951 resultados para crack


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The crack initiation and growth mechanisms in an 2D graphene lattice structure are studied based on molecular dynamics simulations. Crack growth in an initial edge crack model in the arm-chair and the zig-zag lattice configurations of graphene are considered. Influence of the time steps on the post yielding behaviour of graphene is studied. Based on the results, a time step of 0.1 fs is recommended for consistent and accurate simulation of crack propagation. Effect of temperature on the crack propagation in graphene is also studied, considering adiabatic and isothermal conditions. Total energy and stress fields are analyzed. A systematic study of the bond stretching and bond reorientation phenomena is performed, which shows that the crack propagates after significant bond elongation and rotation in graphene. Variation of the crack speed with the change in crack length is estimated. (C) 2015 AIP Publishing LLC.

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A new automatic algorithm for the assessment of mixed mode crack growth rate characteristics is presented based on the concept of an equivalent crack. The residual ligament size approach is introduced to implementation this algorithm for identifying the crack tip position on a curved path with respect to the drop potential signal. The automatic algorithm accounting for the curvilinear crack trajectory and employing an electrical potential difference was calibrated with respect to the optical measurements for the growing crack under cyclic mixed mode loading conditions. The effectiveness of the proposed algorithm is confirmed by fatigue tests performed on ST3 steel compact tension-shear specimens in the full range of mode mixities from pure mode Ito pure mode II. (C) 2015 Elsevier Ltd. All rights reserved.

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Four types of the fundamental complex potential in antiplane elasticity are introduced: (a) a point dislocation, (b) a concentrated force, (c) a dislocation doublet and (d) a concentrated force doublet. It is proven that if the axis of the concentrated force doublet is perpendicular to the direction of the dislocation doublet, the relevant complex potentials are equivalent. Using the obtained complex potentials, a singular integral equation for the curve crack problem is introduced. Some particular features of the obtained singular integral equation are discussed, and numerical solutions and examples are given.

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The Monte- Carlo method is used to simulate the surface fatigue crack growth rate for offshore structural steel E36-Z35, and to determine the distributions and relevance of the parameters in the Paris equation. By this method, the time and cost of fatigue crack propagation testing can be reduced. The application of the method is demonstrated by use of four sets of fatigue crack propagation data for offshore structural steel E36-Z35. A comparison of the test data with the theoretical prediction for surface crack growth rate shows the application of the simulation method to the fatigue crack propagation tests is successful.

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This paper presents a fully anisotropic analysis of strip electric saturation model proposed by Gao et al. (1997) (Gao, H.J., Zhang, T.Y., Tong, P., 1997. Local and global energy release rates for an electrically yielded crack in a piezoelectric ceramic. J. Mech. Phys. Solids, 45, 491-510) for piezoelectric materials. The relationship between the size of the strip saturation zone ahead of a crack tip and the applied electric displacement field is established. It is revealed that the critical fracture stresses for a crack perpendicular to the poling axis is linearly decreased with the increase of the positive applied electric field and increases linearly with the increase of the negative applied electric field. For a crack parallel to the poring axis, the failure stress is not effected by the parallel applied electric field. In order to analyse the existed experimental results, the stress fields ahead of the tip of an elliptic notch in an infinite piezoelectric solid are calculated. The critical maximum stress criterion is adopted for determining the fracture stresses under different remote electric displacement fields. The present analysis indicates that the crack initiation and propagation from the tip of a sharp elliptic notch could be aided or impeded by an electric displacement field depending on the field direction. The fracture stress predicted by the present analysis is consistent with the experimental data given by Park and Sun (1995) (Park, S., Sun, C.T., 1995. Fracture criteria for piezoelectric materials. J. Am. Ceram. Soc 78, 1475-1480).

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The effect of thermally activated energy on the dislocation emission from a crack tip in BCC metal Mo is simulated in this paper. Based on the correlative reference model on which the flexible displacement boundary scheme is introduced naturally, the simulation shows that as temperature increases the critical stress intensity factor for the first dislocation emission will decrease and the total number of emitted dislocations increase for the same external load. The dislocation velocity and extensive distance among partial dislocations are not sensitive to temperature. After a dislocation emission, two different deformation slates are observed, the stable and unstable deformation states. In the stable deformation slate, the nucleated dislocation will emit from the crack tip and piles up at a distance far away from the crack tip, after that the new dislocation can not be nucleated unless the external loading increases. In the unstable deformation state, a number of dislocations can be emitted from the crack lip continuously under the same external load.

