Design and process selection for joints in flexible materials

The application of high performance textiles has grown significantly in the last 10 to 15 years. Various research groups throughout the United Kingdom, such as the Department of Trade and Industry, have identified technical textiles as a field for future development. There is little design guidance for joining of flexible materials or general property models that can be applied to theses materials. This lack is due to the large diversity of properties, structures and resulting behaviours of the materials that are classified as "Flexible Materials". This dissertation explores the issues that are involved in characterising the materials at the fibre, bulk and textile levels. Different units of measurement are used for each stage of the manufacturing process of flexible materials and this disparity creates problems when trying to make general comparisons (e.g. comparing textiles to polymer films). Thus, a possible solution to this is to create selection charts that allow designers to compare the strength of materials for a given mass per unit area. A design tool was created using the Cambridge Engineering Selector (CES) software to enable the selection of joining processes for material. The tool is effective in selecting a reduced number of viable joining processes. Through case studies it was shown that designers are required to examine the selected processes (identified by the software) in greater detail - in particular the economics and geometry of the joint - in order to identify the optimum joining process.

A COMPARATIVE-STUDY OF THE ELBOW JOINTS IN 5 SPECIES OF CHINESE MACAQUES

In this paper, we report the findings of a comparative study of the elbow joints of five species of macaque that inhabit China: Macaca assamensis, M. arctoides, M. mulatta, M. thibetana and M. nemestrina. Results of multivariate analyses of size-related variables and indices of the elbow joint suggested that the breadths of the ventral aspect of the trochlea and of the medial epicondyle of the humerus as well as indices describing the head of the radius are important factors for discriminating these species. The elbow joint of M. arctoides was most similar to that of M. thibetana, no doubt reflecting recency of common ancestry and similarity in terrestrial locomotion. The structures of the elbow joints in M. nemestrina and assamensis seemed more adapted to arboreal quadrupedalism. The elbow joint of M. mulatta, however, appears intermediate between the most terrestrial and the most arboreal forms.

Dynamic characterisation and longitudinal strength of swaged joints

Swaging is a cold working process involving plastic deformation of the work piece to change its shape. A swaged joint is a connection between two components whereby a swaging tool induces plastic deformation of the components at their junction to effectively bind them together. This is commonly used when welding or other standard joining techniques are not viable. Swaged joints can be found for example, in nuclear fuel assemblies to connect the edges of thin rectangular plates to a supporting structure or frame. The aim of this work is to find a model to describe the vibrational behaviour of a swaged joint and to estimate its strength in resisting a longitudinally applied load. The finite element method and various experimental rigs were used in order to find relationships between the natural frequencies of the plate, the joint stiffness and the force required to shift the plate against the restraining action of the swage connection. It is found that a swaged joint is dynamically equivalent to a simple support with the rotation elastically restrained and a small stiffness is enough to resist an important load. © 2011 Elsevier Ltd. All rights reserved.

Characterization of impact induced damage modes in single lap joints of woven GFRP composites

Single lap joints of woven GFRP composites have been investigated for impact induced damage modes using C-scan, X-ray micro tomography, imaging and finite element (FE) modelling. This has allowed for damage modes to be observed in 3D from macro to micro level-resulting in much better understanding of damage mechanisms and realistic FE modelling.

Performance of joints in reinforced concrete slabs for two-way spanning action

A series of tests on filigree slab joints was performed with the aim of assessing whether such joints can be reliably used in the construction of two-way spanning reinforced concrete slabs. The test results were compared with code requirements. Adequate joint performance is shown to be achievable when the joints are appropriately detailed. Further research is recommended for the formulation of a more generic understanding when the design parameters are varied from those studied in this work.

Corrosion fatigue of welded joints of steel for marine platform

Experiments on the corrosion fatigue behaviour of welded joints of the steel for marine platform in air and seawater, and of the joints in seawater with cathodic protection, yielded data for linear regression to obtain fatigue life curves (Delta S-N-f). The laws of corrosion fatigue in welded joints of test steel are discussed with reference to those of A(587) and A(131) steel. In these experiments, the fatigue damage occurring at all welded joints around the weld interface resulted in the cracks and fractures. The fatigue life of the specimens in seawater with cathodic protection is longer than that in seawater Without protection.

Modeling and experiments on an isothermal fatigue test for solder joints

This paper investigates an isothermal fatigue test for solder joints developed at the NPL. The test specimen is a lap joint between two copper arms. During the test the displacement at the ends of the copper are controlled and the force measured. The modeling results in the paper show that the displacement across the solder joint is not equal to the displacement applied at the end of the specimen. This is due to deformation within the copper arms. A method is described to compensate for this difference. The strain distribution in the solder was determined by finite element analysis and compared to the distribution generated by a theoretical 'ideal' test which generates an almost pure shear mode in the solder. By using a damage-based constitutive law the shape of the crack generated in the specimen has been predicted for both the actual test and the ideal pure shear test. Results from the simulations are also compared with experimental data using SnAgCu solder.

