the predictive accuracy of currently used models and highlights the growing demand for greater mathematical modelling accuracy with regards to thermal characterization. Also a newly formulated low Reynolds number (i.e. transitional) turbulence model is proposed with emphasis on hybrid techniques.

A model for computing vibration induced stresses of electronic components in a general flexible mounting

This paper develops a novel full analytic model for vibration analysis of solid-state electronic components. The model is just as accurate as finite element models and numerically light enough to permit for quick design trade-offs and statistical analysis. The paper shows the development of the model, comparison to finite elements and an application to a common engineering problem. A gull-wing flat pack component was selected as the benchmark test case, although the presented methodology is applicable to a wide range of component packages. Results showed very good agreement between the presented method and finite elements and demonstrated the usefulness of the method in how to use standard test data for a general application. © 2013 Elsevier Ltd.

Component scheduling for chip shooter machines: a hybrid genetic algorithm approach

A chip shooter machine for electronic component assembly has a movable feeder carrier, a movable X–Y table carrying a printed circuit board (PCB), and a rotary turret with multiple assembly heads. This paper presents a hybrid genetic algorithm (HGA) to optimize the sequence of component placements and the arrangement of component types to feeders simultaneously for a chip shooter machine, that is, the component scheduling problem. The objective of the problem is to minimize the total assembly time. The GA developed in the paper hybridizes different search heuristics including the nearest-neighbor heuristic, the 2-opt heuristic, and an iterated swap procedure, which is a new improved heuristic. Compared with the results obtained by other researchers, the performance of the HGA is superior in terms of the assembly time. Scope and purpose When assembling the surface mount components on a PCB, it is necessary to obtain the optimal sequence of component placements and the best arrangement of component types to feeders simultaneously in order to minimize the total assembly time. Since it is very difficult to obtain the optimality, a GA hybridized with several search heuristics is developed. The type of machines being studied is the chip shooter machine. This paper compares the algorithm with a simple GA. It shows that the performance of the algorithm is superior to that of the simple GA in terms of the total assembly time.

Estudo dos resíduos eletroeletrônicos de uma prestadora de services do setor naval, com vistas ao gerenciamento ambiental.

Esta pesquisa usou o estudo de caso para analisar os resíduos eletroeletrônicos gerados em uma Empresa prestadora de serviços atuante no setor naval. Após breve reflexão sobre a relação homem-natureza, apresenta-se o conceito de resíduos sólidos e suas classificações, introduzindo-se dados que embasam o impacto dos eletroeletrônicos na geração de resíduos no Brasil. Em seguida, discorre-se sobre a evolução da eletricidade e da eletrônica até os dias atuais, passando-se a comentar os aspectos e impactos da produção e descarte dos dispositivos eletroeletrônicos, que utilizam algumas substâncias tóxicas em sua manufatura. Destacam-se alguns caminhos alternativos para os resíduos eletroeletrônicos como o reuso, o reaproveitamento e a reciclagem que abriram caminhos para novos negócios. O estudo se volta para uma abordagem da legislação ambiental, mencionando aspectos da legislação dos Estados Unidos e da Europa, além de discorrer sobre fatos relevantes do ordenamento jurídico ambiental brasileiro, com ênfase na Política Nacional de Resíduos Sólidos. Esta Seção se encerra com um breve resumo do alinhamento do setor naval à legislação ambiental, através do uso das normas ISO da série 14.000. Prossegue-se com a descrição da Empresa onde se realizou o estudo de caso, apresentando-se um resumo acerca de sua trajetória, estrutura de funcionamento e a situação da gestão ambiental. Em seguida, é descrita a metodologia usada para o desenvolvimento do estudo de caso, detalhando-se os tipos de pesquisa e procedimentos utilizados para a caracterização dos resíduos eletroeletrônicos, bem como as ferramentas de gestão usadas para sua análise. Discorre-se, então, sobre o estudo de caso realizado na Empresa, com a apresentação das ações e pesquisas realizadas acerca de seus processos de geração e descarte de resíduos eletroeletrônicos. Os dados obtidos neste estudo foram analisados à luz do conhecimento ambiental e gestor e, com o auxílio de algumas ferramentas de gestão, foram selecionados os resíduos eletroeletrônicos mais impactantes e os com possibilidade de serem gerenciados pela Empresa. Encerrando o trabalho, as conclusões sobre o estudo e as sugestões para a melhoria do gerenciamento dos resíduos eletroeletrônicos são disponibilizadas para uso da Empresa, propondo-se também a implementação de um sistema de gerenciamento integrado para todos os resíduos nela gerados.

Failure mechanisms of ACF joints under isothermal ageing

The possible failure mechanisms of anisotropic conductive film (ACF) joints under isothermal ageing conditions have been identified through experiments. It has been found that ACF joints formed at higher bonding temperatures can prevent increases in the contact resistance for any ageing temperature. The higher the ageing temperature the higher the electrical failure rate is. The formation of conduction gaps between the conductive particles and the pads and damages to the metal coatings of the particle have been identified as the reasons behind the electrical failures during ageing. In order to understand the mechanism for the formation of the conduction gap and damages in metal coatings during the isothermal ageing, computer modelling has been carried out and the results are discussed extensively. The computer analysis shows that stresses concentrate at the edges of the particle–pad interface, where the adhesive matrix meets the particle. This could lead to subsequent damages and reductions in the adhesion strength in that region and it is possible for the conductive particle to be detached from the pad and the adhesive matrix. It is believed that because of this a conduction gap appears. Furthermore, under thermal loading the thermal expansion of the adhesive matrix squeezes the conductive particle and damages the metal coatings. Experimental evidences support this computational finding. It is, therefore, postulated that if an ACF-based electronic component operates in a high temperature aging condition, its electrical and mechanical functionalities will be at risk.