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The effect of thermal-mechanical loading on a surface mount assembly with interface cracks between the solder and the resistor and between the solder and the printed circuit board (PCB) was studied using a non-linear thermal finite element analysis. The thermal effect was taken as cooling from the solder eutectic temperature to room temperature. Mechanical loading at the ends of the PCB was also applied. The results showed that cooling had the effect of causing large residual shear displacement at the region near the interface cracks. The mechanical loading caused additional crack opening displacements. The analysis on the values of J-integral for the interface cracks showed that J-integral was approximately path independent, and that the effect of crack at the solder/PCB interface is much more serious than that between the component and solder.

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The evolution of dispersed short-fatigue-cracks is analysed based on the equilibrium of crack-number-density (CND). By separating the mean value and the stochastic fluctuation of local CND, the equilibrium equation of overall CND is derived. Comparing with the mean-field equilibrium equation, the equilibrium equation of overall CND has different forms in the expression of crack-nucleation-rate or crack-growth-rate. The simulation results are compared with experimental measurements showing the stochastic analyses provide consistent tendency with experiments. The discrepancy in simulation results between overall CND and mean-field CND is discussed.

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In this paper the problem of a cylindrical crack located in a functionally graded material (FGM) interlayer between two coaxial elastic dissimilar homogeneous cylinders and subjected to a torsional impact loading is considered. The shear modulus and the mass density of the FGM interlayer are assumed to vary continuously between those of the two coaxial cylinders. This mixed boundary value problem is first reduced to a singular integral equation with a Cauchy type kernel in the Laplace domain by applying Laplace and Fourier integral transforms. The singular integral equation is then solved numerically and the dynamic stress intensity factor (DSIF) is also obtained by a numerical Laplace inversion technique. The DSIF is found to rise rapidly to a peak and then reduce and tend to the static value almost without oscillation. The influences of the crack location, the FGM interlayer thickness and the relative magnitudes of the adjoining material properties are examined. It is found among others that, by increasing the FGM gradient, the DSIF can be greatly reduced.

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A mechanical model of a laser transformation hardening specimen with a crack in the middle of the hardened layer is developed to quantify the effects of the residual stress and hardness gradient on crack driving force in terms of J-integral. It is assumed

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Collective damage of short fatigue cracks was analyzed in the light of equilibrium of crack numerical density. With the estimation of crack growth rate and crack nucleation rate, the solution of the equilibrium equation was studied to reveal the distinct feature of saturation distribution for crack numerical density. The critical time that characterized the transition of short and long-crack regimes was estimated, in which the influences of grain size and grain-boundary obstacle effect were investigated. Furthermore, the total number of cracks and the first order of damage moment were discussed.

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The dislocation simulation method is used in this paper to derive the basic equations for a crack perpendicular to the bimaterial interface in a finite solid. The complete solutions to the problem, including the T stress and the stress intensity factors are obtained. The stress field characteristics are investigated in detail. It is found that when the crack is within a weaker material, the stress intensity factor is smaller than that in a homogeneous material and it decreases when the distance between the crack tip and interface decreases. When the crack is within a stiffer material, the stress intensity factor is larger than that in a homogeneous material and it increases when the distance between the crack tip and interface decreases. In both cases, the stress intensity factor will increase when the ratio of the size of a sample to the crack length decreases. A comparison of stress intensity factors between a finite problem and an infinite problem has been given also. The stress distribution ahead of the crack tip, which is near the interface, is shown in details and the T stress effect is considered.

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In this paper, the conformal mapping method was adopted to solve the problem of an infinite plate containing a central lip-shaped crack subjected to remote biaxial loading. A kind of leaf-shaped configuration was also constructed in order to solve the problem. The analytical result showed that the singularity order of the stress field at the tip of a lip-shaped crack remains -1/2, despite the difference in notch-crack width.

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Ultrasonic fractography and scanning electronic microscopy (SEM) are used to determine the direct relationship between the fracture surface morphology and the main crack velocity during the rapid rupture of polymethylmethacrylate (PMMA). Two critical crack velocities are found for the fracture. Quasi-parabolic markings will appear when the crack speed exceeds the first critical speed. Crack propagating at speed above the second critical speed leaves a thicket of small branches penetrating the surface behind them. Both critical speeds are functions of the thickness of the specimens.