Effect of polymeric properties on the operation of gel-type audio transducers.

A novel design of a moving-coil transducer coupled with a low-hardness elastomer called “the gel surround” is presented in this thesis. This device is termed a “gel-type audio transducer”. The gel-type audio transducer has been developed to overcome the problems that conventional loudspeakers have suffered - that is, the problem with size of the audio device against the quality of sound at low frequency range. Therefore the research work presented herein aims to develop the “gel-type audio transducer” as a next-generation audio transducer for miniaturized woofers. The gel-type audio transducer consists of the magnetic and coil-drive plate assembly, and these parts are coupled by the gel surround. The transducer is driven by the electromagnetic conversion mechanism (a moving-coil transducer) and its output driving force can be greatly enhanced by applying the novel mechanism of the gel surround especially at low frequency range, resulting in the enhanced acoustic efficiency. The transducer can be attached to a stiff and light panel with both the optimized impedance matching and minimised wave collisions. The performance of the gel-type audio transducer is greatly influenced by the mass of the magnetic assembly and compliance of the “gel surround”. But as the size of the magnet and its weight have to be kept minimal for a miniaturisation of the device, the focus of the research is on the effect of the of the gel surround. As a result, the effect of the gel surround, made of the RTV (room-temperature vulcanising) silicone elastomer, TPE (thermoplastic elastomer), and the silicone foam, on generation of the output driving force, the energy transfer from the transducer to a panel to which the transducer is attached, and sound radiation from the vibrating panel, was investigated. This effect was studied by COMSOL multiphysics (FE analysis) and thereby, the simulated results were verified by experiments such as the laser scanning measurement, DMA (dynamic mechanical analyzer), and the acoustic test. Successful development of prototypes of the gel-type audio transducers, with an enhanced acoustic efficiency at reduced size and weight, was achieved. Implementation of the transducers into consumer applications was also demonstrated with their commercial values.

Performance evaluation of the RPL Protocol in fixed and mobile sinks low-power and lossy networks.

Low-Power and Lossy-Network (LLN) are usually composed of static nodes, but the increase demand for mobility in mobile robotic and dynamic environment raises the question how a routing protocol for low-power and lossy-networks such as (RPL) would perform if a mobile sink is deployed. In this paper we investigate and evaluate the behaviour of the RPL protocol in fixed and mobile sink environments with respect to different network metrics such as latency, packet delivery ratio (PDR) and energy consumption. Extensive simulation using instant Contiki simulator show significant performance differences between fixed and mobile sink environments. Fixed sink LLNs performed better in terms of average power consumption, latency and packet delivery ratio. The results demonstrated also that RPL protocol is sensitive to mobility and it increases the number of isolated nodes.

The FUELCON meta-architecture, in the landscape of intelligent technologies for refuelling

The conception of the FUELCON architecture, of a composite tool for the generation and validation of patterns for assigning fuel assemblies to the positions in the grid of a reactor core section, has undergone an evolution throughout the history of the project. Different options for various subtask were possible, envisioned, or actually explored or adopted. We project these successive, or even concomitant configurations of the architecture, into a meta-architecture, which quite not by chance happens to reflect basic choices in the field's history over the last decade.

FUELGEN: effective evolutionary design of refuellings for pressurized water reactors

The paper describes the design of an efficient and robust genetic algorithm for the nuclear fuel loading problem (i.e., refuellings: the in-core fuel management problem) - a complex combinatorial, multimodal optimisation., Evolutionary computation as performed by FUELGEN replaces heuristic search of the kind performed by the FUELCON expert system (CAI 12/4), to solve the same problem. In contrast to the traditional genetic algorithm which makes strong requirements on the representation used and its parameter setting in order to be efficient, the results of recent research results on new, robust genetic algorithms show that representations unsuitable for the traditional genetic algorithm can still be used to good effect with little parameter adjustment. The representation presented here is a simple symbolic one with no linkage attributes, making the genetic algorithm particularly easy to apply to fuel loading problems with differing core structures and assembly inventories. A nonlinear fitness function has been constructed to direct the search efficiently in the presence of the many local optima that result from the constraint on solutions.

An automatable generic strategy for dynamic load balancing in parallel structured mesh CFD codes

Parallel computing is now widely used in numerical simulation, particularly for application codes based on finite difference and finite element methods. A popular and successful technique employed to parallelize such codes onto large distributed memory systems is to partition the mesh into sub-domains that are then allocated to processors. The code then executes in parallel, using the SPMD methodology, with message passing for inter-processor interactions. In order to improve the parallel efficiency of an imbalanced structured mesh CFD code, a new dynamic load balancing (DLB) strategy has been developed in which the processor partition range limits of just one of the partitioned dimensions uses non-coincidental limits, as opposed to coincidental limits. The ‘local’ partition limit change allows greater flexibility in obtaining a balanced load distribution, as the workload increase, or decrease, on a processor is no longer restricted by the ‘global’ (coincidental) limit change. The automatic implementation of this generic DLB strategy within an existing parallel code is presented in this chapter, along with some preliminary results.