Utilizing insect behavior in chemical detection by a behavioral biosensor

Traditionally, biosensors have been defined as consisting of two parts; a biological part, which is used to detect chemical or physical changes in the environment, and a corresponding electronic component, which tranduces the signal into an electronically readable format. Biosensors are used for detection of volatile compounds often at a level of sensitivity unattainable by traditional analytical techniques. Classical biosensors and traditional analytical techniques do not allow an ecological context to be imparted to the volatile compound/s under investigation. Therefore, we propose the use of behavioral biosensors, in which a whole organism is utilized for the analysis of chemical stimuli. In this case, the organism detects a chemical or physical change and demonstrates this detection through modifications of its behavior; it is the organism's behavior itself that defines the biosensor. In this review, we evaluate the use and future prospects of behavioral biosensors, with a particular focus on parasitic wasps.

Modeling of optoelectronic devices through neuro-fuzzy architectures

The advantages offered by the electronic component LED (Light Emitting Diode) have caused a quick and wide application of this device in replacement of incandescent lights. However, in its combined application, the relationship between the design variables and the desired effect or result is very complex and it becomes difficult to model by conventional techniques. This work consists of the development of a technique, through comparative analysis of neuro-fuzzy architectures, to make possible to obtain the luminous intensity values of brake lights using LEDs from design data.

Application of intelligent systems for specification of automotive equipments using LEDs

The advantages offered by the electronic component light emitting diode ( LED) have caused a quick and wide application of this device in replacement of incandescent lights. However, in its combined application, the relationship between the design variables and the desired effect or result is very complex and it becomes difficult to model by conventional techniques. This work consists of the development of a technique, through artificial neural networks, to make possible to obtain the luminous intensity values of brake lights using LEDs from design data. (C) 2005 Elsevier B.V. All rights reserved.

Technique for application of hi-bright LED in automobile industry through intelligent systems

The advantages offered by the electronic component LED (Light Emitting Diode) have caused a quick and wide application of this device in replacement of incandescent lights. However, in its combined application, the relationship between the design variables and the desired effect or result is very complex and it becomes difficult to model by conventional techniques. This work consists of the development of a technique, through artificial neural networks, to make possible to obtain the luminous intensity values of brake lights using LEDs from design data.

Numerical and experimental analysis of natural convection in a cavity with flush mounted heat sources on a side wall

This work considers a problem of interest in several technological applications such as the thermal control of electronic equipment. It is also important to study the heat transfer performance of these components under off-normal conditions, such as during failure of cooling fans. The effect of natural convection on the flow and heat transfer in a cavity with two flush mounted heat sources on the left vertical wall, simulating electronic components, is studied numerically and experimentally. The influence of the power distribution, spacing between the heat sources and cavity aspect ratio have been investigated. An analysis of the average Nusselt number of the two heat sources was performed to investigate the behavior of the heat transfer coefficients. The results obtained numerically and experimentally, after an error analysis, showed a good agreement.

Mechanisms of a change in the refractive index of an intensely pumped Yb:YAG crystal

Mechanisms of a change in the refractive index appearing in an intensely diode-pumped Yb:YAG-laser disk element are studied with the help of polarisation interferometry and dynamic grating testing. It is found that changes in the electronic component of the refractive index arising upon changing the populations of electronic levels of Yb ions (the ground F state and the upper F level of the laser transition) and caused by the difference in the polarisability of these levels are an order of magnitude greater than thermal changes in the refractive index. It is shown that the difference Δp in the polarisability at the probe wavelength of 633 nm is 1.9 × 10 cm and at the laser transition wavelength of 1029 nm is 1.6 × 10 cm. ©2006 Kvantovaya Elektronika and Turpion Ltd.

Electronic and vibrational spectra of gaspeite

Visible, near-infrared, IR and Raman spectra of magnesian gaspeite are presented. Nickel ion is the main source of the electronic bands as it is the principal component in the mineral where as the bands in IR and Raman spectra are due to the vibrational processes in the carbonate ion as an entity. The combination of electronic absorption and vibrational spectra (including near-infrared, FTIR and Raman) of magnesian gaspeite are explained in terms of the cation co-ordination and the behaviour of CO32– anion in the Ni–Mg carbonate. The electronic absorption spectrum consists of three broad and intense bands at 8130, 13160 and 22730 cm–1 due to spin-allowed transitions and two weak bands at 20410 and 30300 cm–1 are assigned to spin-forbidden transitions of Ni2+ in an octahedral symmetry. The crystal field parameters evaluated from the observed bands are Dq = 810; B = 800 and C = 3200 cm–1. The two bands in the near-infrared spectrum at 4330 and 5130 cm–1 are overtone and combination of CO32– vibrational modes. For the carbonate group, infrared bands are observed at 1020 cm–1(1 ), 870 cm–1 (2), 1418 cm–1 (3) and 750 cm–1 (4), of which3, the asymmetric stretching mode is most intense. Three well resolved Raman bands at 1571, 1088 and 331 cm–1 are assigned to 3, 1 and MO stretching vibrations.