952 resultados para Differential thermal analysis measurement


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A series of strong solid acids composed of WO3/ZrO2 were prepared. Their crystal structure, surface state, and acidity were determined by the methods of X-ray diffraction, thermal gravimetric and differential thermal analysis, temperature-programmed reduction, laser Raman, and acidity measurement. The results revealed that ZrO2 in WO3/ZrO2 existed mainly in the tetragonal phase, the addition of WO3 plays an important role in stabilizing the tetragonal phase of ZrO2, and all of the samples possessed large surface areas. WO3 in WO3/ZrO2 is mainly monolayer dispersed, and a small amount crystallized on the ZrO2 surface and partly reacted with ZrO2 to form the bond of Zr-O-W, acting as the strong solid acid center. The catalytic properties of WO3/ZrO2 strong solid;acids for alkylation of isobutane with butene at different conditions were investigated. They had a better reaction performance than other strong solid acids; a parallel relationship could be drawn between the catalytic activity and the acid amounts as well as the acidic strength of the catalysts.

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TG and DTA analysis of Y1-xCaxBa2Cu3O7-y suggests that the stability of the 123 phase increases with increasing Ca contents. The O(1) in the Cu(1)-O chain is unstable but O(2) and O(3) in Cu(2)-O planes are very stable. There are hardly any oxygen vacanci

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The crystal structure of erbium (III) complex of benzene acetic acid is reported. The complex crystallizes in the monoclinic space group P2(1)/a with a = 0,9008(3)nm, b=1.4242(5) nm, c=1.8437(7) nm, beta=98.80(3)degrees, V = 2.337(1) nm(3), Z = 4. The mechanism of thermal decomposition of complex has been studied by TG-DTG-DTA. The activation energy for dehydration reaction has been calculated by Freeman Carroll method. The enthalpy change for dehydration and phase change process has been determined.

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The thermal stability and the solid solid phase transitions in Ills compounds with n = 7-12 have been studied by DSC and TG methods. Comparision with CnZn compounds want made. The nature of three phases of CnCu has been discussed in terms of infrared spectroscopy and the assignment of the phase transitions has been given. The thermal stability of CnCu is lower than that of CnZn and presents an obvious odd even effect. All of these compounds exhibit two solid solid phase transitions in the temperature range of 248-337 K. The peak tempe nature of phase transitions changes regularly. The peak temperature or the main phase transition increases with the chain length. The total transition enthalpies and entropies increase with increasing chain length. When n <= 9, the high temperature phase exists in a partial disorder state. When n >= 10, the high temperature phase exists in a conformational disorder state. The main phase transition and the phase transition at 307.7 K of CnCu may mainly are from the change of the packing structure and the change of the partial conformational order-disorder of alkyl chain, respectively.

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Some results on the thermal analysis of polyimides and polyaryl ether sulfones, some reactions and the purity determination of the monomers, and the thermal stability and kinetic analysis of the thermo-oxidative degradation of these polymers are described.

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Magnesium nitride (Mg3N2) was synthesized by the reaction of magnesium in the highly reactive form (Mg*) with nitrogen at 450 degrees C under normal pressure. The effect of doping with nickel dichloride on the nitridation of Mg* was investigated. Differential thermal analysis (DTA) of Mg* systems and transmission electron microscopy (TEM) measurement of the product formed were carried out. TEM measurement showed that the particle size of the Mg3N2 synthesized was in the nanometric range. The dependence of nitridation of the NiCl2-doped Mg* on temperature was investigated at temperatures ranging from 300 to 500 degrees C. The nitridation of NiCl2-doped Mg* could occur even at temperature as low as 300 degrees C. (C) 1999 Kluwer Academic Publishers.

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This paper describes recent developments made to the stress analysis module within FLOTHERM, extending its capability to handle viscoplastic behavior. It also presents the validation of this approach and results obtained for an SMT resistor as an illustrative example. Lifetime predictions are made using the creep strain energy based models of Darveaux. Comment is made about the applicability of the damage model to the geometry of the joint under study.

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This paper investigated the thermal design of the light emitting diode (LED)onto the board and its packaging. The LED was a 6-lead MultiLED with three chips designed for LCD backlighting and other lighting purposes. A 3D finite element model of this LED was built up and thermal analysis was carried out using the multi physics software package PHYSICA. The modeling results were presented as temperature distributions in each LED, and the predicted junction temperature was used for thermal resistance calculation. The results for the board structure indicated that (1) removing the foil attach decreased the thermal resistance, (2) Increasing the copper foil thickness reduced the thermal resistance. package design indicated that the SMT designed LED with integrated slug gave lower thermal resistance. Pb-free solder material gave lower thermal resistance and junction temperature when compared with conductive adhesive