Material properties, geometry and their effect on the fatigue life of two flip-chip models

This paper describes how modeling technology has been used in providing fatigue life time data of two flip-chip models. Full-scale three-dimensional modeling of flip-chips under cyclic thermal loading has been combined with solder joint stand-off height prediction to analyze the stress and strain conditions in the two models. The Coffin-Manson empirical relationship is employed to predict the fatigue life times of the solder interconnects. In order to help designers in selecting the underfill material and the printed circuit board, the Young's modulus and the coefficient of thermal expansion of the underfill, as well as the thickness of the printed circuit boards are treated as variable parameters. Fatigue life times are therefore calculated over a range of these material and geometry parameters. In this paper we will also describe how the use of micro-via technology may affect fatigue life

Multiphysics modelling for electronics design

The future of many companies will depend to a large extent on their ability to initiate techniques that bring schedules, performance, tests, support, production, life-cycle-costs, reliability prediction and quality control into the earliest stages of the product creation process. Important questions for an engineer who is responsible for the quality of electronic parts such as printed circuit boards (PCBs) during design, production, assembly and after-sales support are: What is the impact of temperature? What is the impact of this temperature on the stress produced in the components? What is the electromagnetic compatibility (EMC) associated with such a design? At present, thermal, stress and EMC calculations are undertaken using different software tools that each require model build and meshing. This leads to a large investment in time, and hence cost, to undertake each of these simulations. This paper discusses the progression towards a fully integrated software environment, based on a common data model and user interface, having the capability to predict temperature, stress and EMC fields in a coupled manner. Such a modelling environment used early within the design stage of an electronic product will provide engineers with fast solutions to questions regarding thermal, stress and EMC issues. The paper concentrates on recent developments in creating such an integrated modeling environment with preliminary results from the analyses conducted. Further research into the thermal and stress related aspects of the paper is being conducted under a nationally funded project, while their application in reliability prediction will be addressed in a new European project called PROFIT.

Modelling technology to predict flip-chip assembly

This paper describes modelling technology and its use in providing data governing the assembly of flip-chip components. Details are given on the reflow and curing stages as well as the prediction of solder joint shapes. The reflow process involves the attachment of a die to a board via solder joints. After a reflow process, underfill material is placed between the die and the substrate where it is heated and cured. Upon cooling the thermal mismatch between the die, underfill, solder bumps, and substrate will result in a nonuniform deformation profile across the assembly and hence stress. Shape predictions then thermal solidification and stress prediction are undertaken on solder joints during the reflow process. Both thermal and stress calculations are undertaken to predict phenomena occurring during the curing of the underfill material. These stresses may result in delamination between the underfill and its surrounding materials leading to a subsequent reduction in component performance and lifetime. Comparisons between simulations and experiments for die curvature will be given for the reflow and curing process

Multilevel mesh partitioning for optimising aspect ratio

Multilevel algorithms are a successful class of optimisation techniques which address the mesh partitioning problem. They usually combine a graph contraction algorithm together with a local optimisation method which refines the partition at each graph level. To date these algorithms have been used almost exclusively to minimise the cut-edge weight, however it has been shown that for certain classes of solution algorithm, the convergence of the solver is strongly influenced by the subdomain aspect ratio. In this paper therefore, we modify the multilevel algorithms in order to optimise a cost function based on aspect ratio. Several variants of the algorithms are tested and shown to provide excellent results.

Flo/Stress: an integrated software module to predict stress in electronic products

Software technology that predicts stress in electronic systems and packages, developed as part of TCS Programme, is described. The software is closely integrated within a thermal design tool providing the ability to simulate the coupled effects of airflow, temperature and stress on product performance. This integrated approach to analysis will help decrease the number of design cycles.

The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications

The work presented in this paper focuses on the effect of reflow process on the contact resistance and reliability of anisotropic conductive film (ACF) interconnection. The contact resistance of ACF interconnection increases after reflow process due to the decrease in contact area of the conducting particles between the mating I/O pads. However, the relationship between the contact resistance and bonding parameters of the ACF interconnection with reflow treatment follows the similar trend to that of the as-bonded (i.e. without reflow) ACF interconnection. The contact resistance increases as the peak temperature of reflow profile increases. Nearly 40% of the joints were found to be open after reflow with 260 °C peak temperature. During the reflow process, the entrapped (between the chip and substrate) adhesive matrix tries to expand much more than the tiny conductive particles because of the higher coefficient of thermal expansion, the induced thermal stress will try to lift the bump from the pad and decrease the contact area of the conductive path and eventually, leading to a complete loss of electrical contact. In addition, the environmental effect on contact resistance such as high temperature/humidity aging test was also investigated. Compared with the ACF interconnections with Ni/Au bump, higher thermal stress in the Z-direction is accumulated in the ACF interconnections with Au bump during the reflow process owing to the higher bump height, thus greater loss of contact area between the particles and I/O pads leads to an increase of contact resistance and poorer reliability after reflow.