Macro-segregation of multi-component alloys in shape casting simulation

The objective of this work is to present a new scheme for temperature-solute coupling in a solidification model, where the temperature and concentration fields simultaneously satisfy the macro-scale transport equations and, in the mushy region, meet the constraints imposed by the thermodynamics and the local scale processes. A step-by-step explanation of the macrosegregation algorithm, implemented in the finite volume unstructured mesh multi-physics modelling code PHYSICA, is initially presented and then the proposed scheme is validated against experimental results obtained by Krane for binary and a ternary alloys.

A comprehensive copper stockpile leach model: background and parameter sensitivity

The design and development of a comprehensive computational model of a copper stockpile leach process is summarized. The computational fluid dynamic software framework PHYSICA+ and various phenomena were used to model transport phenomena, mineral reaction kinetics, bacterial effects, and heat, energy and acid balances for the overall leach process. In this paper, the performance of the model is investigated, in particular its sensitvity to particle size and ore permeability. A combination of literature and laboratory sources was used to parameterize the model. The simulation results from the leach model are compared with closely controlled column pilot scale tests. The main performance characteristics (e.g. copper recovery rate) predicted by the model compare reasonably well with the experimental data and clearly reflect the qualitiative behavior of the process in many respects. The model is used to provide a measure of the sensitivity of ore permeability on leach behavior, and simulation results are examined for several different particle size distributions.

Computational modelling of freeze layers in smelting processes

The use of computational modelling in examining process engineering issues is very powerful. It has been used in the development of the HIsmelt process from its concept. It is desirable to further water-cool the HIsmelt vessel to reduce downtime for replacing refractory. Water-cooled elements close to a metal bath run the risk of failure. This generally occurs when a process perturbation causes the freeze and refractory layers to come away from the water-cooled element, which is then exposed to liquid metal. The element fails as they are unable to remove all the heat. Modelling of the water-cooled element involves modelling the heat transfer, fluid flow, stress and solidification for a localised section of the reaction vessel. The complex interaction between the liquid slag and the refractory applied to the outside of thewater-cooled element is also being examined to model the wear of this layer. The model is being constructed in Physica, a CFD code developed at the University of Greenwich. Modelling of this system has commenced with modelling solidification test cases. These test cases have been used to validate the CFD code’s capability to model the solidification in this system. A model to track the penetration of slag into refractory has also been developed and tested.

Demonstration thermo-electric and MHD mathematical models of a 500 kA A1 electrolysis cell

In the present study, a 3D full cell quarter thermo-electric model of a 500kA demonstration cell has been developed and solved. In parallel, a non-linear wave MHD model of the same 500 kA demonstration cell has been developed and solved. A preliminary study of the impact of the interactions between the cell thermo-electric and MHD models will be presented.

Using computer models to identify optimal conditions for flip-chip assembly and reliability

Flip-chip assembly, developed in the early 1960s, is now being positioned as a key joining technology to achieve high-density mounting of electronic components on to printed circuit boards for high-volume, low-cost products. Computer models are now being used early within the product design stage to ensure that optimal process conditions are used. These models capture the governing physics taking place during the assembly process and they can also predict relevant defects that may occur. Describes the application of computational modelling techniques that have the ability to predict a range of interacting physical phenomena associated with the manufacturing process. For example, in the flip-chip assembly process we have solder paste deposition, solder joint shape formation, heat transfer, solidification and thermal stress. Illustrates the application of modelling technology being used as part of a larger UK study aiming to establish a process route for high-volume, low-cost, sub-100-micron pitch flip-chip assembly.