Modelling the behavior of solder joints for wafer level SiP

Design for manufacture of system-in-package (SiP) structures is dependent on a number of physical processes that affect the final quality of the package in terms of its performance and reliability. Solder joints are key structures in a SiP and their behavior can be the critical factor in terms of reliability. This paper discusses the results from a research programme on design for manufacturing of system in package (SiP) technologies. The focus of the paper is on thermo-mechanical modelling of solder joints. This includes the behavior of the joints during testing plus some important insights into the reflow process and how physical phenomena taking place at the assembly stage can affect solder joint behavior. Finite element analysis of a numerical model of an SiP structure with various design parameters is discussed. The goal of this analysis is to identify the most promising combination of design parameters which guarantee longer lifetime of the solder joints and hence the SiP component. The parameters that were studied are the size of the package (i.e. number of solder joints per row), the presence of the underfill and/or the reinforcement as well as the thickness of the passive die. Discussion was also provided on phenomena that take place during the reflow process where the solder joints are formed. In particular, the formation of intermetallics at the solder-pad interfaces

Assessing the performance of crack detection tests for solder joints

This paper presents both modelling and experimental test data to characterise the performance of four non-destructive tests. The focus is on determining the presence and rough magnitude of thermal fatigue cracks within the solder joints for a surface mount resistor on a strip of FR4 PCB. The tests all operate by applying mechanical loads to the PCB and monitoring the strain response at the top of the resistor. The modelling results show that of the four tests investigated, three are sensitive to the presence of a crack in the joint and its magnitude. Hence these tests show promise in being able to detect cracking caused by accelerated testing. The experimental data supports these results although more validation is required.

Constitutive modeling of kinematic-hardening and damage in solder joints

Solder constitutive models are important as they are widely used in FEA simulations to predict the lifetime of soldered assemblies. This paper briefly reviews some common constitutive laws to capture creep in solder and presents work on laws capturing both kinematic hardening and damage. Inverse analysis is used to determine constants for the kinematic hardening law which match experimental creep curves. The mesh dependence of the damage law is overcome by using volume averaging and is applied to predict the crack path in a thermal cycled resistor component

High electric current density-induced interfacial reactions in micro ball grid array (μBGA) solder joints

The effect of a high electric current density on the interfacial reactions of micro ball grid array solder joints was studied at room temperature and at 150 °C. Four types of phenomena were reported. Along with electromigration-induced interfacial intermetallic compound (IMC) formation, dissolution at the Cu under bump metallization (UBM)/bond pad was also noticed. With a detailed investigation, it was found that the narrow and thin metallization at the component side produced “Joule heating” due to its higher resistance, which in turn was responsible for the rapid dissolution of the Cu UBM/bond pad near to the Cu trace. During an “electromigration test” of a solder joint, the heat generation due to Joule heating and the heat dissipation from the package should be considered carefully. When the heat dissipation fails to compete with the Joule heating, the solder joint melts and molten solder accelerates the interfacial reactions in the solder joint. The presence of a liquid phase was demonstrated from microstructural evidence of solder joints after different current stressing (ranging from 0.3 to 2 A) as well as an in situ observation. Electromigration-induced liquid state diffusion of Cu was found to be responsible for the higher growth rate of the IMC on the anode side.

Multiple reflow study of ball grid array (BGA) solder joints on Au/Ni metallization

This paper evaluates the shearing behavior of ball grid array (BGA) solder joints on Au/Ni/Cu pads of FR4 substrates after multiple reflow soldering. A new Pb-free solder, Sn–3Ag–0.5Cu–8In (SACI), has been compared with Sn–3Ag–0.5Cu (SAC) and Sn–37Pb (SP) solders, in terms of fracture surfaces, shearing forces and microstructures. Three failure modes, ball cut, a combination of solder shear and solder/pad bond separation, and pad lift, are assessed for the different solders and reflow cycles. It is found that the shearing forces of the SP and SAC solder joints tend to increase slightly with an increase in the number of reflow cycles due to diffusion-induced solid solution strengthening of the bulk solder and augmentation of the shearing area. However, the shearing forces of the SACI solder joints decrease slightly after four cycles of reflow, which is ascribed to the thermal degradation of both the solder/intermetallic compound (IMC) and IMC/Ni interfaces. The SACI solder joints yield the highest strengths, whereas the SP solder joints give the smallest values, irrespective of the number of reflow cycles. Thickening of the interfacial IMC layer and coarsening of the dispersing IMC particles within the bulk solders were also observed. Nevertheless, the variation of shearing forces and IMC thickness with different numbers of reflow cycles was not so significant since the Ni under layer acted as an effective diffusion barrier. In addition, the initially-formed IMC layer retarded the further extensive dissolution of the pad material and its interaction with the solder