Micro-mechanical parameterisations for continuum modelling of granular material using the discrete element method

The present work uses the discrete element method (DEM) to describe assemblies of particulate bulk materials. Working numerical descriptions of entire processes using this scheme are infeasible because of the very large number of elements (1012 or more in a moderately sized industrial silo). However it is possible to capture much of the essential bulk mechanics through selective DEM on important regions of an assembly, thereafter using the information in continuum numerical descriptions of particulate processes. The continuum numerical model uses population balances of the various components in bulk solid mixtures. It depends on constitutive relationships for the internal transfer, creation and/or destruction of components within the mixture. In this paper we show the means of generating such relationships for two important flow phenomena – segregation whereby particles differing in some important property (often size) separate into discrete phases, and degradation, whereby particles break into sub-elements, through impact on each other or shearing. We perform DEM simulations under a range of representative conditions, extracting the important parameters for the relevant transfer, creation and/or destruction of particles in certain classes within the assembly over time. Continuum predictions of segregation and degradation using this scheme are currently being successfully validated against bulk experimental data and are beginning to be used in schemes to improve the design and operation of bulk solids process plant.

Modelling induction skull melting design modifications

Induction Skull Melting (ISM) is used for heating, melting, mixing and, possibly, evaporating reactive liquid metals at high temperatures when a minimum contact at solid walls is required. The numerical model presented here involves the complete time dependent process analysis based on the coupled electromagnetic, temperature and turbulent velocity fields during the melting and liquid shape changes. The simulation is validated against measurements of liquid metal height, temperature and heat losses in a commercial size ISM furnace. The often observed limiting temperature plateau for ever increasing electrical power input is explained by the turbulent convective heat losses. Various methods to increase the superheat within the liquid melt, the process energy efficiency and stability are proposed.

The effect of thermal cycle profiles on solder joint damage

The relationship between the damage caused at different thermal cycles is very important. The whole of accelerated thermal cycle testing is based on the premise that damage at one cycle is representative of damage at a different cycle. In this paper, the relative damage caused by six thermal cycle profiles are predicted using Finite Element (FE) modelling and the results validated against experiments. Both creep strain and strain energy density were used as damage indicators and creep strain was found to correlate better with experiment. The validated FE model is then used to investigate the effect of altering each of the thermal profile parameters (ramp and swell times, hot and cold temperatures). The components used for testing are surface mount resistors - 1206, 0805 and 0603. The solders investigated are eutectic SnAgCu and eutectic SnAg.

Intermetallic phase detection in lead-free solders using synchrotron X-ray diffraction

The high-intensity, high-resolution x-ray source at the European Synchrotron Radiation Facility (ESRF) has been used in x-ray diffraction (XRD) experiments to detect intermetallic compounds (IMCs) in lead-free solder bumps. The IMCs found in 95.5Sn3.8Ag0.7Cu solder bumps on Cu pads with electroplated-nickel immersion-gold (ENIG) surface finish are consistent with results based on traditional destructive methods. Moreover, after positive identification of the IMCs from the diffraction data, spatial distribution plots over the entire bump were obtained. These spatial distributions for selected intermetallic phases display the layer thickness and confirm the locations of the IMCs. For isothermally aged solder samples, results have shown that much thicker layers of IMCs have grown from the pad interface into the bulk of the solder. Additionally, the XRD technique has also been used in a temperature-resolved mode to observe the formation of IMCs, in situ, during the solidification of the solder joint. The results demonstrate that the XRD technique is very attractive as it allows for nondestructive investigations to be performed on expensive state-of-the-art electronic components, thereby allowing new, lead-free materials to be fully characterized.

Computational fluid dynamics: advancements in technology for modeling iron and steelmaking processes

Computational fluid dynamics (CFD) software technology has formed the basis of many investigations into the behavior and optimization of primary iron and steelmaking processes for the last 25+ years. The objective of this contribution is to review the progress in CFD technologies over the last decade or so and how this can be brought to bear in advancing the process analysis capability of primary ferrous operations. In particular, progress on key challenges such as compute performance, fluid-structure transformation and interaction, and increasingly complex geometries are highlighted.

Unstructured staggered mesh methods for fluid flow, heat transfer and phase change

Unstructured grid meshes used in most commercial CFD codes inevitably adopt collocated variable solution schemes. These schemes have several shortcomings, mainly due to the interpolation of the pressure gradient, that lead to slow convergence. In this publication we show how it is possible to use a much more stable staggered mesh arrangement in an unstructured code. Several alternative groupings of variables are investigated in a search for the optimum scheme.